公开(公告)号：US20140008685A1

公开(公告)日：2014-01-09

申请号：US14004434

申请日：2012-03-20

Applicant: Grigoriy Basin ,  Paul Scott Martin

Inventor： Grigoriy Basin ,  Paul Scott Martin

IPC: H01L33/50

CPC classification number: H01L33/50 ,  H01L33/501 ,  H01L33/505 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/13 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2933/0041 ,  H01L2933/0091

Abstract: LED dies are mounted a single submount tile (or wafer). The LED dies have a light emitting top surface. A uniformly thick layer of UV sensitive silicone infused with phosphor is then deposited over the tile, including over the tops and sides of the LED dies. Only the silicone/phosphor over the top and sides of the LED dies is desired, so the silicone/phosphor directly on the tile needs to be removed. The silicone/phosphor layer is then masked to expose the areas that are to remain to UV light, which creates a cross-linked silicone. The unexposed silicone/phosphor layer is then dissolved with a solvent and removed from the tile surface. The silicone/phosphor layer may be defined to expose a wire bond electrode on the LED dies. The tile is ultimately singulated to produce individual phosphor-converted LEDs.

Abstract translation: LED芯片安装在单个底座瓦片（或晶片）上。 LED管芯具有发光顶表面。 然后将沉积有磷光体的均匀厚的UV敏感硅胶层沉积在瓷砖上，包括在LED管芯的顶部和侧面。 只需要在LED模具的顶部和侧面上的硅氧烷/磷光体，因此需要去除直接在瓷砖上的硅氧烷/磷光体。 然后将硅氧烷/磷光体层掩蔽以暴露出保持为UV光的区域，这产生交联的硅氧烷。 然后将未曝光的硅氧烷/磷光体层用溶剂溶解并从瓷砖表面除去。 可以限定硅氧烷/磷光体层以暴露LED管芯上的引线接合电极。 瓦片最终被分割以产生单个的磷光体转换的LED。

公开(公告)号：US20110049545A1

公开(公告)日：2011-03-03

申请号：US12552328

申请日：2009-09-02

Applicant: Grigoriy Basin ,  Jeffrey Kmetec ,  Paul S. Martin

Inventor： Grigoriy Basin ,  Jeffrey Kmetec ,  Paul S. Martin

IPC: H01L33/00

CPC classification number: H01L24/97 ,  H01L33/005 ,  H01L33/46 ,  H01L33/486 ,  H01L33/505 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/73204 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00

Abstract: After flip chip LEDs are mounted on a submount wafer and their growth substrates removed, a phosphor plate is affixed to the exposed top surface of each LED. A reflective material, such as silicone containing at least 5% TiO2 powder, by weight, is then spun over or molded over the wafer to cover the phosphor plates and the sides of the LEDs. The top surface of the reflective material is then etched using microbead blasting to expose the top of the phosphor plates and create a substantially planar reflective layer over the wafer surface. Lenses may then be formed over the LEDs. The wafer is then singulated. The reflective material reflects all side light back into the LED and phosphor plate so that virtually all light exits the top of the phosphor plate to improve the light emission characteristics.

Abstract translation: 在将倒装芯片LED安装在底座晶片上并且移除其生长衬底之后，将磷光体板固定到每个LED的暴露的顶表面。 然后将反射材料，例如含有至少5重量％TiO 2的硅氧烷的硅酮在晶片上旋转或模制，以覆盖荧光体板和LED的侧面。 然后使用微珠喷射来蚀刻反射材料的顶表面以暴露荧光体板的顶部并在晶片表面上形成基本上平面的反射层。 然后可以在LED上形成透镜。 然后将晶片切片。 反射材料将所有侧光反射回LED和磷光体板，使得几乎所有的光离开荧光体板的顶部以改善发光特性。

公开(公告)号：US07791093B2

公开(公告)日：2010-09-07

申请号：US11849930

申请日：2007-09-04

Applicant: Grigoriy Basin ,  Ashim Shatil Haque ,  Ching-hui Chen ,  Robert Scott West ,  Paul Martin

Inventor： Grigoriy Basin ,  Ashim Shatil Haque ,  Ching-hui Chen ,  Robert Scott West ,  Paul Martin

IPC: H01L33/00

CPC classification number: H01L33/56 ,  H01L33/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/16225 ,  H01L2933/0091 ,  H01L2924/00014

Abstract: In one embodiment, sub-micron size granules of TiO2, ZrO2, or other white colored non-phosphor inert granules are mixed with a silicone encapsulant and applied over an LED. In one experiment, the granules increased the light output of a GaN LED more than 5% when the inert material was between about 2.5-5% by weight of the encapsulant. Generally, a percentage of the inert material greater than 5% begins to reduce the light output. If the LED has a yellowish YAG phosphor coating, the white granules in the encapsulant make the LED appear whiter when the LED is in an off state, which is a more pleasing color when the LED is used as a white light flash in small cameras. The addition of the granules also reduces the variation of color temperature over the view angle and position over the LED, which is important for a camera flash and projection applications.

Abstract translation: 在一个实施方案中，将TiO 2，ZrO 2或其它白色非荧光剂惰性颗粒的亚微米尺寸颗粒与硅氧烷密封剂混合并涂覆在LED上。 在一个实验中，当惰性材料占密封剂的约2.5-5重量％时，颗粒将GaN LED的光输出增加超过5％。 通常，大于5％的惰性材料的百分比开始降低光输出。 如果LED具有黄色的YAG荧光粉涂层，则当LED处于关闭状态时，密封剂中的白色颗粒使得LED显得更白，当LED用作小型相机中的白光闪光时，这是更令人愉快的颜色。 颗粒的添加还减少了在LED上的视角和位置上的色温变化，这对于相机闪光和投影应用是重要的。

公开(公告)号：US20090057699A1

公开(公告)日：2009-03-05

申请号：US11849930

申请日：2007-09-04

Applicant: Grigoriy Basin ,  Ashim Shatil Haque ,  Ching-hui Chen ,  Robert Scott West ,  Paul Martin

Inventor： Grigoriy Basin ,  Ashim Shatil Haque ,  Ching-hui Chen ,  Robert Scott West ,  Paul Martin

IPC: H01L33/00

CPC classification number: H01L33/56 ,  H01L33/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/16225 ,  H01L2933/0091 ,  H01L2924/00014

Abstract: In one embodiment, sub-micron size granules of TiO2, ZrO2, or other white colored non-phosphor inert granules are mixed with a silicone encapsulant and applied over an LED. In one experiment, the granules increased the light output of a GaN LED more than 5% when the inert material was between about 2.5-5% by weight of the encapsulant. Generally, a percentage of the inert material greater than 5% begins to reduce the light output. If the LED has a yellowish YAG phosphor coating, the white granules in the encapsulant make the LED appear whiter when the LED is in an off state, which is a more pleasing color when the LED is used as a white light flash in small cameras. The addition of the granules also reduces the variation of color temperature over the view angle and position over the LED, which is important for a camera flash and projection applications.

Abstract translation: 在一个实施方案中，将TiO 2，ZrO 2或其它白色非荧光剂惰性颗粒的亚微米尺寸颗粒与硅氧烷密封剂混合并涂覆在LED上。 在一个实验中，当惰性材料占密封剂的约2.5-5重量％时，颗粒将GaN LED的光输出增加超过5％。 通常，大于5％的惰性材料的百分比开始降低光输出。 如果LED具有黄色的YAG荧光粉涂层，则当LED处于关闭状态时，密封剂中的白色颗粒使得LED显得更白，当LED用作小型相机中的白光闪光时，这是更令人愉快的颜色。 颗粒的添加还减少了在LED上的视角和位置上的色温变化，这对于相机闪光和投影应用是重要的。

公开(公告)号：US20140193931A1

公开(公告)日：2014-07-10

申请号：US14131686

申请日：2012-07-30

Applicant: Grigoriy Basin ,  John Edward Epler ,  Paul Scott Martin

Inventor： Grigoriy Basin ,  John Edward Epler ,  Paul Scott Martin

IPC: H01L33/48 ,  H01L33/00 ,  H01L33/50

CPC classification number: H01L33/48 ,  H01L21/6836 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L33/005 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/22 ,  H01L33/50 ,  H01L33/501 ,  H01L33/505 ,  H01L33/507 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/27436 ,  H01L2224/29191 ,  H01L2224/32225 ,  H01L2224/83005 ,  H01L2224/8309 ,  H01L2224/83097 ,  H01L2224/83191 ,  H01L2224/83209 ,  H01L2224/94 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2224/27 ,  H01L2224/83 ,  H01L2924/01074 ,  H01L2924/00

Abstract: A method according to embodiments of the invention includes positioning a flexible film (48) over a wafer of semiconductor light emitting devices, each semiconductor light emitting device including a semiconductor structure (13) including a light emitting layer sandwiched between an n-type region and a p-type region. The wafer of semiconductor light emitting devices is bonded to a substrate (50) via the flexible film (48). After bonding, the flexible film (48) is in direct contact with the semiconductor structures (13). The method further includes dividing the wafer after bonding the wafer to the substrate (50).

Abstract translation: 根据本发明的实施例的方法包括在半导体发光器件的晶片上定位柔性膜（48），每个半导体发光器件包括半导体结构（13），该半导体结构（13）包括夹在n型区域和 一个p型区域。 半导体发光器件的晶片经由柔性膜（48）与基板（50）接合。 粘合后，柔性膜（48）与半导体结构（13）直接接触。 该方法还包括在将晶片接合到基板（50）之后分割晶片。

公开(公告)号：US20130221835A1

公开(公告)日：2013-08-29

申请号：US13879639

申请日：2011-10-20

Applicant: Grigoriy Basin ,  Paul Scott Martin

Inventor： Grigoriy Basin ,  Paul Scott Martin

IPC: H05B33/02 ,  F21V9/00 ,  H05B33/10

CPC classification number: H05B33/02 ,  F21V9/00 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/24 ,  H01L2933/0041 ,  H01L2933/0058 ,  H05B33/10 ,  Y10T428/24802 ,  Y10T428/2486 ,  Y10T428/24926

Abstract: Optical elements (130) are attached to a support film (110) at select locations, the select locations corresponding to locations of light emitting elements (140) on another substrate, e.g. the substrate of the title (150).The film is placed on the substrate containing the light emitting elements such that the optical elements are in contact with their corresponding light emitting elements. The optical elements are laminated to the light emitting elements, and the support film is removed. The optical elements may include wavelength conversion elements, lens elements, combinations of elements, and so on. Other elements, such as conductors and reflectors may also be positioned on the laminate film

Abstract translation: 光学元件（130）在选定位置处附接到支撑膜（110），所述选择位置对应于另一衬底上的发光元件（140）的位置，例如。 标题（150）的基板。该膜被放置在含有发光元件的基板上，使得光学元件与其相应的发光元件接触。 将光学元件层压到发光元件上，并且去除支撑膜。 光学元件可以包括波长转换元件，透镜元件，元件的组合等等。 其他元件，例如导体和反射器也可以定位在层压膜上

公开(公告)号：US08431423B2

公开(公告)日：2013-04-30

申请号：US12503951

申请日：2009-07-16

Applicant: Grigoriy Basin ,  Paul S. Martin

Inventor： Grigoriy Basin ,  Paul S. Martin

IPC: H01L33/00

CPC classification number: H01L33/60 ,  H01L33/507 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00012

Abstract: An underfill formation technique for LEDs molds a reflective underfill material to encapsulate LED dies mounted on a submount wafer while forming a reflective layer of the underfill material over the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top of the LED dies is removed using microbead blasting while leaving the reflective layer over the submount surface. The exposed growth substrate is then removed from all the LED dies, and a phosphor layer is molded over the exposed LED surface. A lens is then molded over the LEDs and over a portion of the reflective layer. The submount wafer is then singulated. The reflective layer increases the efficiency of the LED device by reducing light absorption by the submount without any additional processing steps.

Abstract translation: 用于LED的底部填充形成技术模制反射底部填充材料以封装安装在底座晶片上的LED管芯，同时在底座晶片上形成底部填充材料的反射层。 然后将底部填充材料硬化，例如通过固化。 使用微珠喷射除去在LED管芯顶部的固化的底部填充材料，同时将反射层留在底座表面上。 然后将曝光的生长衬底从所有的LED管芯移除，并且在暴露的LED表面上模制荧光体层。 然后将透镜模制在LED上并在反射层的一部分上方。 然后将底座晶片分离。 反射层通过减少副安装座的光吸收而没有任何额外的处理步骤来增加LED器件的效率。

公开(公告)号：US20110223696A1

公开(公告)日：2011-09-15

申请号：US13115475

申请日：2011-05-25

Applicant: Grigoriy Basin ,  Frederic Diana ,  Paul S. Martin ,  Dima Simonian

Inventor： Grigoriy Basin ,  Frederic Diana ,  Paul S. Martin ,  Dima Simonian

IPC: H01L33/52

CPC classification number: H01L33/54 ,  H01L24/97 ,  H01L33/0079 ,  H01L33/56 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

Abstract: An underfill technique for LEDs uses compression molding to simultaneously encapsulate an array of flip-chip LED dies mounted on a submount wafer. The molding process causes liquid underfill material (or a softened underfill material) to fill the gap between the LED dies and the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top and sides of the LED dies is removed using microbead blasting. The exposed growth substrate is then removed from all the LED dies by laser lift-off, and the underfill supports the brittle epitaxial layers of each LED die during the lift-off process. The submount wafer is then singulated. This wafer-level processing of many LEDs simultaneously greatly reduces fabrication time, and a wide variety of materials may be used for the underfill since a wide range of viscosities is tolerable.

Abstract translation: 用于LED的底部填充技术使用压缩成型来同时封装安装在底座晶片上的倒装芯片LED管芯阵列。 成型工艺使液体底部填充材料（或软化的底部填充材料）填充LED管芯和底座晶片之间的间隙。 然后将底部填充材料硬化，例如通过固化。 使用微珠喷砂除去在LED管芯的顶部和侧面上固化的底部填充材料。 然后通过激光剥离从所有LED管芯去除暴露的生长衬底，并且底部填充物在剥离过程中支持每个LED管芯的脆性外延层。 然后将底座晶片分离。 许多LED的晶片级处理同时大大减少了制造时间，并且可以使用各种各样的材料用于底部填充，因为宽范围的粘度是可以容忍的。

公开(公告)号：US20060102914A1

公开(公告)日：2006-05-18

申请号：US11093961

申请日：2005-03-29

Applicant: Willem Smits ,  Robert Hendriks ,  Grigoriy Basin ,  Frans Konijn ,  Robert West ,  Paul Martin ,  Gerard Harbers

Inventor： Willem Smits ,  Robert Hendriks ,  Grigoriy Basin ,  Frans Konijn ,  Robert West ,  Paul Martin ,  Gerard Harbers

IPC: H01L33/00 ,  H01L29/22 ,  H01L29/227

CPC classification number: H01L33/58 ,  G02B19/0028 ,  G02B19/0066 ,  G02B19/0071 ,  H01L33/46 ,  H01L33/504 ,  H01L33/507 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/13 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: Lenses and certain fabrication techniques are described. A wide-emitting lens refracts light emitted by an LED die to cause a peak intensity to occur within 50-80 degrees off the center axis and an intensity along the center axis to be between 5% and 33% of the peak intensity. The lens is particularly useful in a LCD backlighting application. In one embodiment, the lens is affixed to the backplane on which the LED die is mounted and surrounds the LED die. The lens has a hollow portion that forms an air gap between the LED die and the lens, where the light is bent towards the sides both at the air gap interface and the outer lens surface interface. The lens may be a secondary lens surrounding an interior lens molded directly over the LED die.

Abstract translation: 描述镜片和某些制造技术。 宽发射透镜折射由LED管芯发射的光，使峰强度发生在离中心轴50-80度以内，沿着中心轴的强度在峰值强度的5％至33％之间。 镜头在LCD背光应用中特别有用。 在一个实施例中，透镜固定到其上安装有LED管芯的背板上，并且围绕LED管芯。 透镜具有中空部分，其在LED管芯和透镜之间形成气隙，其中光在气隙界面和外透镜表面界面处朝向侧面弯曲。 透镜可以是围绕直接模制在LED芯片上的内部透镜的次级透镜。

公开(公告)号：US08771577B2

公开(公告)日：2014-07-08

申请号：US12706149

申请日：2010-02-16

Applicant: Grigoriy Basin ,  Paul S. Martin

Inventor： Grigoriy Basin ,  Paul S. Martin

IPC: B29C43/18

CPC classification number: H01L33/504 ,  B29C43/18 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/0075 ,  H01L33/50 ,  H01L33/56 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A flexible film comprising a wavelength converting material is positioned over a light source. The flexible film is conformed to a predetermined shape. In some embodiments, the light source is a light emitting diode mounted on a support substrate. The diode is aligned with an indentation in a mold such that the flexible film is disposed between the support substrate and the mold. Transparent molding material is disposed between the support substrate and the mold. The support substrate and the mold are pressed together to cause the molding material to fill the indentation. The flexible film conforms to the shape of the light source or the mold.

Abstract translation: 包括波长转换材料的柔性膜位于光源上。 柔性膜符合预定的形状。 在一些实施例中，光源是安装在支撑衬底上的发光二极管。 二极管与模具中的压痕对准，使得柔性膜设置在支撑基板和模具之间。 透明成型材料设置在支撑基板和模具之间。 将支撑基板和模具压在一起以使模制材料填充凹陷。 柔性膜符合光源或模具的形状。