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公开(公告)号：US09985171B2
公开(公告)日：2018-05-29
申请号：US15632544
申请日：2017-06-26
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC: H01L29/18 , H01L33/00 , H01L31/02 , H01L31/0232 , H01L31/18 , H01L33/62 , H01L33/60 , H01L33/50
CPC classification number: H01L33/0079 , H01L23/3107 , H01L23/3185 , H01L25/042 , H01L25/0753 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/02322 , H01L31/02327 , H01L31/1892 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00
Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, and side areas connecting the top area and the bottom area; electrical contact locations at the top area or at the bottom area of the optoelectronic semiconductor chip; and an electrically insulating shaped body, wherein the optoelectronic semiconductor chip is a flip-chip having the electrical contract locations only at one side, either the underside or the top side, the shaped body surrounds the optoelectronic semiconductor chip at its side areas, and the shaped body is free of a via that electrically connects the optoelectronic semiconductor chip.
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公开(公告)号：US09490396B2
公开(公告)日：2016-11-08
申请号：US14931246
申请日：2015-11-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC: H01L29/18 , H01L33/48 , H01L33/62 , H01L31/0232 , H01L33/60 , H01L31/0203 , H01L33/56 , H01L23/31 , H01L33/54
CPC classification number: H01L33/0079 , H01L23/3107 , H01L23/3185 , H01L25/042 , H01L25/0753 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/02322 , H01L31/02327 , H01L31/1892 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00
Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having side areas, a surface at a top side of the semiconductor chip, and a surface at a bottom side of the semiconductor chip; a shaped body having a surface at a top side of the shaped body and a surface at an underside of the shaped body; at least one plated-through hole including an electrically conductive material; and an electrically conductive connection electrically conductively connected to the semiconductor chip and the plated-through hole, wherein the side areas of the optoelectronic semiconductor chip are covered by the shaped body, and the surface at the top side and/or the surface at the bottom side of the optoelectronic semiconductor chip are completely free of the shaped body.
Abstract translation: 光电子半导体部件包括：具有侧面区域的光电子半导体芯片，半导体芯片顶面的表面以及半导体芯片底面的表面; 成形体，其具有在成形体的顶侧的表面和成形体的下侧的表面; 至少一个包括导电材料的电镀通孔; 以及与半导体芯片和镀通孔导电连接的导电连接，其中光电子半导体芯片的侧面被成形体覆盖，并且在顶部和/或底部的表面处的表面 光电半导体芯片的一侧完全没有成形体。
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公开(公告)号：US20160056343A1
公开(公告)日：2016-02-25
申请号：US14931246
申请日：2015-11-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC: H01L33/48 , H01L31/0232 , H01L33/56 , H01L31/0203 , H01L33/62 , H01L33/60
CPC classification number: H01L33/0079 , H01L23/3107 , H01L23/3185 , H01L25/042 , H01L25/0753 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/02322 , H01L31/02327 , H01L31/1892 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00
Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having side areas, a surface at a top side of the semiconductor chip, and a surface at a bottom side of the semiconductor chip; a shaped body having a surface at a top side of the shaped body and a surface at an underside of the shaped body; at least one plated-through hole including an electrically conductive material; and an electrically conductive connection electrically conductively connected to the semiconductor chip and the plated-through hole, wherein the side areas of the optoelectronic semiconductor chip are covered by the shaped body, and the surface at the top side and/or the surface at the bottom side of the optoelectronic semiconductor chip are completely free of the shaped body.
Abstract translation: 光电子半导体部件包括具有侧面区域的半导体芯片，半导体芯片顶面的表面和半导体芯片底面的表面， 成形体，其具有在成形体的顶侧的表面和成形体的下侧的表面; 至少一个包括导电材料的电镀通孔; 以及与半导体芯片和镀通孔导电连接的导电连接，其中光电子半导体芯片的侧面被成形体覆盖，并且在顶部和/或底部的表面处的表面 光电半导体芯片的一侧完全没有成形体。
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公开(公告)号：US20150270459A1
公开(公告)日：2015-09-24
申请号：US14430539
申请日：2013-09-24
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Georg Dirscherl , Walter Wegleiter , Caroline Cassignol , Karl Weidner
CPC classification number: H01L33/56 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/62 , H01L2924/0002 , H01L2924/00
Abstract: The invention relates to an optoelectronic semiconductor component, which has a carrier element (1), on which an optoelectronic semiconductor chip (2) having at least one active layer is arranged, wherein the active layer is designed to emit or receive light during operation and wherein the semiconductor chip (2) is covered with a protective layer (3) that contains poly-para-xylenes.
Abstract translation: 本发明涉及一种具有载体元件（1）的光电子半导体元件，其上布置有具有至少一个有源层的光电子半导体芯片（2），其中该有源层被设计为在操作期间发射或接收光;以及 其中所述半导体芯片（2）被包含聚对二甲苯的保护层（3）覆盖。
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15.发明申请公开(公告)号：US20150014737A1
公开(公告)日：2015-01-15
申请号：US14378610
申请日：2013-01-17
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Stefan Illek , Walter Wegleiter , Karl Weidner , Stefan Stegmeier
CPC classification number: H01L33/64 , H01L25/0753 , H01L27/15 , H01L33/005 , H01L33/36 , H01L33/486 , H01L33/52 , H01L33/54 , H01L33/62 , H01L33/647 , H01L2224/48091 , H01L2224/48137 , H01L2933/0016 , H01L2933/0025 , H01L2933/005 , H01L2933/0066 , H01L2924/00014
Abstract: In at least one embodiment, the semiconductor component includes at least one optoelectronic semiconductor chip having a radiation exit side. The surface-mountable semiconductor component comprises a shaped body that covers side surfaces of the semiconductor chip directly and in a positively locking manner. The shaped body and the semiconductor chip do not overlap, as seen in a plan view of the radiation exit side.
Abstract translation: 在至少一个实施例中，半导体部件包括具有辐射出射侧的至少一个光电子半导体芯片。 可表面安装的半导体部件包括直接覆盖半导体芯片的侧表面并以正锁定方式覆盖的成形体。 成形体和半导体芯片不重叠，如在辐射出口侧的平面图中所见。
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Patent Agency Ranking
公开(公告)号：US12002901B2
公开(公告)日：2024-06-04
申请号：US18212935
申请日：2023-06-22
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC: H01L33/00 , H01L23/31 , H01L25/04 , H01L25/075 , H01L31/02 , H01L31/0203 , H01L31/0232 , H01L31/18 , H01L33/48 , H01L33/50 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62
CPC classification number: H01L33/0093 , H01L23/3107 , H01L23/3185 , H01L25/042 , H01L25/0753 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/02322 , H01L31/02327 , H01L31/1892 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/54 , H01L2924/0002 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/0002 , H01L2924/00
Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, at least one side area connecting the top area and the bottom area; electrical contact locations at the top area or at the bottom area of the optoelectronic semiconductor chip; and a molded body, wherein the molded body surrounds the optoelectronic semiconductor chip at all side areas at least in places, the molded body is electrically insulating, and the molded body is free of any conductive element that completely penetrates the molded body.
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公开(公告)号：US20200251612A1
公开(公告)日：2020-08-06
申请号：US16851232
申请日：2020-04-17
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC: H01L33/00 , H01L33/48 , H01L33/62 , H01L25/075 , H01L23/31 , H01L31/0232 , H01L33/60 , H01L31/0203 , H01L33/56 , H01L25/04 , H01L31/02 , H01L33/50 , H01L31/18
Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, side areas connecting the top area and the bottom area, and epitaxially produced layers; electrical n- and p-side contacts at the bottom area of the optoelectronic semiconductor chip; and an electrically insulating shaped body, wherein the shaped body surrounds the optoelectronic semiconductor chip at its side areas, and the epitaxially produced layers are free from the shaped body.
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公开(公告)号：US20150345727A1
公开(公告)日：2015-12-03
申请号：US14654538
申请日：2013-12-17
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Siegfried Herrmann , Walter Wegleiter , Andreas Plößl
CPC classification number: H05K3/32 , F21S41/141 , F21S41/192 , F21S43/14 , F21S43/195 , H01L25/0753 , H01L33/0079 , H01L33/486 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066 , H05K3/325 , H05K2201/10106 , H05K2201/1034 , H05K2201/10409 , H05K2201/10924 , Y10T29/49131 , H01L2924/00
Abstract: An optoelectronic device and a method for producing an optoelectronic device are disclosed. An embodiment of an optoelectronic device includes a carrier, an electrically conductive layer arranged on the carrier, at least one semiconductor chip comprising an active layer for generating electromagnetic radiation, wherein the semiconductor chip is electrically conductively and mechanically connected with the carrier via the electrically conductive layer. The device further comprises a holder, wherein a surface of the carrier remote from the semiconductor chip is arranged on the holder, wherein the carrier is mechanically connected with the holder by at least one fastening element and is fastened to the holder, wherein the fastening element passes completely through the carrier, and wherein the semiconductor chip is electrically conductively connected to the holder by the fastening element.
Abstract translation: 公开了一种光电器件及其制造方法。 光电子器件的实施例包括载体，布置在载体上的导电层，至少一个半导体芯片，包括用于产生电磁辐射的有源层，其中半导体芯片通过导电的方式与载体导电地和机械连接 层。 该装置还包括保持器，其中远离半导体芯片的载体的表面布置在保持器上，其中载体通过至少一个紧固元件与保持器机械连接并且被紧固到保持器，其中紧固元件 完全穿过载体，并且其中半导体芯片通过紧固元件导电地连接到保持器。
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19.发明申请公开(公告)号：US20150249070A1
公开(公告)日：2015-09-03
申请号：US14430215
申请日：2013-09-06
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Stefan Illek , Thomas Schwarz , Jürgen Moosburger , Walter Wegleiter
IPC: H01L25/075 , H01L33/52 , H01L33/64 , H01L33/50 , H01L33/62
CPC classification number: H01L25/0753 , H01L33/505 , H01L33/52 , H01L33/62 , H01L33/644 , H01L2924/0002 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0066 , H01L2933/0075 , H01L2924/00
Abstract: An optoelectronic semiconductor component and a method for making an optoelectronic semiconductor component are disclosed. In an embodiment the component includes a carrier including at least one conversion-medium body and a potting body, the potting body surrounding the conversion-medium body at least in places, as seen in plan view, electrical contact structures fitted at least indirectly to the carrier and a plurality of optoelectronic semiconductor chips fitted to a main face of the carrier, the optoelectronic semiconductor chips configured to generate radiation, wherein the conversion-medium body is shaped as a plate, wherein the semiconductor chips are directly mechanically connected to the conversion-medium body, and wherein the conversion-medium body is free of cutouts for the electrical contact structures and is not penetrated by the electrical contact structure.
Abstract translation: 公开了一种光电子半导体部件和制造光电半导体部件的方法。 在一个实施例中，部件包括载体，该载体包括至少一个转化介质体和灌封体，灌封体至少在一些地方围绕转化介质体，如平面图所示，电接触结构至少间接地安装在 载体和安装在载体的主面上的多个光电半导体芯片，所述光电子半导体芯片被配置为产生辐射，其中所述转换介质体被成形为板，其中所述半导体芯片直接机械地连接到所述转换 - 中间体，并且其中所述转换介质主体没有用于所述电接触结构的切口并且不被所述电接触结构穿透。
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公开(公告)号：US20230352617A1
公开(公告)日：2023-11-02
申请号：US18212935
申请日：2023-06-22
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC: H01L33/00 , H01L33/48 , H01L33/62 , H01L25/075 , H01L23/31 , H01L31/0232 , H01L33/60 , H01L31/0203 , H01L33/56 , H01L25/04 , H01L31/02 , H01L33/50 , H01L31/18
CPC classification number: H01L33/0093 , H01L33/486 , H01L33/62 , H01L25/0753 , H01L23/3185 , H01L31/0232 , H01L33/60 , H01L31/0203 , H01L31/02327 , H01L33/483 , H01L33/56 , H01L23/3107 , H01L25/042 , H01L31/02005 , H01L33/502 , H01L31/02322 , H01L31/1892 , H01L33/54
Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, at least one side area connecting the top area and the bottom area; electrical contact locations at the top area or at the bottom area of the optoelectronic semiconductor chip; and a molded body, wherein the molded body surrounds the optoelectronic semiconductor chip at all side areas at least in places, the molded body is electrically insulating, and the molded body is free of any conductive element that completely penetrates the molded body.
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