公开(公告)号：US20070007540A1

公开(公告)日：2007-01-11

申请号：US10558360

申请日：2004-05-26

申请人： Takuma Hashimoto ,  Masaru Sugimoto ,  Ryoji Yokotani ,  Koji Nishioka ,  Yutaka Iwahori ,  Shinya Ishizaki ,  Toshiyuki Suzuki ,  Yoshiyuki Uchinono ,  Masahide Muto ,  Satoshi Mori ,  Hideyoshi Kimura

发明人： Takuma Hashimoto ,  Masaru Sugimoto ,  Ryoji Yokotani ,  Koji Nishioka ,  Yutaka Iwahori ,  Shinya Ishizaki ,  Toshiyuki Suzuki ,  Yoshiyuki Uchinono ,  Masahide Muto ,  Satoshi Mori ,  Hideyoshi Kimura

IPC分类号： H01L33/00

CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/15156 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/01005 ,  H01L2924/01033

摘要： A light-emitting device (200) has a submount (100) and a plate for heat transfer (300) having a metallic plate (30). The submount (100) has a mount base (10), at least one light-emitting diode chip (5) mounted thereon and electrically conducting lines (12-17) formed on the mount base (10) to be connected electrically to the light-emitting diode chip (5). A first plane (11) of the mount base (10) of the submount (100) is bonded thermally to the first plate (300). For example, the plate is a circuit board having a metallic plate (30), and the submount (100) is bonded thermally to the metallic plate (30) of the one of the at least one plate (300). In an example, a second plate for heat transfer is also bonded thermally to a second plane of the mount base (100) for providing a plurality of heat transfer paths.

摘要翻译： 发光装置（200）具有底座（100）和具有金属板（30）的传热板（300）。 基座（100）具有安装基座（10），安装有至少一个发光二极管芯片（5）和形成在安装基座（10）上的电导线（12-17），以电连接到光 发光二极管芯片（5）。 底座（100）的安装座（10）的第一平面（11）被热接合到第一板（300）。 例如，板是具有金属板（30）的电路板，并且底座（100）热接合到至少一个板（300）中的一个的金属板（30）。 在一个示例中，用于传热的第二板也热粘合到安装基座（100）的第二平面，以提供多个传热路径。

公开(公告)号：US07495322B2

公开(公告)日：2009-02-24

申请号：US10558360

申请日：2004-05-26

申请人： Takuma Hashimoto ,  Masaru Sugimoto ,  Ryoji Yokotani ,  Koji Nishioka ,  Yutaka Iwahori ,  Shinya Ishizaki ,  Toshiyuki Suzuki ,  Yoshiyuki Uchinono ,  Masahide Muto ,  Satoshi Mori ,  Hideyoshi Kimura

发明人： Takuma Hashimoto ,  Masaru Sugimoto ,  Ryoji Yokotani ,  Koji Nishioka ,  Yutaka Iwahori ,  Shinya Ishizaki ,  Toshiyuki Suzuki ,  Yoshiyuki Uchinono ,  Masahide Muto ,  Satoshi Mori ,  Hideyoshi Kimura

IPC分类号： H01L21/00 ,  H01L23/495 ,  F21V29/00 ,  H05K1/11 ,  H05K5/02 ,  H05K7/18

CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/15156 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/01005 ,  H01L2924/01033

摘要： A light-emitting device (200) has a submount (100) and a plate for heat transfer (300) having a metallic plate (30). The submount (100) has a mount base (10), at least one light-emitting diode chip (5) mounted thereon and electrically conducting lines (12-17) formed on the mount base (10) to be connected electrically to the light-emitting diode chip (5). A first plane (11) of the mount base (10) of the submount (100) is bonded thermally to the first plate (300). For example, the plate is a circuit board having a metallic plate (30), and the submount (100) is bonded thermally to the metallic plate (30) of the one of the at least one plate (300). In an example, a second plate for heat transfer is also bonded thermally to a second plane of the mount base (100) for providing a plurality of heat transfer paths.

摘要翻译： 发光装置（200）具有底座（100）和具有金属板（30）的传热板（300）。 基座（100）具有安装基座（10），安装有至少一个发光二极管芯片（5）和形成在安装基座（10）上的电导线（12-17），以电连接到光 发光二极管芯片（5）。 底座（100）的安装座（10）的第一平面（11）被热接合到第一板（300）。 例如，板是具有金属板（30）的电路板，并且底座（100）热接合到至少一个板（300）中的一个的金属板（30）。 在一个示例中，用于传热的第二板也热粘合到安装基座（100）的第二平面，以提供多个传热路径。

公开(公告)号：US07084435B2

公开(公告)日：2006-08-01

申请号：US10483995

申请日：2003-01-06

申请人： Masaru Sugimoto ,  Masao Yamaguchi ,  Takuma Hashimoto ,  Koji Nishioka ,  Ryoji Yokotani ,  Hideyoshi Kimura ,  Tadashi Murakami ,  Eiji Shiohama

发明人： Masaru Sugimoto ,  Masao Yamaguchi ,  Takuma Hashimoto ,  Koji Nishioka ,  Ryoji Yokotani ,  Hideyoshi Kimura ,  Tadashi Murakami ,  Eiji Shiohama

IPC分类号： H01L29/22 ,  H01L29/24

CPC分类号： H01L33/507 ,  F21K9/64 ,  F21V29/677 ,  F21V29/83 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/16225

摘要： A light-emitting device which uses and LED having a light-emitting element being placed on a package substrate. The light-emitting element has a light-extracting surface. A fluorescent element which is formed by dispersing a fluorescent material in a transparent substance and is placed face to face with the light-extracting surface of the light emitting element and comprises a clearance gap in between. The light-emitting element generates light of a certain wavelength that emanates through the light-extracting surface into the fluorescent element where the wavelength is changed. The device further comprises an optical element which receives light from the light-emitting element through the fluorescent element and directs the light to the outside of the device.

摘要翻译： 一种发光装置，其使用具有发光元件的LED，该发光元件放置在封装基板上。 发光元件具有光提取面。 荧光元件，其通过将荧光材料分散在透明物质中并且与发光元件的光提取表面面对面并且在其间包括间隙而形成。 发光元件产生通过光提取表面发射到波长变化的荧光元件的一定波长的光。 该装置还包括光学元件，其通过荧光元件接收来自发光元件的光并将光引导到装置的外部。

公开(公告)号：US06930332B2

公开(公告)日：2005-08-16

申请号：US10466114

申请日：2002-08-28

申请人： Takuma Hashimoto ,  Masaru Sugimoto ,  Hideyoshi Kimura ,  Eiji Shiohama

发明人： Takuma Hashimoto ,  Masaru Sugimoto ,  Hideyoshi Kimura ,  Eiji Shiohama

IPC分类号： H01L33/64 ,  H01L25/075 ,  H01L33/32 ,  H01L33/54 ,  H01L33/60 ,  H01L33/00

CPC分类号： H01L33/642 ,  H01L25/0753 ,  H01L25/167 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A light emitting device that can provide enhanced heat radiation as well as allowing light from a light emitting diode (LED) chip to be efficiently extracted out of the device. This light emitting device includes a metal plate (11) that is made of aluminum. The metal plate (11) has a projection (11a) projecting forward. The projection (11a) has a front side provided with a housing recess (11b). An LED chip (1) is mounted on the bottom of the housing recess (11b) so that it is thermally coupled to the metal plate (11), thus allowing heat to be radiated efficiently. A printed circuit board (12), having a grass epoxy substrate to be joined to the front surface of the metal plate (11), is provided with an insertion hole (13) into which the projection (11a) is inserted. The LED chip (1) and a bonding wire (W) are encapsulated in a transparent resin seal portion (50). The side wall of the housing recess (11b) that is part of the metal plate (11) functions as a reflector for reflecting forward light emitted from the LED chip (1). Thus, light from the LED chip (1) can be extracted efficiently.

摘要翻译： 可以提供增强的热辐射以及允许来自发光二极管（LED）芯片的光被有效地从设备中提取的发光器件。 该发光器件包括由铝制成的金属板（11）。 金属板（11）具有向前突出的突起（11a）。 突起（11a）具有设置有壳体凹部（11b）的前侧。 LED芯片（1）安装在壳体凹部（11b）的底部，使得其与金属板（11）热耦合，从而有效地辐射热量。 具有要连接到金属板（11）的前表面的草环氧树脂基板的印刷电路板（12）设置有插入孔（11），插入孔（11a）。 LED芯片（1）和接合线（W）被封装在透明树脂密封部分（50）中。 作为金属板（11）的一部分的壳体凹部（11b）的侧壁用作反射从LED芯片（1）发射的向前的光的反射器。 因此，可以有效地提取来自LED芯片（1）的光。

公开(公告)号：US06796027B2

公开(公告)日：2004-09-28

申请号：US10146800

申请日：2002-05-17

申请人： Toshiyuki Suzuki ,  Kazuya Nakagawa ,  Mitsuru Kobayashi ,  Eiji Shiohama ,  Masaru Sugimoto ,  Hideyoshi Kimura ,  Takuma Hashimoto

发明人： Toshiyuki Suzuki ,  Kazuya Nakagawa ,  Mitsuru Kobayashi ,  Eiji Shiohama ,  Masaru Sugimoto ,  Hideyoshi Kimura ,  Takuma Hashimoto

IPC分类号： H05K310

CPC分类号： H05K3/242 ,  H05K1/0284 ,  H05K1/0293 ,  H05K3/045 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09127 ,  H05K2203/175 ,  H05K2203/308 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49222

摘要： A method of efficiently manufacturing a printed wiring board is provided. In this method, a metal thin film is formed on a substrate having a projection. Then, an initial circuit pattern is formed on the substrate by patterning the metal thin film. The initial circuit pattern comprises first and second circuit patterns isolated from each other and a conductive layer formed on the projection to make a temporary electrical connection between the first and second circuit patterns. Electroplating is performed by the passage of electric current through the initial circuit pattern to form an additional metal film on the initial circuit pattern. After the electroplating, the conductive layer on the projection is removed to provide electrical insulation between the first and second circuit patterns.

摘要翻译： 提供一种有效地制造印刷电路板的方法。 在该方法中，在具有突起的基板上形成金属薄膜。 然后，通过图案化金属薄膜，在基板上形成初始电路图案。 初始电路图案包括彼此隔离的第一和第二电路图案，以及形成在突起上的导电层，以在第一和第二电路图案之间进行临时电连接。 通过电流通过初始电路图案进行电镀，以在初始电路图案上形成附加的金属膜。 在电镀之后，去除突起上的导电层以在第一和第二电路图案之间提供电绝缘。

公开(公告)号：US06874910B2

公开(公告)日：2005-04-05

申请号：US10398660

申请日：2001-12-03

申请人： Masaru Sugimoto ,  Eiji Shiohama ,  Hideyoshi Kimura ,  Takuma Hashimoto ,  Toshiyuki Suzuki ,  Kazuya Nakagawa ,  Mitsuru Kobayashi ,  Jiro Hashizume

发明人： Masaru Sugimoto ,  Eiji Shiohama ,  Hideyoshi Kimura ,  Takuma Hashimoto ,  Toshiyuki Suzuki ,  Kazuya Nakagawa ,  Mitsuru Kobayashi ,  Jiro Hashizume

IPC分类号： H01L25/075 ,  H01L33/64 ,  F21V29/00 ,  H01L33/00

CPC分类号： H01L33/642 ,  H01L24/45 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/60 ,  H01L33/647 ,  H01L2224/16225 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  Y10S362/80 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/20752

摘要： A light source apparatus having a radiator plate having thermally conductive properties and an insulating member coupled to at least one side of the radiator plate having a through hole provided in a side thereof facing the radiator plate. The light source apparatus further including a LED chip installed and thermally coupled to an exposed portion of the radiator plate facing the through hole, an extension inwardly projecting at the through hole from the radiator plate end of the insulating member, and a wiring pattern provided on the insulating member electrically isolated by the insulating member from the radiator plate. The light source apparatus also including bonding wires electrically connecting portions of the wiring pattern on the extension and the electrodes of the LED chip, and a light-transmissive sealing material filling the through hole for entirely encapsulating the LED chip and the bonding wires.

摘要翻译： 一种具有导热性的散热板的光源装置和与散热板的至少一侧连接的绝缘构件，其具有设置在其面向散热板的一侧的通孔。 所述光源装置还包括LED芯片，所述LED芯片安装并热耦合到所述辐射板的面向所述通孔的暴露部分，从所述绝缘构件的散热板端部在所述通孔向内突出的延伸部，以及布置在 所述绝缘构件通过所述绝缘构件与所述散热板电隔离。 光源装置还包括电连接延伸部上的布线图案和LED芯片的电极的接合线，以及填充用于完全封装LED芯片和接合线的通孔的透光密封材料。

公开(公告)号：US06639341B1

公开(公告)日：2003-10-28

申请号：US09535746

申请日：2000-03-27

申请人： Kazuhiko Sakai ,  Atsunori Okada ,  Singo Higashisaka ,  Takuma Hashimoto

发明人： Kazuhiko Sakai ,  Atsunori Okada ,  Singo Higashisaka ,  Takuma Hashimoto

IPC分类号： H05B3104

CPC分类号： H01J61/125 ,  H01J61/34 ,  H01J61/827

摘要： A metal halide discharge lamp which is capable of reducing a color change when subjected to a variation in the lamp power and/or the voltage supplied to the lamp. The metal halide lamp has an arc tube filled with at least sodium halide and scandium halide. The arc tube is formed at its opposite ends with electrodes which gives an arc discharge therebetween. The lamp has regulator means for keeping a coldest spot temperature of the arc tube at 550° C. or more when operating the lamp at a lamp power which is 50% or rated lamp power. It is found that when the lamp is configured to have a coldest spot temperature at 550° C. or more when operating the lamp at a lamp power which is 50% of the rated lamp power, the lamp shows much less color variation even subjected to the lamp voltage variation, thereby maintaining a desired color.

摘要翻译： 一种金属卤化物放电灯，其能够在经受灯功率变化和/或提供给灯的电压时降低颜色变化。 金属卤化物灯具有至少填充有卤化钠和卤化钪的电弧管。 电弧管在其相对端形成有在其间产生电弧放电的电极。 该灯具有调节装置，用于在灯功率为50％或额定灯功率下操作灯时，将电弧管的最冷点温度保持在550℃或更高。 已经发现，当以灯功率为额定灯功率的50％来操作灯时，当灯被配置为具有550℃或更高的最低点温度时，该灯显示出甚至经受 灯电压变化，从而保持期望的颜色。