公开(公告)号：US20160268188A1

公开(公告)日：2016-09-15

申请号：US15055921

申请日：2016-02-29

Applicant: IBIDEN CO., LTD.

Inventor： Takashi KARIYA ,  Shigeru YAMADA ,  Masatoshi KUNIEDA

IPC: H01L23/498 ,  H01L23/31

CPC classification number: H01L23/3121 ,  H01L23/49811 ,  H01L23/5389 ,  H01L2224/16225 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A printed wiring board for package-on-package includes a first insulating layer, a wiring layer including a conductor pattern and formed on first surface of the first insulating layer, a second insulating layer formed on first surface side of the first insulating layer, electrodes formed in through holes of the first insulating layer respectively such that the electrodes electrically connect to the conductor pattern and have exposed surfaces exposed from second surface of the first insulating layer, first pads formed on the second insulating layer and positioned to connect an IC chip in center portion of the second insulating layer, second pads formed on the second insulating layer and positioned in outer edge portion of the second insulating layer to connect a second printed wiring board, and via conductors formed in the second insulating layer such that the via conductors electrically connect the first and second pads to the conductor pattern.

Abstract translation: 一种用于封装封装的印刷线路板包括：第一绝缘层，包括导体图案的布线层，并形成在第一绝缘层的第一表面上;第二绝缘层，形成在第一绝缘层的第一表面侧;电极 分别形成在第一绝缘层的通孔中，使得电极电连接到导体图案，并且具有从第一绝缘层的第二表面露出的暴露表面，形成在第二绝缘层上的第一焊盘并且定位成将IC芯片 所述第二绝缘层的中心部分，形成在所述第二绝缘层上并位于所述第二绝缘层的外边缘部分中以连接第二印刷线路板的第二焊盘，以及形成在所述第二绝缘层中的通孔导体， 将第一和第二焊盘连接到导体图案。

公开(公告)号：US20150250054A1

公开(公告)日：2015-09-03

申请号：US14633864

申请日：2015-02-27

Applicant: IBIDEN CO., LTD.

Inventor： Kazuhiro YOSHIKAWA ,  Takashi KARIYA

IPC: H05K1/11 ,  H05K1/09 ,  H05K3/18 ,  H05K3/46 ,  H05K3/22 ,  H05K3/02 ,  H01L23/00 ,  H05K1/14

CPC classification number: H05K1/111 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/09 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H05K1/144 ,  H05K3/28 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3478 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/042 ,  H05K2201/068 ,  H05K2201/09745 ,  H05K2201/098 ,  H05K2201/10977 ,  H05K2201/2072 ,  H05K2203/0353 ,  H05K2203/0361 ,  H05K2203/0405 ,  H05K2203/0594 ,  H05K2203/0597 ,  H05K2203/1184 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A printed wiring board includes an uppermost insulating layer, first pads positioned to mount an IC chip on the insulating layer, second pads positioned to mount a second printed wiring board on the insulating layer, metal posts formed on the second pads, respectively, such that the metal posts mount the second board over the chip, and a solder resist layer formed on the uppermost insulating layer and having first and second openings such that the first openings exposes the first pads and that the second openings exposes the second pads, respectively. The metal posts are formed such that each of the metal posts has a diameter which is smaller than a diameter of each of the second opening portions, and the second opening portions are formed such that the diameter of each of the second opening portions is smaller than a diameter of each of the second pads.

Abstract translation: 印刷布线板包括最上层的绝缘层，位于绝缘层上的IC芯片安装的第一焊盘，位于绝缘层上的第二印刷电路板安装的第二焊盘，分别形成在第二焊盘上的金属柱，使得 金属柱将第二板安装在芯片上，以及形成在最上层绝缘层上并具有第一和第二开口的阻焊层，使得第一开口暴露第一焊盘，并且第二开口分别暴露第二焊盘。 金属柱形成为使得每个金属柱的直径小于每个第二开口部的直径，并且第二开口部形成为使得每个第二开口部的直径小于 每个第二垫的直径。

公开(公告)号：US20150245485A1

公开(公告)日：2015-08-27

申请号：US14628477

申请日：2015-02-23

Applicant: IBIDEN CO., LTD.

Inventor： Nobuya TAKAHASHI ,  Shigeru YAMADA ,  Takashi KARIYA

IPC: H05K1/11 ,  H05K3/18 ,  H05K3/30

CPC classification number: H05K1/113 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5386 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K3/4694 ,  H05K2201/094 ,  H05K2201/09972 ,  H05K2201/10522 ,  H05K2201/10674 ,  Y10T29/49144

Abstract: A printed wiring board includes a first insulating layer, a first conductor layer formed on a surface of the first insulating layer and including first pads, and a wiring structure including a second conductor layer formed on the first insulating layer, a second insulating layer laminated on the second conductor layer, a third conductor layer formed on the second insulating layer, and formed through the second insulating layer. The second conductor layer includes second pads formed on the first insulating layer, the third conductor layer includes third pads formed on the second insulating layer, the via conductors are positioned such that the via conductors are connecting the second pads and the third conductor layer, and the wiring structure is formed such that the second conductor layer and third conductor layer are not electrically connected to the first conductor layer.

Abstract translation: 印刷布线板包括第一绝缘层，形成在第一绝缘层的表面上并包括第一焊盘的第一导体层，以及包括形成在第一绝缘层上的第二导体层的布线结构，层叠在第一绝缘层上的第二绝缘层 第二导体层，形成在第二绝缘层上的第三导体层，并通过第二绝缘层形成。 所述第二导体层包括形成在所述第一绝缘层上的第二焊盘，所述第三导体层包括形成在所述第二绝缘层上的第三焊盘，所述通孔导体定位成使得所述通孔导体连接所述第二焊盘和所述第三导体层，以及 布线结构形成为使得第二导体层和第三导体层不与第一导体层电连接。

公开(公告)号：US20150092357A1

公开(公告)日：2015-04-02

申请号：US14504969

申请日：2014-10-02

Applicant: IBIDEN CO., LTD.

Inventor： Kazuhiro YOSHIKAWA ,  Takashi KARIYA

IPC: H05K1/03 ,  H05K3/00 ,  H05K3/46 ,  H05K3/18 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/113 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/5385 ,  H01L23/5389 ,  H01L23/562 ,  H01L25/00 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K1/112 ,  H05K1/144 ,  H05K1/183 ,  H05K3/244 ,  H05K3/282 ,  H05K3/3473 ,  H05K3/4007 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/096 ,  H05K2201/09854 ,  H05K2203/0392 ,  H05K2203/0577 ,  H05K2203/0723 ,  H05K2203/1383

Abstract: A method for manufacturing a printed wiring board includes forming a resin insulation layer on an interlayer resin insulation layer and conductive circuits such that the resin insulation layer has first openings exposing pad portions in central portion of the interlayer layer and second openings exposing pad portions in peripheral portion of the interlayer layer, forming a seed layer on the resin insulation layer, in the first and second openings and on the pad portions, forming on the seed layer a plating resist such that the resist has resist openings exposing the second openings and having diameters greater than the second openings, filling the resist openings with electrolytic plating material via the seed layer such that metal posts are formed in the resist openings, removing the resist from the resin insulation layer, and removing the seed layer exposed on the resin insulation layer by the removing of the resist.

Abstract translation: 一种制造印刷电路板的方法包括在层间树脂绝缘层上形成树脂绝缘层和导电电路，使得树脂绝缘层具有露出层间层中心部分的焊盘部分的第一开口和暴露外围焊盘部分的第二开口 在所述第一和第二开口和所述垫部分上在所述树脂绝缘层上形成种子层，在所述种子层上形成电镀抗蚀剂，使得所述抗蚀剂具有抵抗开口暴露所述第二开口并且具有直径 大于第二开口，通过种子层用电解电镀材料填充抗蚀剂开口，使得在抗蚀剂开口中形成金属柱，从树脂绝缘层除去抗蚀剂，并且通过在树脂绝缘层上暴露的种子层除去 去除抗蚀剂。

公开(公告)号：US20150060124A1

公开(公告)日：2015-03-05

申请号：US14473235

申请日：2014-08-29

Applicant: IBIDEN CO., LTD.

Inventor： Makoto TERUI ,  Takashi KARIYA ,  Yoshinori SHIZUNO ,  Masatoshi KUNIEDA

IPC: H05K1/11 ,  H05K3/20 ,  H05K3/40 ,  H05K1/02

CPC classification number: H05K1/111 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5385 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2924/15313 ,  H05K1/141 ,  H05K1/181 ,  H05K3/3436 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/041 ,  H05K2201/094 ,  H05K2201/09472 ,  H05K2201/09827 ,  H05K2201/10159 ,  H05K2201/10674 ,  H05K2203/0465 ,  Y02P70/611 ,  Y10T29/49128

Abstract: A combined printed wiring board includes a multilayer printed wiring board having an outermost insulation layer, and a wiring film fixed to a portion of the outermost insulation layer of the multilayer printed wiring board. The wiring film includes dense-pitch pads formed on a semiconductor-mounting surface of the wiring film, the multilayer printed wiring board has sparse-pitch pads formed on a semiconductor-mounting surface of the multilayer printed wiring board, the dense-pitch pads are formed to facilitate electrical connection between a first semiconductor element and a second semiconductor element, and the sparse-pitch pads are formed to facilitate electrical connection between the multilayer printed wiring board and the first semiconductor element and/or the second semiconductor element.

Abstract translation: 组合印刷线路板包括具有最外绝缘层的多层印刷布线板和固定到多层印刷线路板的最外层绝缘层的一部分的布线膜。 布线膜包括形成在布线膜的半导体安装表面上的密集垫片，多层印刷布线板具有形成在多层印刷布线板的半导体安装表面上的稀疏间距衬垫，密集衬垫是 形成为促进第一半导体元件和第二半导体元件之间的电连接，并且形成稀疏间距焊盘以便于多层印刷线路板与第一半导体元件和/或第二半导体元件之间的电连接。

公开(公告)号：US20130223033A1

公开(公告)日：2013-08-29

申请号：US13729106

申请日：2012-12-28

Applicant: IBIDEN Co., Ltd.

Inventor： Yasuhiko MANO ,  Kazuhiro YOSHIKAWA ,  Takashi KARIYA

IPC: H01F27/28 ,  H05K1/18

CPC classification number: H01F27/2804 ,  H01F17/0013 ,  H01F2017/002 ,  H01F2017/0066 ,  H05K1/162 ,  H05K1/165 ,  H05K1/18 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4682 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2203/0191 ,  H05K2203/1469

Abstract: A printed wiring board has a core base having an opening portion, an inductor component accommodated in the opening portion, and a filler resin filling gap between the component and a side wall of the opening portion. The component has a support layer, a first conductive pattern on the support, an interlayer insulation layer on the support and first pattern, a second conductive pattern on the insulation layer, and a via conductor in the insulation layer and connecting the first and second patterns, the insulation layer includes a magnetic layer and a resin layer covering the magnetic layer, the magnetic layer includes magnetic material and resin material and has a first hole, the insulation layer has a second hole penetrating through the resin layer such that the second hole passes through the first hole and extends to the first pattern, and the via conductor is formed in the second hole.

Abstract translation: 印刷电路板具有：具有开口部的芯基部，容纳在开口部的电感器部，以及所述部件与所述开口部的侧壁之间的填充树脂填充间隙。 所述部件具有支撑层，支撑体上的第一导电图案，支撑件上的层间绝缘层和第一图案，绝缘层上的第二导电图案，以及绝缘层中的通孔导体，并连接第一和第二图案 所述绝缘层包括磁性层和覆盖所述磁性层的树脂层，所述磁性层包括磁性材料和树脂材料，并且具有第一孔，所述绝缘层具有穿过所述树脂层的第二孔，使得所述第二孔通过 通过第一孔延伸到第一图案，并且通孔导体形成在第二孔中。