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    LIGHT-EMITTING DEVICE
    11.
    发明申请
    LIGHT-EMITTING DEVICE 审中-公开

    公开(公告)号：US20180315896A1

    公开(公告)日：2018-11-01

    申请号：US15962876

    申请日：2018-04-25

    Applicant: NICHIA CORPORATION

    Inventor： Takuya NAKABAYASHI ,  Tomokazu MARUYAMA ,  Tetsuya ISHIKAWA

    IPC: H01L33/48 ,  H01L33/60 ,  H01L33/62

    Abstract: A light-emitting device includes, a substrate, a plurality of light-emitting elements aligned along a longitudinal direction, and a covering member. The substrate includes a pair of first depressed portions and a second depressed portion each opening on a back surface and a bottom surface of a base and positioned on both end sides of the base in the longitudinal direction. The second depressed portion has a width larger than a width of the first depressed portions as measured along a height direction. First metal films extend from inside the first depressed portions to the back surface. A second metal film extends from inside the second depressed portion to the back surface. A solder mask covers at least a part of each of the first metal films and at least a part of the second metal film on the back surface of the base.

    LIGHT EMITTING DEVICE
    12.
    发明申请
    LIGHT EMITTING DEVICE 审中-公开

    公开(公告)号：US20180261745A1

    公开(公告)日：2018-09-13

    申请号：US15975121

    申请日：2018-05-09

    Applicant: NICHIA CORPORATION

    Inventor： Takuya NAKABAYASHI ,  Akira HORI

    IPC: H01L33/64 ,  H01L33/56 ,  H01L33/32 ,  H01L33/62 ,  H01L33/60 ,  H01L33/50

    CPC classification number: H01L33/647 ,  H01L25/0753 ,  H01L33/32 ,  H01L33/486 ,  H01L33/502 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/16225

    Abstract: A light emitting device includes a substrate, light emitting elements, a sealing member, a light transmissive member and a heat dissipation terminal. The sealing member is in contact with at least a part of a side surface of each of the light emitting elements, is formed substantially in the same plane as the substrate, and a width of the sealing member between adjacent ones of the light emitting elements is larger than a width of the sealing member on an outside of an outermost one of the light emitting elements. The light transmissive member covers upper surfaces of the light emitting elements and a part of an upper surface of the sealing member, side surfaces of the light transmissive member being covered with the sealing member. The heat dissipation terminal is arranged generally in the center on a second main surface of the substrate and has a recess portion.

    LIGHT-EMITTING DEVICE
    15.
    发明申请
    LIGHT-EMITTING DEVICE 有权
    发光装置

    公开(公告)号：US20160095184A1

    公开(公告)日：2016-03-31

    申请号：US14870007

    申请日：2015-09-30

    Applicant: NICHIA CORPORATION

    Inventor： Takuya NAKABAYASHI ,  Hiroto TAMAKI

    IPC: H05B33/22 ,  F21V13/08

    CPC classification number: H05B33/22 ,  F21V13/08 ,  H01L33/20 ,  H01L33/486 ,  H01L33/504 ,  H01L33/505 ,  H01L33/60 ,  H01L2924/18161

    Abstract: A light-emitting device includes a base, a light-emitting element, a wavelength conversion member, and a light reflecting member. The base has a base upper surface. The light-emitting element is provided on the base and includes a semiconductor layer, a light transmissive substrate, and a recess. The semiconductor layer is provided on the base so that a semiconductor lower surface faces the base upper surface of the base. The light transmissive substrate has a substrate upper surface, a substrate lower surface opposite to the substrate upper surface, and a substrate side surface between the substrate upper surface and the substrate lower surface. The light transmissive substrate is provided on the semiconductor layer so that the substrate lower surface contacts a semiconductor upper surface of the semiconductor layer. The recess is provided on the substrate upper surface of the light transmissive substrate. The wavelength conversion member is provided in the recess.

    Abstract translation: 发光装置包括基座，发光元件，波长转换构件和光反射构件。 基座具有基座上表面。 发光元件设置在基底上，并且包括半导体层，透光基板和凹部。 半导体层设置在基底上，使得半导体下表面面向基底的基底上表面。 透光基板具有基板上表面，与基板上表面相对的基板下表面，以及基板上表面和基板下表面之间的基板侧面。 透光基板设置在半导体层上，使得基板下表面接触半导体层的半导体上表面。 凹部设置在透光基板的基板上表面上。 波长转换构件设置在凹部中。

    LIGHT EMITTING DEVICE AND METHOD FOR PRODUCING THE SAME
    16.
    发明申请
    LIGHT EMITTING DEVICE AND METHOD FOR PRODUCING THE SAME 有权
    发光装置及其制造方法

    公开(公告)号：US20160093780A1

    公开(公告)日：2016-03-31

    申请号：US14866317

    申请日：2015-09-25

    Applicant: Nichia Corporation

    Inventor： Suguru BEPPU ,  Yoichi BANDO ,  Hiroto TAMAKI ,  Takuya NAKABAYASHI

    IPC: H01L33/60 ,  H01L33/50

    CPC classification number: H01L33/60 ,  H01L33/50 ,  H01L2224/73253 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0058

    Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.

    Abstract translation: 发光器件包括半导体发光元件; 以及具有多层结构并覆盖半导体发光元件的侧面的光反射构件。 光反射构件包括：设置在内部半导体发光元件侧的第一层，第一层包括含有光反射物质的透光树脂，以及设置成与第一层的外侧接触的第二层 第二层包括含有比第一层低的含量的光反射物质的透光树脂。

    LIGHT EMITTING DEVICE
    17.
    发明申请
    LIGHT EMITTING DEVICE 有权
    发光装置

    公开(公告)号：US20150340569A1

    公开(公告)日：2015-11-26

    申请号：US14710723

    申请日：2015-05-13

    Applicant: NICHIA CORPORATION

    Inventor： Hiroto TAMAKI ,  Takuya NAKABAYASHI

    IPC: H01L33/48 ,  H01L33/60 ,  H01L33/50 ,  H01L33/62

    CPC classification number: H01L33/486 ,  H01L24/97 ,  H01L33/50 ,  H01L33/507 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225

    Abstract: A light emitting device has a base body equipped with a base material and a pair of connection terminals disposed from a first main face to a second main face that is on the opposite side from the first main face; a light emitting element connected to the connection terminals on the first main face; and a light reflecting member that covers the side faces of the light emitting element, the base material having a protruding component on the second main face, and the connection terminals being disposed on the first main face from the second main face on both sides of the protruding component, and being partly exposed from the light reflecting member on both sides of the first main face.

    Abstract translation: 发光装置具有配置有基材的基体和从第一主面到与第一主面相反的一侧的第二主面配置的一对连接端子， 连接到第一主面上的连接端子的发光元件; 以及覆盖发光元件的侧面的光反射部件，所述基材在所述第二主面上具有突出部，所述连接端子从所述第二主面的所述第二主面设置在所述第一主面上 并且在第一主面的两侧部分地从光反射部件露出。

    LEAD FRAME AND SEMICONDUCTOR DEVICE
    18.
    发明申请
    LEAD FRAME AND SEMICONDUCTOR DEVICE 有权
    引线框架和半导体器件

    公开(公告)号：US20140252582A1

    公开(公告)日：2014-09-11

    申请号：US14196805

    申请日：2014-03-04

    Applicant: NICHIA CORPORATION

    Inventor： Takuya NAKABAYASHI ,  Yoshitaka BANDO ,  Hiroto TAMAKI

    IPC: H01L23/495

    CPC classification number: H01L23/49503 ,  H01L23/49562 ,  H01L23/49582 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2924/00

    Abstract: A lead frame of high quality which can endure direct bonding to a semiconductor element, and a semiconductor device of high reliability which utilizing the lead frame. A lead frame includes a plurality of connected units, each unit including a pair of lead portions arranged spaced apart and opposite from each other, for mounting a semiconductor element and electrically connecting to a pair of electrodes of the semiconductor element respectively. The lead portions respectively include an element mounting region arranged on a surface thereof to mount the semiconductor element, and a groove extending from opposing end surfaces of each of the pair of lead portions, in a direction away from the end surfaces and bending in a surrounding manner along outer periphery of the element mounting region.

    Abstract translation: 可以承受与半导体元件的直接接合的高质量的引线框架，以及利用引线框架的高可靠性的半导体器件。 引线框架包括多个连接的单元，每个单元包括彼此间隔开并相对布置的一对引线部分，用于安装半导体元件并电连接到半导体元件的一对电极。 引线部分分别包括布置在其表面上以安装半导体元件的元件安装区域和从远离端面的方向从一对引线部分的每一个的相对端表面延伸的凹槽，并在周围 方式沿着元件安装区域的外周。

    PLANAR LIGHT SOURCE
    19.
    发明申请
    PLANAR LIGHT SOURCE 有权

    公开(公告)号：US20230013159A1

    公开(公告)日：2023-01-19

    申请号：US17864066

    申请日：2022-07-13

    Applicant: NICHIA CORPORATION

    Inventor： Satoshi YOSHINAGA ,  Takuya NAKABAYASHI ,  Yuki SHIBUTANI ,  Yoichi BANDO ,  Yasushi OKAMOTO

    IPC: F21V8/00

    Abstract: A planar light source includes: a light guide member, a light source including a light-emitting element and a first light adjustment member and being disposed in a first hole of the light guide member, a first light-transmissive member disposed in the first hole between a lateral surface of the light source and the light guide member and on the light source, and a second light adjustment member disposed on the first light-transmissive member. A transmittance of the first light-transmissive member is higher than a transmittance of the first light adjustment member and a transmittance of the second light adjustment member with respect to light emitted from the light source. The first light-transmissive member includes a first light-transmissive portion 1ocated between the first light adjustment member and the second light adjustment member, and a second light-transmissive portion 1ocated between the lateral surface of the light source and the light guide member.

    LIGHT EMITTING MODULE AND PLANAR LIGHT SOURCE
    20.
    发明申请
    LIGHT EMITTING MODULE AND PLANAR LIGHT SOURCE 有权

    公开(公告)号：US20220170611A1

    公开(公告)日：2022-06-02

    申请号：US17671897

    申请日：2022-02-15

    Applicant: NICHIA CORPORATION

    Inventor： Takuya NAKABAYASHI ,  Toru HASHIMOTO ,  Keiji EMURA

    IPC: F21V5/04

    Abstract: A light emitting module includes: a light guide member including: an emission region defined by a sectioning groove, a light source placement part located in the emission region, and a light adjusting hole that, in a schematic top view, is located between the sectioning groove and the light source placement part; and a light source disposed in the light source placement part. A refractive index of an inside of the light adjusting hole is lower than a refractive index of the light guide member. In the schematic top view, the light adjusting hole is positioned to intersect with a first straight line connecting a center of the light source and a farthest point in the sectioning groove, the farthest point being farthest from the center of the light source.

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