公开(公告)号：US07712212B2

公开(公告)日：2010-05-11

申请号：US11522961

申请日：2006-09-19

申请人： Motoo Asai ,  Yasuji Hiramatsu

发明人： Motoo Asai ,  Yasuji Hiramatsu

IPC分类号： H01K3/10

CPC分类号： H05K3/108 ,  H05K1/0269 ,  H05K3/067 ,  H05K3/244 ,  H05K3/3452 ,  H05K3/382 ,  H05K3/384 ,  H05K3/4661 ,  H05K2201/0989 ,  H05K2201/09918 ,  H05K2203/0307 ,  H05K2203/072 ,  Y10S428/901 ,  Y10T29/49002 ,  Y10T29/49156 ,  Y10T29/49167 ,  Y10T156/1056 ,  Y10T428/24917

摘要： A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.

摘要翻译： 印刷电路板是通过在基板的导体电路上层叠层间绝缘层而形成的，其中导体电路由无电解电镀膜和电解电镀膜构成，并且在至少一部分上形成有粗糙层 导体电路的表面。

公开(公告)号：US06835895B1

公开(公告)日：2004-12-28

申请号：US09319258

申请日：1999-06-11

申请人： Motoo Asai ,  Yasuji Hiramatsu

发明人： Motoo Asai ,  Yasuji Hiramatsu

IPC分类号： H05K103

CPC分类号： H05K3/108 ,  H05K1/0269 ,  H05K3/067 ,  H05K3/244 ,  H05K3/3452 ,  H05K3/382 ,  H05K3/384 ,  H05K3/4661 ,  H05K2201/0989 ,  H05K2201/09918 ,  H05K2203/0307 ,  H05K2203/072 ,  Y10S428/901 ,  Y10T29/49002 ,  Y10T29/49156 ,  Y10T29/49167 ,  Y10T156/1056 ,  Y10T428/24917

摘要： A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.

摘要翻译： 印刷电路板是通过在基板的导体电路上层叠层间绝缘层而形成的，其中导体电路由无电解电镀膜和电解电镀膜构成，并且在至少一部分上形成有粗糙层 导体电路的表面。

公开(公告)号：US07375289B2

公开(公告)日：2008-05-20

申请号：US11331268

申请日：2006-01-13

申请人： Yasuji Hiramatsu ,  Motoo Asai ,  Naohiro Hirose ,  Takashi Kariya

发明人： Yasuji Hiramatsu ,  Motoo Asai ,  Naohiro Hirose ,  Takashi Kariya

IPC分类号： H05K1/11 ,  H01R12/04

CPC分类号： H05K3/4679 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/0082 ,  H05K3/421 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/0554 ,  Y10S430/146 ,  Y10T29/49004 ,  Y10T29/49082 ,  Y10T29/49085 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A multi-layer printed wiring board includes a board covered with a conductor layer, an interlayer insulating resin layer, an etched metal film on the interlayer insulating resin layer, and a via hole. The interlayer insulating resin layer has a fibrous substrate. The via hole has an electrolytic plated film and an electrolessly plated film and connects the conductor layer of the board and the etched metal film.

摘要翻译： 多层印刷电路板包括覆盖有导体层的基板，层间绝缘树脂层，层间绝缘树脂层上的蚀刻金属膜和通孔。 层间绝缘树脂层具有纤维基材。 通孔具有电解电镀膜和无电镀膜，并且连接板的导体层和蚀刻的金属膜。

公开(公告)号：US07615162B2

公开(公告)日：2009-11-10

申请号：US11522960

申请日：2006-09-19

申请人： Motoo Asai ,  Yasuji Hiramatsu ,  Yoshinori Wakihara ,  Kazuhito Yamada

发明人： Motoo Asai ,  Yasuji Hiramatsu ,  Yoshinori Wakihara ,  Kazuhito Yamada

IPC分类号： H01B13/00

CPC分类号： H05K3/108 ,  H05K1/0269 ,  H05K3/067 ,  H05K3/244 ,  H05K3/3452 ,  H05K3/382 ,  H05K3/384 ,  H05K3/4661 ,  H05K2201/0989 ,  H05K2201/09918 ,  H05K2203/0307 ,  H05K2203/072 ,  Y10S428/901 ,  Y10T29/49002 ,  Y10T29/49156 ,  Y10T29/49167 ,  Y10T156/1056 ,  Y10T428/24917

摘要： A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.

公开(公告)号：US20070051695A1

公开(公告)日：2007-03-08

申请号：US11522961

申请日：2006-09-19

申请人： Motoo Asai ,  Yasuji Hiramatsu

发明人： Motoo Asai ,  Yasuji Hiramatsu

IPC分类号： H01B13/00

CPC分类号： H05K3/108 ,  H05K1/0269 ,  H05K3/067 ,  H05K3/244 ,  H05K3/3452 ,  H05K3/382 ,  H05K3/384 ,  H05K3/4661 ,  H05K2201/0989 ,  H05K2201/09918 ,  H05K2203/0307 ,  H05K2203/072 ,  Y10S428/901 ,  Y10T29/49002 ,  Y10T29/49156 ,  Y10T29/49167 ,  Y10T156/1056 ,  Y10T428/24917

摘要： A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.

公开(公告)号：US20070051694A1

公开(公告)日：2007-03-08

申请号：US11522960

申请日：2006-09-19

申请人： Motoo Asai ,  Yasuji Hiramatsu ,  Yoshinori Wakihara ,  Kazuhito Yamada

发明人： Motoo Asai ,  Yasuji Hiramatsu ,  Yoshinori Wakihara ,  Kazuhito Yamada

IPC分类号： H01B13/00

CPC分类号： H05K3/108 ,  H05K1/0269 ,  H05K3/067 ,  H05K3/244 ,  H05K3/3452 ,  H05K3/382 ,  H05K3/384 ,  H05K3/4661 ,  H05K2201/0989 ,  H05K2201/09918 ,  H05K2203/0307 ,  H05K2203/072 ,  Y10S428/901 ,  Y10T29/49002 ,  Y10T29/49156 ,  Y10T29/49167 ,  Y10T156/1056 ,  Y10T428/24917

摘要： A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.

公开(公告)号：US06609297B1

公开(公告)日：2003-08-26

申请号：US09581298

申请日：2000-06-12

申请人： Yasuji Hiramatsu ,  Motoo Asai ,  Naohiro Hirose ,  Takashi Kariya

发明人： Yasuji Hiramatsu ,  Motoo Asai ,  Naohiro Hirose ,  Takashi Kariya

IPC分类号： H01K310

CPC分类号： H05K3/4679 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/0082 ,  H05K3/421 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/0554 ,  Y10S430/146 ,  Y10T29/49004 ,  Y10T29/49082 ,  Y10T29/49085 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A board 20 is provided with a Cu film 30 as a conformal mask, in which are formed a register mark 30b and an opening 3a through which a via hole is formed. A camera senses this register mark 30b so that the position of the board 30 is determined. A laser beam is directed to the approximate position of the opening 30a, so that the opening 26a through which the via hole is drilled is formed. The accuracy of the position of the opening of the via hole depends on the accuracy of the position of the opening 30a in the Cu film 30 as the conformal mask. Therefore, the via hole can be formed at an adequate position despite the low accuracy of the position for laser irradiation.

摘要翻译： 板20设置有作为保形掩模的Cu膜30，其中形成有对准标记30b和形成通孔的开口3a。 摄像机感测该对准标记30b，从而确定板30的位置。 激光束被引导到开口30a的近似位置，从而形成通孔穿过的开口26a。 通孔的开口的位置的精度取决于作为保形掩模的Cu膜30中的开口30a的位置的精度。 因此，尽管激光照射位置的精度低，但是通孔可以形成在适当的位置。

公开(公告)号：US6010768A

公开(公告)日：2000-01-04

申请号：US854683

申请日：1997-05-12

申请人： Toshihiko Yasue ,  Yasuji Hiramatsu ,  Hideki Yano ,  Yoshifumi Ishitani ,  Yoichiro Kawamura ,  Hideki Murase ,  Ayumi Suzuki ,  Masato Kawade ,  Motoo Asai

发明人： Toshihiko Yasue ,  Yasuji Hiramatsu ,  Hideki Yano ,  Yoshifumi Ishitani ,  Yoichiro Kawamura ,  Hideki Murase ,  Ayumi Suzuki ,  Masato Kawade ,  Motoo Asai

IPC分类号： H05K3/00 ,  H05K3/38 ,  H05K3/46 ,  B32B3/00

CPC分类号： H05K3/4661 ,  H05K3/0094 ,  H05K3/4602 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09881 ,  H05K2203/0773 ,  H05K3/382 ,  H05K3/384 ,  Y10S428/901 ,  Y10T428/24893 ,  Y10T428/24917 ,  Y10T428/252

摘要： It is to provide a multilayer printed circuit board having excellent resolution, interlaminar insulation property and resistance to cool-heat shock without forming unevenness on the surface and lowering peel strength even if the thickness of the resin insulating layer is thin. The invention proposes a multilayer printed circuit board comprising an upper conductor circuit layer, a lower conductor circuit layer and a resin insulating layer electrically insulating both the conductor circuit layers, in which the resin insulating layer is a composite layer comprised of an layer made from a heat-resistant resin hardly soluble in acid or oxidizing agent as a lower layer and an adhesive layer for electroless plating made from a heat-resistant resin as an upper layer, and if necessary, a resin is filled in a concave portion created between conductor insulating circuits of the lower layer so as to render the surface into the same plane as the surface of the conductor circuit.

摘要翻译： 提供一种具有优异的分辨率，层间绝缘性和耐冷热冲击性的多层印刷电路板，而不会在表面上形成不均匀性，并且即使树脂绝缘层的厚度薄，也降低剥离强度。 本发明提出了一种多层印刷电路板，包括上导体电路层，下导体电路层和电绝缘两个导体电路层的树脂绝缘层，其中树脂绝缘层是由由 耐热树脂难溶于作为下层的酸或氧化剂以及由耐热树脂作为上层制成的用于化学镀的粘合剂层，如果需要，树脂填充在导体绝缘 电路，以使表面进入与导体电路的表面相同的平面。

公开(公告)号：US07462802B2

公开(公告)日：2008-12-09

申请号：US11356259

申请日：2006-02-17

申请人： Yasuji Hiramatsu

发明人： Yasuji Hiramatsu

IPC分类号： B23K26/38 ,  B23K26/03

CPC分类号： B23K26/066 ,  B23K26/03 ,  B23K26/032 ,  B23K26/04 ,  B23K26/0622 ,  B23K26/064 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/0665 ,  B23K26/067 ,  B23K26/0673 ,  B23K26/08 ,  B23K26/082 ,  B23K26/0853 ,  B23K26/382 ,  B23K26/389 ,  B23K26/40 ,  B23K2101/42 ,  B23K2103/16 ,  B23K2103/42 ,  B23K2103/50 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0026 ,  H05K3/0035 ,  H05K3/4644 ,  H05K3/4679 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/10113

摘要： There is provided a laser processing apparatus, a multilayer printed wiring board manufacturing apparatus, and a manufacturing method to form via holes of ultra-fine diameter. The laser beam from the CO2 laser oscillator (60) is converted to the shortened wavelength beam by a tellurium crystal (94) to control diffraction of the laser beam. Simultaneously, when the laser beam is condensed, a limit value of the condensation limit is reduced. Thereby, the spot diameter of laser beam is reduced and a hole for via hole is bored on the interlayer insulation resin on a substrate (10). Therefore, even when the laser beam output is raised to form a deeper hole, the hole diameter is not widened and thereby a hole for a small diameter via hole can be formed.

公开(公告)号：US07078655B1

公开(公告)日：2006-07-18

申请号：US10048490

申请日：2000-02-18

申请人： Yasutaka Ito ,  Yasuji Hiramatsu

发明人： Yasutaka Ito ,  Yasuji Hiramatsu

IPC分类号： H05B3/68

CPC分类号： H01L21/6835 ,  C04B35/00 ,  C04B35/581 ,  H01L21/6833 ,  H01L2924/30105

摘要： A ceramic substrate for semiconductor manufacture and/or inspection which is conducive to decrease in α-rays radiated to prevent electrical errors, and to decrease an electrostatic chucking force such as heater or wafer prober, generation of particles, and circuit defects. The ceramic substrate is configured such that the level of α-rays radiated from the surface of the ceramic substrate is not higher than 0.250 c/cm2.hr.

摘要翻译： 一种用于半导体制造和/或检查的陶瓷衬底，其有助于减少辐射的α射线以防止电气错误，并且减少诸如加热器或晶片探针的静电吸附力，产生颗粒和电路缺陷。 陶瓷基板被配置为使得从陶瓷基板的表面辐射的α射线的电平不高于0.250c / cm 2·hr。