公开(公告)号：US20160169763A1

公开(公告)日：2016-06-16

申请号：US14945661

申请日：2015-11-19

Applicant: Infineon Technologies AG

Inventor： Mathias Vaupel ,  Matthias Boehm ,  Steven Gross ,  Markus Loehndorf ,  Stephan Schmitt ,  Horst Theuss ,  Helmut Wietschorke

IPC: G01L19/00 ,  G01L9/00

CPC classification number: G01L19/0084 ,  G01L19/147 ,  G01L19/148

Abstract: A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.

Abstract translation: 公开了一种包括壳体，压力传感器芯片以及集成无源器件（IDP）芯片和分立无源器件中的一个或多个的压力传感器模块。 压力传感器芯片和一个或多个IPD芯片和分立无源器件布置在壳体内。

公开(公告)号：US09312226B2

公开(公告)日：2016-04-12

申请号：US13716004

申请日：2012-12-14

Applicant: Infineon Technologies AG

Inventor： Stefan Martens ,  Berthold Schuderer ,  Mathias Vaupel ,  Raimund Peichl

IPC: H01L23/485 ,  H01L23/544 ,  H01L23/31

CPC classification number: H01L23/544 ,  H01L23/3171 ,  H01L2223/54406 ,  H01L2223/54413 ,  H01L2223/5442 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device includes a chip, a contact pad arranged over the front side of the chip and an identification mark arranged over the contact pad. The identification mark includes an information about a property of the chip.

Abstract translation: 半导体器件包括芯片，布置在芯片的前侧上的接触焊盘和布置在接触焊盘上的识别标记。 识别标记包括关于芯片的属性的信息。

公开(公告)号：US20150132614A1

公开(公告)日：2015-05-14

申请号：US14077362

申请日：2013-11-12

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Jochen Dangelmaier ,  Franz Michael Darrer ,  Thomas Müller ,  Mathias Vaupel ,  Manfred Fries ,  Günther Ruhl ,  Horst Theuss

IPC: H01M10/48

CPC classification number: H01M10/48 ,  H01M10/0525 ,  H01M10/486 ,  H04Q9/00 ,  H04Q2209/40 ,  H04Q2209/823 ,  Y02T10/7011

Abstract: A sensor arrangement according to an embodiment comprises a transmitter to be arranged inside a battery cell and to transmit a signal based on at least one sensed operational parameter of the battery cell wirelessly.

Abstract translation: 根据实施例的传感器装置包括要布置在电池单元内的发射器，并且基于无线地基于电池单元的至少一个感测的操作参数发送信号。

公开(公告)号：US20150004451A1

公开(公告)日：2015-01-01

申请号：US14311489

申请日：2014-06-23

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Jochen Dangelmaier ,  Manfred Fries ,  Juergen Hoegerl ,  Georg Meyer-Berg ,  Thomas Mueller ,  Guenther Ruhl ,  Horst Theuss ,  Mathias Vaupel

IPC: G01R31/36 ,  H01M10/48

CPC classification number: H01M10/48 ,  G01R31/3689 ,  H01M6/505 ,  H01M10/488

Abstract: An apparatus for determining a state of a rechargeable battery or of a battery has a sensor device and an evaluation device. The sensor device brings about an interaction between an optical signal and a part of the rechargeable battery or of the battery, which part indicates optically acquirable information about a state of the rechargeable battery or of the battery, and detects an optical signal caused by the interaction. The sensor device furthermore provides a detection signal having information about the detected optical signal. The evaluation device determines information about a state of the rechargeable battery or of the battery on the basis of the information of the detection signal. Furthermore, the evaluation device provides a state signal having the information about the determined state.

Abstract translation: 用于确定可再充电电池或电池的状态的装置具有传感器装置和评估装置。 该传感器装置引起光信号与可再充电电池或电池的一部分之间的相互作用，该部分指示关于可再充电电池或电池的状态的光学上可获取的信息，并检测由相互作用引起的光信号 。 传感器装置还提供具有关于检测到的光信号的信息的检测信号。 评估装置基于检测信号的信息来确定关于可再充电电池或电池的状态的信息。 此外，评估装置提供具有关于所确定的状态的信息的状态信号。

公开(公告)号：US11655143B2

公开(公告)日：2023-05-23

申请号：US17116021

申请日：2020-12-09

Applicant: Infineon Technologies AG

Inventor： Mathias Vaupel ,  Bernhard Knott ,  Horst Theuss

IPC: B81B7/00 ,  H01L23/04 ,  H01L23/24 ,  H01L23/498 ,  H01L23/16 ,  B81C1/00 ,  H01L21/311 ,  H01L21/52 ,  H01L21/56 ,  H01L23/055 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00

CPC classification number: B81B7/0058 ,  B81C1/00301 ,  H01L21/31144 ,  H01L21/52 ,  H01L21/56 ,  H01L23/04 ,  H01L23/055 ,  H01L23/16 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/49541 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/85 ,  B81B2201/0264 ,  H01L23/49551 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/45144 ,  H01L2924/00014

Abstract: A method for producing a semiconductor component is proposed. The method includes providing a housing. At least one semiconductor chip is arranged in a cavity of the housing. Furthermore, an electrical contact of the semiconductor chip is connected to an electrical contact of the housing via a bond wire. The method furthermore includes applying a protective material on the electrical contact of the housing and also on a region of the bond wire which is adjacent to the electrical contact of the housing. Moreover, the method also includes filling at least one partial region of the cavity with a gel.

公开(公告)号：US10947109B2

公开(公告)日：2021-03-16

申请号：US16142826

申请日：2018-09-26

Applicant: Infineon Technologies AG

Inventor： Mathias Vaupel ,  Bernhard Knott ,  Horst Theuss

IPC: H01L29/84 ,  B81B7/00 ,  H01L23/04 ,  H01L23/24 ,  H01L23/498 ,  H01L23/16 ,  B81C1/00 ,  H01L21/311 ,  H01L21/52 ,  H01L21/56 ,  H01L23/055 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00

Abstract: A method for producing a semiconductor component is proposed. The method includes providing a housing. At least one semiconductor chip is arranged in a cavity of the housing. Furthermore, an electrical contact of the semiconductor chip is connected to an electrical contact of the housing via a bond wire. The method furthermore includes applying a protective material on the electrical contact of the semiconductor chip and also on a region of the bond wire which is adjacent to the electrical contact of the semiconductor chip, and/or on the electrical contact of the housing and also on a region of the bond wire which is adjacent to the electrical contact of the housing. Moreover, the method also includes filling at least one partial region of the cavity with a gel.

公开(公告)号：US10677675B2

公开(公告)日：2020-06-09

申请号：US16114543

申请日：2018-08-28

Applicant: Infineon Technologies AG

Inventor： Mathias Vaupel ,  Matthias Boehm ,  Steven Gross ,  Markus Loehndorf ,  Stephan Schmitt ,  Horst Theuss ,  Helmut Wietschorke

IPC: G01L9/12 ,  G01L19/14 ,  G01L19/00

Abstract: A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.

公开(公告)号：US10107867B2

公开(公告)日：2018-10-23

申请号：US14631443

申请日：2015-02-25

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Jochen Dangelmaier ,  Franz Michael Darrer ,  Thomas Mueller ,  Mathias Vaupel ,  Manfred Fries ,  Guenther Ruhl ,  Horst Theuss ,  Matthias Rose ,  Stephan Auer ,  Tue Fatt David Wee ,  Sie Boo Chiang

IPC: H01M10/48 ,  G01R31/36 ,  H01M10/42 ,  H04Q9/00 ,  H01M10/0525

Abstract: A sensor arrangement according to an embodiment includes a substrate, and at least one sensor and a control circuit mounted on the substrate, wherein the at least one sensor and the control circuit are located on the substrate to be mountable inside a battery cell and outside the battery cell, respectively.

公开(公告)号：US10060819B2

公开(公告)日：2018-08-28

申请号：US14945661

申请日：2015-11-19

Applicant: Infineon Technologies AG

Inventor： Mathias Vaupel ,  Matthias Boehm ,  Steven Gross ,  Markus Loehndorf ,  Stephan Schmitt ,  Horst Theuss ,  Helmut Wietschorke

IPC: G01L7/00 ,  G01L9/12 ,  G01L19/00 ,  G01L19/14

CPC classification number: G01L19/0084 ,  G01L19/147 ,  G01L19/148

Abstract: A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.

公开(公告)号：US09984927B2

公开(公告)日：2018-05-29

申请号：US14949691

申请日：2015-11-23

Applicant: Infineon Technologies AG

Inventor： Mathias Vaupel ,  Kurt Gehrig ,  Kian Pin Queck

IPC: B32B43/00 ,  H01L21/78 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01L21/78 ,  H01L21/67017 ,  H01L21/67092 ,  H01L21/67098 ,  H01L21/67132 ,  H01L21/6836 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68368 ,  H01L2221/68381 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/10 ,  Y10T156/1121 ,  Y10T156/1126 ,  Y10T156/1137 ,  Y10T156/1153 ,  Y10T156/1911 ,  Y10T156/1922 ,  Y10T156/1939

Abstract: An embodiment method for separating semiconductor devices from a wafer comprises using a carrier which acts an adjustable adhesive force upon the semiconductor devices and removing the semiconductor devices from the carrier by applying a mechanical or acoustical impulse to the carrier.