公开(公告)号：US5077248A

公开(公告)日：1991-12-31

申请号：US150613

申请日：1988-02-01

申请人： Masahide Ogawa ,  Teiji Sato ,  Masanori Tanaka ,  Noriyuki Takahashi

发明人： Masahide Ogawa ,  Teiji Sato ,  Masanori Tanaka ,  Noriyuki Takahashi

IPC分类号： B01J20/10 ,  C01B33/20 ,  C01B33/40 ,  C09K3/00

CPC分类号： C01B33/405

摘要： Synthetic stevensite composed of stevensite-type sodium magnesium phylosilicate of which metallic components consist essentially of magnesium, sodium and silicon. The synthetic stevensite is characterized by having an X-ray diffraction peak at a spacing of 16 to 26 .ANG. when treated with ethylene glycol. It can be produced by a process comprising hydrothermally treating an aqueous composition containing basic magnesium carbonate and a silica-sodium component selected from the group consisting of (i) sodium silicate, (ii) sodium silicate and amorphous silica, and (iii) amorphous silica and sodium silicate.

公开(公告)号：US4830843A

公开(公告)日：1989-05-16

申请号：US4215

申请日：1987-01-05

申请人： Kiochi Usui ,  Teiji Sato ,  Masanori Tanaka ,  Noriyuki Takahashi

发明人： Kiochi Usui ,  Teiji Sato ,  Masanori Tanaka ,  Noriyuki Takahashi

IPC分类号： A61K8/25 ,  A61Q19/00 ,  B01F17/00 ,  C01B33/22 ,  C02F1/28 ,  C11D3/12 ,  D21H17/68

CPC分类号： A61K8/25 ,  A61Q19/00 ,  B01F17/0007 ,  C01B33/22 ,  C02F1/281 ,  C11D3/1253 ,  D21H17/68

摘要： A synthetic lamellar magnesium phyllosilicate has as the main component a composition represented by the following formula:Mg.sub.3 Si.sub.4 O.sub.10 (OH).sub.2.nH.sub.2 O (1)wherein n is a number of up to 5, and has X-ray diffraction peaks at spacings of 4.5-4.6 .ANG., 2.5-2.6 .ANG. and 1.5-1.6 .ANG., wherein the lamination asymmetry index (Is) defined by the following formula:Is=tan .theta..sub.2 /tan .theta..sub.1 (2)wherein.theta..sub.1 stands for the angle formed by the peak perpendicular and the peak tangent on the small diffraction angle side in said X-ray diffraction peak at a spacing of 4.5-4.6 .ANG., and.theta..sub.2 stands for the angle formed by the peak perpendicular and the peak tangent on the large diffraction angle side in said X-ray diffraction peak,is at least 3.0, the BET specific surface area is at least 300 m.sup.2 /g and the Methylene Blue decolorizing power (JIS K-1470) is at least 100 ml/g. This synthetic lamellar magnesium phyllosilicate is prepared by a process comprising subjecting active silicic acid or active aluminosilicic acid and an oxide or hydroxide of magnesium or a compound capable of forming said oxide or hydroxide under reaction conditions to a hydrothermal treatment.

摘要翻译： 合成层状镁页硅酸盐作为主要组分，由下式表示的组成：Mg 3 Si 4 O 10（OH）2·nH 2 O（1）其中n是多至5个数，并且在间隔为4.5的情况下具有X射线衍射峰， 4.6 ANGSTROM，2.5-2.6 ANGSTROM和1.5-1.6 ANGSTROM，其中由下式定义的层压不对称指数（Is）：Is =tanθ2 /tanθ1（2）其中theta 1表示由峰形成的角度 垂直和在所述X射线衍射峰中的小衍射角侧的峰值切线，间隔为4.5-4.6安培角，θ2表示在大衍射角侧的峰垂直和峰切线形成的角度 所述X射线衍射峰为至少3.0，BET比表面积为至少300m 2 / g，亚甲基蓝脱色力（JIS K-1470）为至少100ml / g。 这种合成层状镁页硅酸盐通过包括在反应条件下进行水热处理的活性硅酸或活性铝硅酸和镁的氧化物或氢氧化物或能够形成所述氧化物或氢氧化物的化合物的方法制备。

公开(公告)号：US4784982A

公开(公告)日：1988-11-15

申请号：US160706

申请日：1988-02-26

申请人： Kouichi Usui ,  Masahide Ogawa ,  Osamu Okumura ,  Teiji Sato ,  Kouichi Yamada ,  Masanori Tanaka ,  Noriyuki Takahashi

发明人： Kouichi Usui ,  Masahide Ogawa ,  Osamu Okumura ,  Teiji Sato ,  Kouichi Yamada ,  Masanori Tanaka ,  Noriyuki Takahashi

IPC分类号： C01B33/20 ,  B01J20/10 ,  B01J20/16 ,  B01J20/32 ,  C01B33/26 ,  B01J20/04 ,  B01J20/08

CPC分类号： C01B33/26 ,  B01J20/16 ,  B01J20/3204 ,  B01J20/3236

摘要： Disclosed is a composite body comprising amorphous and porous silica or silica-alumina and a layer of an aluminum-containing phylosilicate formed on surfaces of primary particles of the silica or silica-alumina. This composite phylosilicate is obtained by reacting a water-soluble silicate, a water-soluble zinc salt or magnesium salt and a water-soluble aluminum salt or aluminate in an aqueous medium containing a sol or gel of silica or silica-alumina. This composite phylosilicate has a large specific surface area and a large pore volume and has both the properties of a solid acid and the properties of a solid base.

摘要翻译： 公开了一种复合体，其包含无定形和多孔二氧化硅或二氧化硅 - 氧化铝和在二氧化硅或二氧化硅 - 氧化铝的一次颗粒表面上形成的含铝硅酸盐硅酸盐层。 该复合硅酸硅酸盐通过使水溶性硅酸盐，水溶性锌盐或镁盐与水溶性铝盐或铝酸盐在含有二氧化硅或二氧化硅 - 氧化铝的溶胶或凝胶的水性介质中反应而获得。 该复合硅酸硅酸盐具有大的比表面积和较大的孔体积，并具有固体酸的性质和固体碱的性质。

公开(公告)号：US4152011A

公开(公告)日：1979-05-01

申请号：US839121

申请日：1977-10-03

申请人： Shoichi Sano ,  Noriyuki Takahashi ,  Goro Urushiyama ,  Seiji Kasai ,  Toshihiko Aoyama ,  Tokuro Takaoka

发明人： Shoichi Sano ,  Noriyuki Takahashi ,  Goro Urushiyama ,  Seiji Kasai ,  Toshihiko Aoyama ,  Tokuro Takaoka

IPC分类号： B60G11/64 ,  B60G7/04 ,  B60G17/02 ,  B60G21/04 ,  B60G21/055 ,  B60G11/18

CPC分类号： B60G21/0551 ,  B60G17/025 ,  B60G7/04

摘要： A device including a torsion bar rotatably mounted on the vehicle frame transversely thereof and a pair of rock arms extending integrally from the opposite ends of the torsion bar at right angles thereto and connected with a right and a left wheel, respectively. An abutment arm is fixed to the torsion bar at the middle thereof and engageable with a stop pad provided on the vehicle frame, when either or both of the wheels are moved down, to restrain further downward movement thereof. Thus, the spring rate of air springs associated with the respective wheels is in effect increased as the loads thereon are reduced, particularly in a lower load region.

摘要翻译： 一种装置，包括横向地可转动地安装在车架上的扭力杆，以及一对岩石臂，它们分别从扭力杆的相对端部与其直角地一体地延伸，并与左右车轮连接。 一个抵靠臂在其中间被固定到扭力杆上，当车轮中的任一个或两个都向下移动时，可以与设置在车架上的止动垫接合，以限制其进一步的向下运动。 因此，与相应车轮相关联的空气弹簧的弹簧速率实际上随着其上的负载而减小，特别是在较低负载区域中。

公开(公告)号：US4092017A

公开(公告)日：1978-05-30

申请号：US803286

申请日：1977-06-03

申请人： Goro Urushiyama ,  Noriyuki Takahashi

发明人： Goro Urushiyama ,  Noriyuki Takahashi

IPC分类号： B60G11/26 ,  F16F9/08

CPC分类号： B60G11/26 ,  F16F9/082 ,  B60G2206/4222

摘要： A diaphragm arranged in a rigid casing to define therein a chamber to be filled with a mass of gaseous spring medium and another chamber to be held under oil pressure load is normally bulged into the oil chamber and formed on both surfaces thereof with dense clusters of elastic piles or projections which are compressed against each other only when the diaphragm is displaced from its neutral position to the load side as the load is reduced. Such displacement of the diaphragm is resisted by the elastic projections so as to increase the spring constant of the device in the lower load region and, with the device, used as a spring for automotive suspension, the pitching and rolling movements of the vehicle body are minimized.

摘要翻译： 布置在刚性壳体中的膜片在其中限定有填充有大量气态弹簧介质的腔室和待保持在油压负载下的另一腔室通常凸起到油室中，并在其两个表面上形成致密的弹性簇 只有当负载减小时隔膜从其中立位置移动到负载侧时，彼此压缩的桩或突起。 膜片的这种位移被弹性突起抵抗，以便增加装置在较低载荷区域的弹簧常数，并且该装置用作用于汽车悬架的弹簧，车身的俯仰和滚动运动是 最小化。

公开(公告)号：US07847388B2

公开(公告)日：2010-12-07

申请号：US12537124

申请日：2009-08-06

申请人： Noriyuki Takahashi

发明人： Noriyuki Takahashi

IPC分类号： H01L23/02

CPC分类号： H01L21/78 ,  G01R1/0483 ,  G01R31/2863 ,  G01R31/2886 ,  H01L23/3114 ,  H01L23/3171 ,  H01L23/585 ,  H01L29/0657 ,  H01L2224/0401 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/13022 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/00 ,  H01L2224/05552

摘要： Chipping of semiconductor chips is to be prevented. A semiconductor device comprises a semiconductor chip having a main surface, a plurality of pads formed over the main surface, a rearrangement wiring formed over the main surface to alter an arrangement of the plurality of pads, and a protective film and an insulating film formed over the main surface, and a plurality of solder bumps each connected to the rearrangement wiring and arranged differently from the plurality of pads. The presence of a bevel cut surface obliquely continuous to the main surface and formed on a periphery of the main surface of the semiconductor chip prevents chipping.

摘要翻译： 要防止半导体芯片的碎裂。 半导体器件包括具有主表面的半导体芯片，在主表面上形成的多个焊盘，在主表面上形成的改变布线以改变多个焊盘的布置的重排布线，以及形成在多个焊盘上的保护膜和绝缘膜 主表面和多个焊料凸块，每个焊料凸块连接到重排布线并且与多个焊盘不同的布置。 形成在半导体芯片的主表面的周边上的与主表面倾斜连续的斜切面的存在防止了切屑。

公开(公告)号：US07579216B2

公开(公告)日：2009-08-25

申请号：US12118752

申请日：2008-05-12

申请人： Tadashi Munakata ,  Shingo Oosaka ,  Mitsuru Kinoshita ,  Yoshihiko Yamaguchi ,  Noriyuki Takahashi

发明人： Tadashi Munakata ,  Shingo Oosaka ,  Mitsuru Kinoshita ,  Yoshihiko Yamaguchi ,  Noriyuki Takahashi

IPC分类号： H01L21/58

CPC分类号： H01L21/78 ,  H01L21/02076 ,  H01L21/561 ,  H01L21/565 ,  H01L21/67092 ,  H01L21/67126 ,  H01L21/67333 ,  H01L21/6838 ,  H01L23/3128 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.

摘要翻译： 一种半导体器件制造方法，包括以下步骤：提供具有形成在其上的多个器件区域的主表面的矩阵衬底，将多个半导体芯片分别固定到多个器件区域，然后将多个半导体芯片与树脂一起密封以形成块密封 通过切割将每个设备区域的块状密封构件和矩阵基板分开，然后用刷子擦拭每个切割的密封构件部分的表面，然后将通过切割形成的半导体器件分别存储到一个 托盘，并且分别从托盘传送半导体器件。 由于在模块密封部件的表面进行真空夹紧的同时通过切割进行块模塑后的基板分割作业，所以可以在不对矩阵基板的外部端子安装面施加任何应力的情况下进行基板分割。

公开(公告)号：US07481186B2

公开(公告)日：2009-01-27

申请号：US11674016

申请日：2007-02-12

申请人： Noriyuki Takahashi

发明人： Noriyuki Takahashi

IPC分类号： F01P3/20 ,  F01P11/04 ,  F02F7/00

CPC分类号： F01P5/10 ,  F01M1/02 ,  F01P11/04 ,  F01P2050/16 ,  F02B61/02 ,  F02B75/22 ,  F02F7/007

摘要： A cooling water structure for an engine with improved external appearance and reduced cost. A first passage section of a cooling water passage discharges cooling water from a water pump to water jackets of front and rear cylinders. The first passage section is formed in a surface of a partition wall of a right case that is an inside wall surface of a crank case. The water pump is accommodated with the first passage section in a crank chamber of the crank case.

摘要翻译： 用于发动机的冷却水结构，具有改善的外观和降低的成本。 冷却水通道的第一通道部分将冷却水从水泵排放到前缸和后缸的水套上。 第一通道部分形成在作为曲轴箱的内壁表面的右壳体的分隔壁的表面中。 水泵容纳有曲柄箱的曲柄室中的第一通道部分。

公开(公告)号：US20050127535A1

公开(公告)日：2005-06-16

申请号：US11047660

申请日：2005-02-02

申请人： Noriyuki Takahashi ,  Masayuki Suzuki ,  Kouji Tsuchiya ,  Takao Matsuura ,  Takanori Hashizume ,  Masahiro Ichitani ,  Kazunari Suzuki ,  Takafumi Nishita ,  Kenichi Imura ,  Takashi Miwa

发明人： Noriyuki Takahashi ,  Masayuki Suzuki ,  Kouji Tsuchiya ,  Takao Matsuura ,  Takanori Hashizume ,  Masahiro Ichitani ,  Kazunari Suzuki ,  Takafumi Nishita ,  Kenichi Imura ,  Takashi Miwa

IPC分类号： B29C45/14 ,  H01L21/56 ,  H01L23/00 ,  H01L23/12 ,  H01L23/31 ,  H01L23/498 ,  H01L23/28

CPC分类号： H01L23/564 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/30105 ,  H01L2924/351 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012

摘要： The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.

摘要翻译： 将其上安装有多个半导体芯片的带状基板的背面真空吸附到模具的下半模，并且在该状态下，多个半导体芯片同时用树脂密封以形成密封构件。 此后，带状基板和密封构件从模具中释放并切割成多个半导体器件。 由此获得的半导体器件的安装可靠性得到改善。

公开(公告)号：US06872597B2

公开(公告)日：2005-03-29

申请号：US10784276

申请日：2004-02-24

申请人： Noriyuki Takahashi ,  Masayuki Suzuki ,  Kouji Tsuchiya ,  Takao Matsuura ,  Takanori Hashizume ,  Masahiro Ichitani ,  Kazunari Suzuki ,  Takafumi Nishita ,  Kenichi Imura ,  Takashi Miwa

发明人： Noriyuki Takahashi ,  Masayuki Suzuki ,  Kouji Tsuchiya ,  Takao Matsuura ,  Takanori Hashizume ,  Masahiro Ichitani ,  Kazunari Suzuki ,  Takafumi Nishita ,  Kenichi Imura ,  Takashi Miwa

IPC分类号： B29C45/14 ,  H01L21/56 ,  H01L23/00 ,  H01L23/12 ,  H01L23/31 ,  H01L23/498 ,  H01L21/44

CPC分类号： H01L23/564 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/30105 ,  H01L2924/351 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012

摘要： The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.