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11.发明申请Printed circuit board including landless via and method of manufacturing the same 审中-公开包括无地面通孔及其制造方法的印刷电路板公开(公告)号：US20090294164A1
公开(公告)日：2009-12-03
申请号：US12219079
申请日：2008-07-15
申请人： Han Kim , Je Gwang Yoo , Chang Sup Ryu , Chang Gun Oh
发明人： Han Kim , Je Gwang Yoo , Chang Sup Ryu , Chang Gun Oh
CPC分类号： H05K1/116 , H05K3/0035 , H05K3/0038 , H05K3/025 , H05K3/108 , H05K3/427 , H05K2201/0394 , H05K2201/09545 , Y10T29/49165
摘要： Disclosed herein is a printed circuit board including a landless via and a method of manufacturing the printed circuit board. The printed circuit board includes a landless via having no upper land. The via includes a circuit pattern having a line width smaller than the minimum diameter of the via. The via does not have an upper land on an end surface thereof having the minimum diameter, and thus a circuit pattern connected to the via is finely formed, resulting in the high-density circuit pattern. Thus, a compact printed circuit board having a reduced number of layers is realized.
摘要翻译： 本发明公开了一种印刷电路板，其包括无轨道通孔和制造印刷电路板的方法。 印刷电路板包括没有上部焊盘的无地通孔。 通孔包括具有小于通孔的最小直径的线宽的电路图案。 通孔在其端面上没有具有最小直径的上部焊盘，因此与通孔连接的电路图案被精细地形成，导致高密度电路图案。 因此，实现了层数减少的紧凑型印刷电路板。
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公开(公告)号：US20090236141A1
公开(公告)日：2009-09-24
申请号：US12285133
申请日：2008-09-29
申请人： Han Kim , Mi-Ja Han , Hyo-Jic Jung
发明人： Han Kim , Mi-Ja Han , Hyo-Jic Jung
IPC分类号： H05K1/02
CPC分类号： H01P1/2005 , H01L2224/16 , H01P1/203 , H05K1/0236 , H05K1/0237 , H05K2201/09309 , H05K2201/09518 , H05K2201/096 , H05K2201/09627 , H05K2201/09663 , H05K2201/09681
摘要： According to an embodiment of the present invention, an electromagnetic bandgap structure can include: at least three conductive plates; a first stitching via, configured to electrically connect any one of the conductive plates to another conductive plate; and a second stitching via, configured to electrically connect the one conductive plate to yet another conductive plate. In the electromagnetic bandgap structure of the present invetion, the first stitching via can electrically connect the one conductive plate to another conductive plate by allowing a part of the first stitching via to be connected through a planar surface above the one conductive plate, and the second stitching via can electrically connect the one conductive plate to yet another conductive plate by allowing a part of the second stitching via to be connected through a planar surface below the one conductive plate.
摘要翻译： 根据本发明的实施例，电磁带隙结构可以包括：至少三个导电板; 第一缝合通孔，被配置为将任一导电板电连接到另一个导电板; 以及第二缝合通孔，其被配置为将所述一个导电板电连接到另一个导电板。 在本发明的电磁带隙结构中，第一缝合通孔可以通过允许第一缝合通孔的一部分通过一个导电板上的平面连接而将一个导电板电连接到另一个导电板， 缝合通孔可以通过允许第二缝合通孔的一部分通过一个导电板下面的平坦表面连接而将一个导电板电连接到另一个导电板。
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公开(公告)号：US20090145646A1
公开(公告)日：2009-06-11
申请号：US12230871
申请日：2008-09-05
申请人： Mi-Ja Han , Dae-Hyun Park , Han Kim
发明人： Mi-Ja Han , Dae-Hyun Park , Han Kim
CPC分类号： H01P1/20327 , H01L2224/16225 , H01P1/2005 , H05K1/0236 , H05K2201/09309 , H05K2201/09663 , H05K2201/09681
摘要： According to the present invention, the board can include a dielectric layer; a plurality of conductive plates; and a stitching via, to electrically connect two of the conductive plates to each other. Here, the stitching via can include a first via and a second via, respectively, passing through the dielectric layer and having one end part being placed on a same planar surface as each of the two conductive plates; a connection pattern, having each end part being connected to the other end part of the first via and the second via, respectively; and a first extension pattern, placed on the same planar surface as one of the conductive plates and having one end part being connected to the one end part of the first via and the end part being connected to one of the conductive plates.
摘要翻译： 根据本发明，电路板可以包括电介质层; 多个导电板; 以及缝合通孔，以将两个导电板彼此电连接。 这里，缝合通孔可以分别包括通过电介质层的第一通孔和第二通孔，并且具有一个端部与两个导电板中的每一个放置在同一平面上; 连接图案，其每个端部分别连接到第一通孔和第二通孔的另一端部; 和第一延伸图案，其放置在与导电板之一相同的平面上，并且具有一个端部连接到第一通孔的一个端部，并且端部连接到导电板之一。
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14.发明申请Cavity capacitor fabrication method and printed circuit board having embedded cavity capacitor 审中-公开腔电容器制造方法和具有嵌入式腔体电容器的印刷电路板公开(公告)号：US20090084591A1
公开(公告)日：2009-04-02
申请号：US12007369
申请日：2008-01-09
申请人： Han Kim , Je-Gwang Yoo , Chang-Sup Ryu
发明人： Han Kim , Je-Gwang Yoo , Chang-Sup Ryu
CPC分类号： H05K1/162 , H05K3/0035 , H05K3/4069 , H05K3/4602 , H05K2201/0187 , H05K2201/0394 , H05K2201/09509 , H05K2201/09563 , Y10T29/435 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： A cavity capacitor fabrication method and a printed circuit board having an embedded cavity capacitor are disclosed. In accordance with an embodiment of the present invention, the printed circuit board having the embedded cavity capacitor includes two conductive layers to be used as a power layer and a ground layer, respectively; and a first dielectric layer, placed between the two conductive layers, wherein the cavity capacitor is placed between the two conductive layers, the cavity capacitor being formed to allow a second dielectric layer to have a lower stepped portion than the first dielectric layer, and the second dielectric layer using the two conductive layers as a first electrode and a second electrode, respectively, and placed between the first electrode and the second electrode.
摘要翻译： 公开了一种空腔电容器制造方法和具有嵌入式空腔电容器的印刷电路板。 根据本发明的实施例，具有嵌入式空腔电容器的印刷电路板分别包括用作功率层和接地层的两个导电层; 以及放置在所述两个导电层之间的第一电介质层，其中所述空腔电容器被放置在所述两个导电层之间，所述空腔电容器被形成为允许第二电介质层具有比所述第一电介质层更低的台阶部分， 第二电介质层，分别使用两个导电层作为第一电极和第二电极，并且放置在第一电极和第二电极之间。
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15.发明申请Electromagnetic bandgap structure and printed circuit board including multi-via 有权电磁带隙结构和印刷电路板，包括多通孔公开(公告)号：US20090071709A1
公开(公告)日：2009-03-19
申请号：US12076650
申请日：2008-03-20
IPC分类号： H05K1/02
CPC分类号： H05K1/0236 , H05K2201/09309 , H05K2201/09627 , H05K2201/09663
摘要： An electromagnetic bandgap structure and a printed circuit board that intercepts to transfer a signal having a predetermined frequency band are disclosed. In particularly, the electromagnetic bandgap structure includes a first metal layer and a second metal layer; a metal plate, placed between the first metal layer and a second metal layer; a multi-via, penetrating the first metal layer, passing through the same planar surface as an outer metal layer and turning toward the first metal layer to connect the metal plate and the first metal layer; and a dielectric layer, stacked in between the first metal layer and the metal plate, between the metal plate and the second metal layer and between the first metal layer and the outer metal layer. With the present invention, a bandgap frequency can be decreased without increasing the size of the metal plate.
摘要翻译： 公开了一种电磁带隙结构和用于传送具有预定频带的信号的印刷电路板。 特别地，电磁带隙结构包括第一金属层和第二金属层; 金属板，放置在第一金属层和第二金属层之间; 穿过第一金属层的多通孔，穿过与外部金属层相同的平面，并朝着第一金属层转动以连接金属板和第一金属层; 以及电介质层，层叠在所述第一金属层和所述金属板之间，所述金属板与所述第二金属层之间以及所述第一金属层与所述外部金属层之间。 通过本发明，可以在不增加金属板的尺寸的情况下降低带隙频率。
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公开(公告)号：US20070096684A1
公开(公告)日：2007-05-03
申请号：US11262207
申请日：2005-10-28
申请人： Han Kim
发明人： Han Kim
IPC分类号： H02J7/00
摘要： A control system providing more stable operation of an electric vehicle. From when the ignition switch is turned on to when the power ratchet period is completed, because the reset signal in the state of active “low” is supplied only once, communications between the MCU and apparatuses connected to the MCU can be stable. In addition, because the reset signal in the state of active “low” is not generated even though the ignition switch is turned on during the power ratchet period after the ignition switch is turned off, unnecessary booting does not occur. Therefore, a malfunction between the MCU and a battery management system can be prevented.
摘要翻译： 一种提供电动车辆更稳定运行的控制系统。 从点火开关接通到电源棘轮时间段结束时，由于在“低”状态下的复位信号仅供给一次，MCU与MCU连接的设备之间的通信稳定。 此外，由于即使在点火开关关闭之后的动力棘轮期间点火开关接通时，也不产生处于“低”状态的复位信号，因此不会发生不必要的启动。 因此，可以防止MCU与电池管理系统之间的故障。
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公开(公告)号：US20060257569A1
公开(公告)日：2006-11-16
申请号：US11433176
申请日：2006-05-12
申请人： Han Kim , Myoung Kim , Myung Huh , Seok Jeong , Hee Kang
发明人： Han Kim , Myoung Kim , Myung Huh , Seok Jeong , Hee Kang
IPC分类号： C23C16/00
摘要： A method for in-situ polycrystalline thin film growth is provided. A catalyst enhanced chemical vapor deposition (CECVD) apparatus is used to grow the polycrystalline silicon thin film. No subsequent annealing or dehydrogenating process is needed. The method comprises exhausting a chamber to form a vacuum chamber, and then purging vacuum chamber and introducing a catalyst. A substrate is then placed in the vacuum chamber and reaction gas is injected into the chamber. The reaction gas reacts with the catalyst in the chamber to grow a polycrystalline thin film on the substrate. The inventive method reduces processing time and production cost and can be used to fabricate larger devices due to the elimination of bulky annealing equipment.
摘要翻译： 提供了一种原位多晶薄膜生长的方法。 使用催化剂增强化学气相沉积（CECVD）装置来生长多晶硅薄膜。 不需要随后的退火或脱氢过程。 该方法包括排空室以形成真空室，然后净化真空室并引入催化剂。 然后将基板放置在真空室中，并将反应气体注入室中。 反应气体与室中的催化剂反应，以在衬底上生长多晶薄膜。 本发明的方法减少了处理时间和生产成本，并且由于消除了大型退火设备而可用于制造更大的装置。
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公开(公告)号：US20060146484A1
公开(公告)日：2006-07-06
申请号：US11222398
申请日：2005-09-07
IPC分类号： H02B1/00
CPC分类号： H05K1/0219 , H05K2201/09618
摘要： A high frequency signal transmission line having reduced noise. Particularly, a signal transmission line of the current invention has reduced radiation noise and reflection noise, because a conventional ground guard fence line disposed between signal lines is separated into a plurality of ground line blocks that are spaced apart from each other to shield against noise.
摘要翻译： 具有降低噪声的高频信号传输线。 特别地，本发明的信号传输线由于将设置在信号线之间的传统的接地保护栅栏线分离成彼此间隔开的多个接地线块以防止噪声，所以本发明的信号传输线具有降低的辐射噪声和反射噪声。
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公开(公告)号：US20050139390A1
公开(公告)日：2005-06-30
申请号：US10875916
申请日：2004-06-23
申请人： Han Kim , Bong-Kyu Choi , Dae-Cheol Seo , Heung-Kyu Kim , Sang-Kab Park
发明人： Han Kim , Bong-Kyu Choi , Dae-Cheol Seo , Heung-Kyu Kim , Sang-Kab Park
CPC分类号： H05K1/115 , H01L23/49827 , H01L23/49833 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/01068 , H01L2924/01078 , H01L2924/09701 , H01L2924/15311 , H05K3/4602 , H05K2201/09836 , H01L2924/00
摘要： Disclosed herein is a via structure that minimizes high frequency loss. A PCB or an IC package of the present invention includes an insulation layer, a plurality of circuit layers, and one or more vias obliquely formed with respect to the circuit layers and constructed to have obtuse angles with respect to the directions of signal and power transmission.
摘要翻译： 本文公开了一种使高频损耗最小化的通孔结构。 本发明的PCB或IC封装包括绝缘层，多个电路层以及相对于电路层倾斜地形成的一个或多个通孔，并被构造成相对于信号和电力传输的方向具有钝角 。
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20.发明授权Apparatus for manufacturing diamond film having a large area and method thereof 失效具有大面积的金刚石膜的制造装置及其方法
公开(公告)号：US6063455A
公开(公告)日：2000-05-16
申请号：US731059
申请日：1996-10-09
申请人： Hyo Soo Jeong , Han Kim , Jung Ok Choi , Moung Jae Kim
发明人： Hyo Soo Jeong , Han Kim , Jung Ok Choi , Moung Jae Kim
CPC分类号： C23C14/0611 , C23C14/28
摘要： The present invention relates to an apparatus for manufacturing a diamond film having a large area which is used for a field emission display (FED) and a manufacturing method thereof.The apparatus for manufacturing a diamond film having a large area according to the present invention comprises a pulse laser generating system for generating a pulse laser beam, a laser beam scanner for scanning said pulse laser beam, and a vacuum chamber which includes a target and a substrate holder, wherein said laser beam having passed said laser beam scanner is irradiated on said target, and wherein a substrate on which a diamond film is to be formed by a plume produced from said target is set up to said substrate holder. The diamond film according to the present invention has a uniform electrical and mechanical properties and can be obtained in a short time period and with a uniform width and a large area. The diamond film manufactured according to the present invention can be also used for manufacturing emitters for FED having a large area and can increase the efficiency of the target because of the possibility of using the overall area thereof.
摘要翻译： 本发明涉及用于场发射显示（FED）的面积大的金刚石膜的制造装置及其制造方法。 根据本发明的用于制造具有大面积的金刚石膜的设备包括用于产生脉冲激光束的脉冲激光产生系统，用于扫描所述脉冲激光束的激光束扫描器和包括靶和 衬底保持器，其中通过所述激光束扫描器的所述激光束被照射在所述靶上，并且其中将由所述靶产生的羽流形成金刚石膜的衬底设置到所述衬底保持器。 根据本发明的金刚石膜具有均匀的电气和机械性能，并且可以在短时间内获得并且具有均匀的宽度和大的面积。 根据本发明制造的金刚石膜也可用于制造具有大面积的FED的发射体，并且由于可能使用其整个面积而能够提高靶的效率。
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