公开(公告)号：US20090145645A1

公开(公告)日：2009-06-11

申请号：US12228890

申请日：2008-08-15

申请人： Jinsu Kwon ,  Kimitaka Endo ,  Sean Moran

发明人： Jinsu Kwon ,  Kimitaka Endo ,  Sean Moran

IPC分类号： H05K7/00 ,  H05K1/11 ,  G01R3/00 ,  H05K3/00

CPC分类号： H05K1/11 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/05 ,  H01L24/16 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2203/0384 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  H01L2924/00

摘要： An interconnection element is provided for conductive interconnection with another element having at least one of microelectronic devices or wiring thereon. The interconnection element includes a dielectric element having a major surface. A plated metal layer including a plurality of exposed metal posts can project outwardly beyond the major surface of the dielectric element. Some of the metal posts can be electrically insulated from each other by the dielectric element. The interconnection element typically includes a plurality of terminals in conductive communication with the metal posts. The terminals can be connected through the dielectric element to the metal posts. The posts may be defined by plating a metal onto exposed co-planar surfaces of a mandrel and interior surfaces of openings in a mandrel, after which the mandrel can be removed.

摘要翻译： 提供互连元件用于与具有微电子器件或其上的布线中的至少一个的另一元件的导电互连。 互连元件包括具有主表面的电介质元件。 包括多个暴露的金属柱的电镀金属层可以向外突出超过介电元件的主表面。 一些金属柱可以通过电介质元件彼此电绝缘。 互连元件通常包括与金属柱导电连通的多个端子。 端子可以通过电介质元件连接到金属柱。 可以通过将金属镀在芯棒的暴露的共平面表面和心轴中的开口的内表面上来定义柱，然后可以去除心轴。

公开(公告)号：US20090071707A1

公开(公告)日：2009-03-19

申请号：US12228537

申请日：2008-08-13

申请人： Kimitaka Endo ,  Philip Damberg ,  Craig S. Mitchell ,  Sean Moran ,  Christopher Wade ,  Belgacem Haba ,  John Riley

发明人： Kimitaka Endo ,  Philip Damberg ,  Craig S. Mitchell ,  Sean Moran ,  Christopher Wade ,  Belgacem Haba ,  John Riley

IPC分类号： H05K1/11 ,  C25D5/02

CPC分类号： H05K3/4007 ,  C25D5/02 ,  H01L21/4846 ,  H01L24/73 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/112 ,  H05K3/06 ,  H05K3/20 ,  H05K3/243 ,  H05K3/421 ,  H05K3/423 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2201/09563 ,  H05K2203/0152 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0733 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A method is provided for manufacturing a multilayer substrate. An insulating layer can have a hole overlying a patterned second metal layer. In turn, the second metal layer can overlie a first metal layer. A third metal layer can be electroplated onto the patterned second metal layer within the hole, the third metal layer extending from the second metal layer onto a wall of the hole. When plating the third metal layer, the first and second metal layers can function as a conductive commoning element.

摘要翻译： 提供了制造多层基板的方法。 绝缘层可以具有覆盖图案化的第二金属层的孔。 反过来，第二金属层可以覆盖在第一金属层上。 第三金属层可以电镀在孔内的图案化的第二金属层上，第三金属层从第二金属层延伸到孔的壁上。 当电镀第三金属层时，第一和第二金属层可以用作导电共用元件。

公开(公告)号：US20090045524A1

公开(公告)日：2009-02-19

申请号：US11894036

申请日：2007-08-16

申请人： IIyas Mohammed ,  Belgacem Haba ,  Sean Moran ,  Wei-Shun Wang ,  Ellis Chau ,  Christopher Wade

发明人： IIyas Mohammed ,  Belgacem Haba ,  Sean Moran ,  Wei-Shun Wang ,  Ellis Chau ,  Christopher Wade

IPC分类号： H01L21/50 ,  H01L23/48

CPC分类号： H01L23/48 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/06135 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49431 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A microelectronic package includes a lower unit having a lower unit substrate with conductive features and a top and bottom surface. The lower unit includes one or more lower unit chips overly/ing the top surface of the lower unit substrate that are electrically connected to the conductive features of the lower unit substrate. The microelectronic package also includes an upper unit including an upper unit substrate having conductive features, top and bottom surfaces and a hole extending between such top and bottom surfaces. The upper unit further includes one or more upper unit chips overlying the top surface of the upper unit substrate and electrically connected to the conductive features of the upper unit substrate by connections extending within the hole. The upper unit may include an upper unit encapsulant that covers the connections of the upper unit and the one or more upper unit chips.

摘要翻译： 微电子封装包括具有导电特征的下单元衬底和顶表面和底表面的下单元。 下部单元包括一个或多个下部单元芯片，其跨过下部单元基板的顶表面电连接到下部单元基板的导电特征。 微电子封装还包括上部单元，其包括具有导电特征的上部单元基板，顶部和底部表面以及在该顶部和底部表面之间延伸的孔。 上部单元还包括一个或多个上部单元芯片，其覆盖在上部单元基板的顶表面上，并且通过在孔内延伸的连接电连接到上部单元基板的导电特征。 上部单元可以包括覆盖上部单元和一个或多个上部单元芯片的连接的上部单元密封剂。

公开(公告)号：US20080006613A1

公开(公告)日：2008-01-10

申请号：US11484145

申请日：2006-07-10

申请人： Mark Ulrich ,  Sean Moran ,  Kenneth C. Altekruse ,  Ben Newcomb

发明人： Mark Ulrich ,  Sean Moran ,  Kenneth C. Altekruse ,  Ben Newcomb

IPC分类号： B23K9/20

CPC分类号： B23K9/205 ,  B23K9/0738

摘要： A short resistant welder that includes, in some embodiments, a short circuit sensor configured to transmit a first signal indicative of a short circuit between a workpiece and a stud, and a stud welding controller communicatively coupled to the short circuit sensor. In certain embodiments, the stud welding controller is configured to transmit an increase-current control signal to a power supply in response to the first signal.

摘要翻译： 在一些实施例中，包括短路传感器的短路传感器，该短路传感器被配置为传送指示工件和螺柱之间的短路的第一信号，以及通信地耦合到短路传感器的螺柱焊接控制器。 在某些实施例中，螺柱焊接控制器被配置为响应于第一信号将增加电流控制信号传送到电源。

公开(公告)号：US20060015058A1

公开(公告)日：2006-01-19

申请号：US11065278

申请日：2005-02-25

申请人： Scott Kellogg ,  Shikha Barman ,  Lauren Roode ,  Hannah Farnham ,  Sean Moran ,  Samir Mitragotri ,  Joseph Kost ,  Nicholas Warner

发明人： Scott Kellogg ,  Shikha Barman ,  Lauren Roode ,  Hannah Farnham ,  Sean Moran ,  Samir Mitragotri ,  Joseph Kost ,  Nicholas Warner

IPC分类号： A61B17/20 ,  A61B5/00

CPC分类号： A61B5/681 ,  A61B5/14514 ,  A61B5/14532 ,  A61B5/1486 ,  A61B5/411 ,  A61B5/415 ,  A61B5/418 ,  A61B5/6843 ,  A61B17/20 ,  A61K9/0009 ,  A61K47/10 ,  A61M37/0092 ,  A61N1/30

摘要： The invention according to an exemplary embodiment relates to a method for transporting a substance across a biological membrane comprising the steps of applying a delipidation agent to a portion of the biological membrane, applying a hydration agent to the portion of the biological membrane, sonicating the portion of the biological membrane, and transporting the substance across the biological membrane. The step of applying the delipidation agent may be carried out prior to or simultaneously with the step of applying the hydration agent. The hydration agent may be applied before, during, or after the sonication step. The methods according to exemplary embodiments of the invention can provide improved transdermal transport in applications such as continuous analyte extraction and analysis and transdermal delivery of drugs and vaccines.

摘要翻译： 根据示例性实施方案的本发明涉及一种用于在物质膜上输送物质的方法，包括以下步骤：将一种脱脂剂施用于该生物膜的一部分，将该水合剂施用于生物膜的该部分， 的生物膜，并将物质运送到生物膜上。 施用脱脂剂的步骤可以在施用水化剂的步骤之前或同时进行。 水合剂可以在超声处理步骤之前，期间或之后施用。 根据本发明的示例性实施方案的方法可以在诸如连续分析物提取和分析以及药物和疫苗的透皮递送等应用中提供改进的透皮转运。

公开(公告)号：US08505199B2

公开(公告)日：2013-08-13

申请号：US12228890

申请日：2008-08-15

申请人： Jinsu Kwon ,  Kimitaka Endo ,  Sean Moran

发明人： Jinsu Kwon ,  Kimitaka Endo ,  Sean Moran

IPC分类号： H01R43/16 ,  H05K1/11

CPC分类号： H05K1/11 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/05 ,  H01L24/16 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2203/0384 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  H01L2924/00

摘要： An interconnection element is provided for conductive interconnection with another element having at least one of microelectronic devices or wiring thereon. The interconnection element includes a dielectric element having a major surface. A plated metal layer including a plurality of exposed metal posts can project outwardly beyond the major surface of the dielectric element. Some of the metal posts can be electrically insulated from each other by the dielectric element. The interconnection element typically includes a plurality of terminals in conductive communication with the metal posts. The terminals can be connected through the dielectric element to the metal posts. The posts may be defined by plating a metal onto exposed co-planar surfaces of a mandrel and interior surfaces of openings in a mandrel, after which the mandrel can be removed.

摘要翻译： 提供互连元件用于与具有微电子器件或其上的布线中的至少一个的另一元件的导电互连。 互连元件包括具有主表面的电介质元件。 包括多个暴露的金属柱的电镀金属层可以向外突出超过介电元件的主表面。 一些金属柱可以通过电介质元件彼此电绝缘。 互连元件通常包括与金属柱导电连通的多个端子。 端子可以通过电介质元件连接到金属柱。 可以通过将金属镀在芯棒的暴露的共平面表面和心轴中的开口的内表面上来定义柱，然后可以去除心轴。

公开(公告)号：US20060086696A1

公开(公告)日：2006-04-27

申请号：US10904168

申请日：2004-10-27

申请人： Mark Ulrich ,  Sean Moran ,  Warren Wran

发明人： Mark Ulrich ,  Sean Moran ,  Warren Wran

IPC分类号： B23K9/20

CPC分类号： B23K9/205

摘要： A welding apparatus is presented that includes a post-firing detection system and control connected to communicate with the post-firing detection system such that a stud welding gun is prevented from activation if a recently fired welding stud remains connected to the stud welding gun.

摘要翻译： 提供了一种焊接装置，其包括后燃烧检测系统和连接以与后燃烧检测系统连通的控制，使得如果近来燃烧的焊接螺柱保持连接到螺柱焊枪，则防止螺柱焊枪的启动。

公开(公告)号：US20050111932A1

公开(公告)日：2005-05-26

申请号：US10707214

申请日：2003-11-26

申请人： Bruce Albrecht ,  Sean Moran ,  Sundaram Nagarajan ,  Mark Ulrich

发明人： Bruce Albrecht ,  Sean Moran ,  Sundaram Nagarajan ,  Mark Ulrich

IPC分类号： B23K9/20 ,  B23K35/02 ,  F16B37/06

CPC分类号： B23K9/208 ,  B23K9/207 ,  B23K35/0288

摘要： A welding stud apparatus and method of manufacturing a welding stud are disclosed. The welding stud has a weld end constructed to be welded to a workpiece that has at least one recess formed therein. The recess decreases an effective arc area of the weld end to localize a current therethrough and increase the efficiency with which the welding stud can be welded to a workpiece.

摘要翻译： 公开了一种焊接螺柱设备及其制造方法。 焊接螺柱具有被焊接到其上形成有至少一个凹部的工件的焊接端。 该凹陷减小了焊接端的有效电弧面积，以便使电流定位，从而提高了将焊接螺柱焊接到工件上的效率。

公开(公告)号：US06345097B1

公开(公告)日：2002-02-05

申请号：US09206540

申请日：1998-12-07

申请人： Thomas J. Chintala ,  Jose F. Olivas ,  Paul J. Smith ,  Sean Moran ,  James Beckwith

发明人： Thomas J. Chintala ,  Jose F. Olivas ,  Paul J. Smith ,  Sean Moran ,  James Beckwith

IPC分类号： H04M100

CPC分类号： H04M1/0216 ,  H04M1/725

摘要： A portable phone has a cavity at one end in which a hinge pin is rotatably mounted, with opposite ends of the hinge pin releasably secured to a flip panel rotatable between a closed position extending over part of one face of the phone, and an open position. The hinge pin includes a cam formation, and a biasing spring secured in the cavity has a bearing portion acting against the cam portion to releasably retain the flip panel in its open and closed positions. A cam retainer is mounted in the cavity to extend over the hinge pin and resist bending of the hinge pin out of a straight, axial orientation.

摘要翻译： 便携式电话的一端具有空腔，铰链销可旋转地安装在其中，铰链销的相对端可释放地固定到可在电话的一个面的一部分延伸的关闭位置和可打开位置之间旋转的翻盖板 。 铰链销包括凸轮结构，并且固定在空腔中的偏压弹簧具有作用于凸轮部分的轴承部分，以可拆卸地将翻盖保持在其打开和关闭位置。 凸轮保持器安装在空腔中以在铰链销上延伸并且抵抗铰链销的弯曲从直的轴向取向。