公开(公告)号：US08967827B2

公开(公告)日：2015-03-03

申请号：US13641483

申请日：2011-04-26

申请人： Yoji Urano ,  Ryoji Yokotani ,  Ikko Kuzuhara ,  Kenichiro Tanaka

发明人： Yoji Urano ,  Ryoji Yokotani ,  Ikko Kuzuhara ,  Kenichiro Tanaka

IPC分类号： F21S4/00 ,  F21V21/00 ,  H05K1/02 ,  F21K99/00 ,  F21V19/00 ,  H05K1/18 ,  F21V29/00 ,  H01L25/075 ,  H01L33/48 ,  H01L33/62 ,  H05K1/05 ,  H05K3/20 ,  F21Y101/02 ,  F21Y103/00 ,  F21Y105/00 ,  H01L23/00

CPC分类号： H05K1/0203 ,  F21K9/20 ,  F21K9/27 ,  F21K9/90 ,  F21V19/004 ,  F21V29/767 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2107/90 ,  F21Y2115/10 ,  H01L24/45 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H05K1/0271 ,  H05K1/056 ,  H05K1/181 ,  H05K3/202 ,  H05K2201/10106 ,  Y02P70/611 ,  Y10S362/80 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01049

摘要： Provided is lead frame in which a wiring pattern supported by a support piece inside of a one-pitch outer frame section comprises a plurality of base units, each of which comprises a die pad on which a solid-state light emitting element is mounted, a heat sink extending from die pad so as to surround die pad electrically connected to one electrode of the element, and a lead electrically connected to the other electrode of the element. Lead of one base unit among adjacent base units and heat sink of the other base unit are coupled and electrically connected in series. Increase in temperature of the element is inhibited, light output is increased, and cost of a light emitting unit in which a plurality of solid-state light emitting elements connected in series are used is reduced. Also provided are wiring board, light emitting unit, and illuminating apparatus.

摘要翻译： 本发明提供了一种引线框架，其中由一节距外框部分内的支撑件支撑的布线图案包括多个基座单元，每个基座单元包括其上安装固态发光元件的芯片焊盘， 从芯片焊盘延伸的散热片，以便围绕与该元件的一个电极电连接的芯片焊盘以及与该元件的另一个电极电连接的引线。 相邻基座中的一个基本单元和另一个基座单元的散热器的引线串联并电连接。 抑制元件的温度升高，光输出增加，并且使用串联连接的多个固态发光元件的发光单元的成本降低。 还提供了布线板，发光单元和照明装置。

公开(公告)号：US07495322B2

公开(公告)日：2009-02-24

申请号：US10558360

申请日：2004-05-26

申请人： Takuma Hashimoto ,  Masaru Sugimoto ,  Ryoji Yokotani ,  Koji Nishioka ,  Yutaka Iwahori ,  Shinya Ishizaki ,  Toshiyuki Suzuki ,  Yoshiyuki Uchinono ,  Masahide Muto ,  Satoshi Mori ,  Hideyoshi Kimura

发明人： Takuma Hashimoto ,  Masaru Sugimoto ,  Ryoji Yokotani ,  Koji Nishioka ,  Yutaka Iwahori ,  Shinya Ishizaki ,  Toshiyuki Suzuki ,  Yoshiyuki Uchinono ,  Masahide Muto ,  Satoshi Mori ,  Hideyoshi Kimura

IPC分类号： H01L21/00 ,  H01L23/495 ,  F21V29/00 ,  H05K1/11 ,  H05K5/02 ,  H05K7/18

CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/15156 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/01005 ,  H01L2924/01033

摘要： A light-emitting device (200) has a submount (100) and a plate for heat transfer (300) having a metallic plate (30). The submount (100) has a mount base (10), at least one light-emitting diode chip (5) mounted thereon and electrically conducting lines (12-17) formed on the mount base (10) to be connected electrically to the light-emitting diode chip (5). A first plane (11) of the mount base (10) of the submount (100) is bonded thermally to the first plate (300). For example, the plate is a circuit board having a metallic plate (30), and the submount (100) is bonded thermally to the metallic plate (30) of the one of the at least one plate (300). In an example, a second plate for heat transfer is also bonded thermally to a second plane of the mount base (100) for providing a plurality of heat transfer paths.

摘要翻译： 发光装置（200）具有底座（100）和具有金属板（30）的传热板（300）。 基座（100）具有安装基座（10），安装有至少一个发光二极管芯片（5）和形成在安装基座（10）上的电导线（12-17），以电连接到光 发光二极管芯片（5）。 底座（100）的安装座（10）的第一平面（11）被热接合到第一板（300）。 例如，板是具有金属板（30）的电路板，并且底座（100）热接合到至少一个板（300）中的一个的金属板（30）。 在一个示例中，用于传热的第二板也热粘合到安装基座（100）的第二平面，以提供多个传热路径。

公开(公告)号：US20070085103A1

公开(公告)日：2007-04-19

申请号：US10596019

申请日：2004-11-25

申请人： Kouji Nishioka ,  Masaru Sugimoto ,  Hideyoshi Kimura ,  Ryoji Yokotani ,  Yutaka Iwahori ,  Takuma Hashmoto ,  Shinya Ishizaki ,  Satoshi Mori ,  Hiroyuki Sekii ,  Eiji Shiohama

发明人： Kouji Nishioka ,  Masaru Sugimoto ,  Hideyoshi Kimura ,  Ryoji Yokotani ,  Yutaka Iwahori ,  Takuma Hashmoto ,  Shinya Ishizaki ,  Satoshi Mori ,  Hiroyuki Sekii ,  Eiji Shiohama

IPC分类号： H01L33/00

CPC分类号： H01L33/507 ,  H01L33/508 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/16195 ,  H01L2924/3025 ,  Y10S362/80 ,  H01L2924/00 ,  H01L2924/00014

摘要： A light emitting device comprises: an LED chip mounted in a recess formed in a mounting substrate; a wavelength converting member that is disposed so as to cover the recess and the edge area around the recess and that is excited by light emitted from the LED chip to emit light of a wavelength different from an excitation wavelength; and an emission control member disposed at a light output side of the wavelength converting member so as to allow emission of light coming from an area of the wavelength converting member that corresponds to the recess and to prevent emission of light coming from an area of the wavelength converting member that corresponds to the edge area around the recess. This can prevent variations in color between light emitted from the central part of the wavelength converting member and light emitted from the part of the wavelength converting member that is located on the edge area around the recess of the mounting substrate, thereby reducing unevenness of color on the irradiation surface.

摘要翻译： 发光装置包括：安装在形成于安装基板上的凹部中的LED芯片; 波长转换部件被设置为覆盖凹部和围绕凹部的边缘区域并被从LED芯片发射的光激发以发射与激发波长不同的波长的光; 以及发射控制部件，其设置在所述波长转换部件的光输出侧，以便发射来自与所述凹部对应的所述波长转换部件的区域的光，并且防止来自所述波长的区域的光的发射 转换构件对应于凹部周围的边缘区域。 这可以防止从波长转换构件的中心部分发射的光和位于安装基板的凹部周围的边缘区域上的波长转换构件的部分发射的光之间的颜色变化，从而减少颜色的不均匀性 照射面。

公开(公告)号：US20060175625A1

公开(公告)日：2006-08-10

申请号：US10514723

申请日：2003-05-28

申请人： Ryoji Yokotani ,  Masao Yamaguchi

发明人： Ryoji Yokotani ,  Masao Yamaguchi

IPC分类号： H01L33/00

CPC分类号： H01L33/20 ,  G02B5/0231 ,  G02B5/0278 ,  H01L33/22 ,  H01L33/44 ,  H01L33/507 ,  H01L33/54

摘要： In a non-sealed type light emitting device in which a diode structure on a face of a transparent substrate by lamination of an n-type semiconductor layer and a p-type semiconductor layer, an outer face of the transparent substrate is made not in parallel with a most outer face of the diode structure by, for example, being slanted so as to increase a light taking efficiency from an exit face of light. An incident angle of a light beam entering into an exit face of light is gradually reduces by repeating total reflection on these two faces so as to make is smaller than a critical angle, and to emit the light beams outward of the light emitting device.

摘要翻译： 在通过层叠n型半导体层和p型半导体层的透明基板的表面上的二极管结构的非密封型发光器件中，使透明基板的外表面不平行 通过例如倾斜的二极管结构的最外表面，以便从光的出射面增加取光效率。 入射到光出射面的光束的入射角通过在这两个面上重复全反射以使其小于临界角而逐渐减小，并将光束发射到发光器件的外部。

公开(公告)号：US07084435B2

公开(公告)日：2006-08-01

申请号：US10483995

申请日：2003-01-06

申请人： Masaru Sugimoto ,  Masao Yamaguchi ,  Takuma Hashimoto ,  Koji Nishioka ,  Ryoji Yokotani ,  Hideyoshi Kimura ,  Tadashi Murakami ,  Eiji Shiohama

发明人： Masaru Sugimoto ,  Masao Yamaguchi ,  Takuma Hashimoto ,  Koji Nishioka ,  Ryoji Yokotani ,  Hideyoshi Kimura ,  Tadashi Murakami ,  Eiji Shiohama

IPC分类号： H01L29/22 ,  H01L29/24

CPC分类号： H01L33/507 ,  F21K9/64 ,  F21V29/677 ,  F21V29/83 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/16225

摘要： A light-emitting device which uses and LED having a light-emitting element being placed on a package substrate. The light-emitting element has a light-extracting surface. A fluorescent element which is formed by dispersing a fluorescent material in a transparent substance and is placed face to face with the light-extracting surface of the light emitting element and comprises a clearance gap in between. The light-emitting element generates light of a certain wavelength that emanates through the light-extracting surface into the fluorescent element where the wavelength is changed. The device further comprises an optical element which receives light from the light-emitting element through the fluorescent element and directs the light to the outside of the device.

摘要翻译： 一种发光装置，其使用具有发光元件的LED，该发光元件放置在封装基板上。 发光元件具有光提取面。 荧光元件，其通过将荧光材料分散在透明物质中并且与发光元件的光提取表面面对面并且在其间包括间隙而形成。 发光元件产生通过光提取表面发射到波长变化的荧光元件的一定波长的光。 该装置还包括光学元件，其通过荧光元件接收来自发光元件的光并将光引导到装置的外部。