摘要:
There is provided a substrate processing method and apparatus which can measure and monitor the thickness and/or properties of a film formed on a substrate as needed, and quickly correct a deviation in the process conditions, and which can therefore stably provide a product of constant quality. A substrate processing method for processing a substrate with a metal and an insulating material exposed on its surface in such a manner that the film thickness of the metal portion with the exposed surface of the metal as a reference plane is selectively or preferentially changed, including measuring a change in the film thickness and/or a film property of the metal portion during and/or immediately after processing, and monitoring the processing and adjusting the processing conditions based on the results of measurement.
摘要:
An acid solution is continuously supplied to a central portion of a surface of a substrate while the substrate is rotating, and an oxidizing agent solution is continuously or intermittently supplied to a periphery of the substrate. In addition, an oxidizing agent solution and an acid solution are simultaneously or alternately supplied to a reverse side of the substrate.
摘要:
An exhaust apparatus in an ion implantation system for implanting impurities into a target substrate is used for evacuating an ion source chamber. The exhaust apparatus comprises at least one vacuum pump which does not use working oil for evacuating the ion source chamber, an atmospheric exhaust pipe connected to the vacuum pump for exhausting gas from the vacuum pump; and a device for introducing inert gas into at least one of the vacuum pump and the atmospheric exhaust pipe. The exhaust apparatus includes at least two vacuum pumps comprising a turbomolecular pump and a dry pump.
摘要:
A substrate processing method includes covering, in advance, the surface of a substrate with water, holding the substrate generally horizontally with the surface facing upward and rotating it in a horizontal plane, and blowing to the substrate top surface drying gas flow that is thin in area in comparison with the substrate surface, in which the water is removed from the substrate top surface by the rotation in the horizontal plane while blowing the drying gas flow, a substrate processing apparatus for implementing the above method, and a control program for use with the above method and apparatus.
摘要:
A solution containing a metal component of composite ultrafine metal particles each having a core substantially made of metal component and a covering layer made of an organic compound chemically bonded to the core having an average diameter ranging from 1 to 10 nm, uniformly dispersed in a solvent, forms a thin metal film on the surface of a transfer sheet, after which the transfer sheet is thermally decomposed to transfer the thin metal film to a substrate.
摘要:
A polishing method polishes a substrate so as to remove an interconnect metal film and a barrier film formed on portions other than interconnect recesses. The method includes performing a first polishing process of polishing a surface of the substrate After performing the first polishing process, the surface of the substrate is cleaned. After cleaning, a second polishing process is performed for further polishing the surface of the substrate. At least one of performing the first polishing process and performing the second polishing process includes performing electrolytic polishing.
摘要:
A substrate processing method can securely form a metal film by electroless plating on an exposed surface of a base metal, such as interconnects, with increased throughput and without the formation of voids in the base metal. The substrate processing method includes: cleaning a surface of a substrate having a base metal formed in the surface with a cleaning solution comprising an aqueous solution of a carboxyl group-containing organic acid or its salt and a surfactant as an additive; bringing the surface of the substrate after the cleaning into contact with a processing solution comprising a mixture of the cleaning solution and a solution containing a catalyst metal ion, thereby applying the catalyst to the surface of the substrate; and forming a metal film by electroless plating on the catalyst-applied surface of the substrate.
摘要:
A substrate wet-processing method can carry out uniform chemical processing of the surface of a substrate while easily preventing a gas from remaining on the surface of the substrate and preventing difference in the concentration and the temperature of a chemical solution between the end portion and the central portion of the substrate. The substrate wet-processing method includes: providing an acidic solution whose concentration is previously adjusted within a predetermined concentration range; continuously spraying the acidic solution having the adjusted concentration toward a substrate at a predetermined pressure to bring it into contact with a surface of the substrate; and then forming a film of an insulating material, a metal or an alloy on the exposed surface of a metal formed in the surface of the substrate.
摘要:
A reaction probe chip which is prepared by loading a reactive probe on fine pieces of carrier such as particles, tile-like plates and then arraying and immobilizing the reactive probe-loaded carrier on a base material. The carrier fine pieces such as particles, tile-like plates and the like are porous or have a reactive surface, and the base material is preferably a thin inorganic plate or a thin organic plate is disclosed.The inorganic base material is preferably a glass slide or silicon wafer, and the organic base material is preferably a polyester film or polyethylene film. In case the porous carrier pieces are used, the reactivity of the inner surfaces of the porous carrier pores should be maintained during array or immobilization process of the reactive probe-loaded carrier.A composite substrate characterized in that on at least a section of the surface thereof, a plurality of porous regions are orderly arranged as compartments by non-porous regions, or a plurality of non-porous regions are orderly arranged as compartments by porous regions is also disclosed. The porous solid is preferably porous glass or porous ceramic, the porous glass is preferably split-phase porous glass, and the surface is preferably flattened by a process such as polishing.
摘要:
The present invention relates to composite metallic ultrafine particles which have excellent dispersion stability and can be produced on an industrial scale, and a process for producing the same, and a method and an apparatus for forming an interconnection with use of the same. A surface of a core metal produced from a metallic salt, a metallic oxide, or a metallic hydroxide and having a particle diameter of 1 to 100 nm is covered with an organic compound including a functional group having chemisorption capability onto the surface of the core metal.