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公开(公告)号：US09520442B2
公开(公告)日：2016-12-13
申请号：US14575913
申请日：2014-12-18
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Ralph Wirth , Alexander Linkov
CPC classification number: H01L25/0753 , H01L27/15 , H01L33/30 , H01L33/32 , H01L33/483 , H01L33/50 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
Abstract: An optoelectronic component can be used for mixing electromagnetic radiation having different wavelengths, in particular in the far field. The optoelectronic component includes a carrier. A first semiconductor chip has a first radiation exit surface for emitting electromagnetic radiation in a first spectral range is provided on the carrier and a second semiconductor chip as a second radiation exit surface for emitting electromagnetic radiation in a second spectral range is provided on the carrier. A diffusing layer is provided on the radiation exit surfaces of the semiconductor chips which face away from the carrier.
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公开(公告)号：US09490396B2
公开(公告)日：2016-11-08
申请号：US14931246
申请日：2015-11-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC: H01L29/18 , H01L33/48 , H01L33/62 , H01L31/0232 , H01L33/60 , H01L31/0203 , H01L33/56 , H01L23/31 , H01L33/54
CPC classification number: H01L33/0079 , H01L23/3107 , H01L23/3185 , H01L25/042 , H01L25/0753 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/02322 , H01L31/02327 , H01L31/1892 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00
Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having side areas, a surface at a top side of the semiconductor chip, and a surface at a bottom side of the semiconductor chip; a shaped body having a surface at a top side of the shaped body and a surface at an underside of the shaped body; at least one plated-through hole including an electrically conductive material; and an electrically conductive connection electrically conductively connected to the semiconductor chip and the plated-through hole, wherein the side areas of the optoelectronic semiconductor chip are covered by the shaped body, and the surface at the top side and/or the surface at the bottom side of the optoelectronic semiconductor chip are completely free of the shaped body.
Abstract translation: 光电子半导体部件包括：具有侧面区域的光电子半导体芯片，半导体芯片顶面的表面以及半导体芯片底面的表面; 成形体，其具有在成形体的顶侧的表面和成形体的下侧的表面; 至少一个包括导电材料的电镀通孔; 以及与半导体芯片和镀通孔导电连接的导电连接，其中光电子半导体芯片的侧面被成形体覆盖，并且在顶部和/或底部的表面处的表面 光电半导体芯片的一侧完全没有成形体。
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公开(公告)号：US20160056343A1
公开(公告)日：2016-02-25
申请号：US14931246
申请日：2015-11-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC: H01L33/48 , H01L31/0232 , H01L33/56 , H01L31/0203 , H01L33/62 , H01L33/60
CPC classification number: H01L33/0079 , H01L23/3107 , H01L23/3185 , H01L25/042 , H01L25/0753 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/02322 , H01L31/02327 , H01L31/1892 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00
Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having side areas, a surface at a top side of the semiconductor chip, and a surface at a bottom side of the semiconductor chip; a shaped body having a surface at a top side of the shaped body and a surface at an underside of the shaped body; at least one plated-through hole including an electrically conductive material; and an electrically conductive connection electrically conductively connected to the semiconductor chip and the plated-through hole, wherein the side areas of the optoelectronic semiconductor chip are covered by the shaped body, and the surface at the top side and/or the surface at the bottom side of the optoelectronic semiconductor chip are completely free of the shaped body.
Abstract translation: 光电子半导体部件包括具有侧面区域的半导体芯片，半导体芯片顶面的表面和半导体芯片底面的表面， 成形体，其具有在成形体的顶侧的表面和成形体的下侧的表面; 至少一个包括导电材料的电镀通孔; 以及与半导体芯片和镀通孔导电连接的导电连接，其中光电子半导体芯片的侧面被成形体覆盖，并且在顶部和/或底部的表面处的表面 光电半导体芯片的一侧完全没有成形体。
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公开(公告)号：US11931185B2
公开(公告)日：2024-03-19
申请号：US17440657
申请日：2020-03-24
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Sergey Kudaev , Reiner Windisch , Dennis Sprenger , Ralph Wirth , Thomas Klafta
CPC classification number: A61B5/7207 , A61B5/02427 , A61B5/6801 , A61B2562/12
Abstract: In an embodiment a vital sign sensor includes an emitter component configured to emit light, a detector component configured to detect light, a first layer of a substantially transparent material, wherein the emitter component is embedded in the first layer, and a second layer of a light scattering material arranged on the first layer, wherein the second layer includes converter particles, and wherein the first layer and the second layer are surrounded by at least one wall of a reflective material.
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公开(公告)号：US11749776B2
公开(公告)日：2023-09-05
申请号：US17552657
申请日：2021-12-16
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC: H01L33/00 , H01L33/48 , H01L33/62 , H01L25/075 , H01L23/31 , H01L31/0232 , H01L33/60 , H01L31/0203 , H01L33/56 , H01L25/04 , H01L31/02 , H01L33/50 , H01L31/18 , H01L33/54
CPC classification number: H01L33/0093 , H01L23/3107 , H01L23/3185 , H01L25/042 , H01L25/0753 , H01L31/0203 , H01L31/02005 , H01L31/0232 , H01L31/02322 , H01L31/02327 , H01L31/1892 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/54 , H01L2924/0002 , H01L2933/005 , H01L2933/0033 , H01L2933/0066 , H01L2924/0002 , H01L2924/00
Abstract: A method of producing an optoelectronic semiconductor component includes providing a carrier; arranging at least one optoelectronic semiconductor chip at a top side of the carrier, wherein the semiconductor chip includes semiconductor layers deposited on a substrate; forming a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body surrounds all side areas of the at least one optoelectronic semiconductor chip and at least some of the layers deposited on the substrate are free of the shaped body such that these layers are not covered or completely exposed; and removing the carrier.
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Patent Agency Ranking
公开(公告)号：US20220109082A1
公开(公告)日：2022-04-07
申请号：US17552657
申请日：2021-12-16
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC: H01L33/00 , H01L33/48 , H01L33/62 , H01L25/075 , H01L23/31 , H01L31/0232 , H01L33/60 , H01L31/0203 , H01L33/56 , H01L25/04 , H01L31/02 , H01L33/50 , H01L31/18
Abstract: A method of producing an optoelectronic semiconductor component includes providing a carrier; arranging at least one optoelectronic semiconductor chip at a top side of the carrier, wherein the semiconductor chip includes semiconductor layers deposited on a substrate; forming a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body surrounds all side areas of the at least one optoelectronic semiconductor chip and at least some of the layers deposited on the substrate are free of the shaped body such that these layers are not covered or completely exposed; and removing the carrier.
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公开(公告)号：US11004834B2
公开(公告)日：2021-05-11
申请号：US16484459
申请日：2018-02-06
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Farhang Ghasemi Afshar , Ralph Wirth
IPC: H01L25/075 , H01L27/15 , H01L33/50 , H01L33/52 , H01L33/60
Abstract: An LED unit comprises a substrate and a first LED chip. The first LED chip may include a first light-emitting surface arranged on the substrate in such a way that light emitted from the first LED chip radiates in a direction of radiation of the LED unit. The LED unit includes a second LED chip comprising a second light-emitting surface and arranged above the first LED chip in such a way that the second LED chip at least partially covers the first LED chip and radiates light emitted from the second LED chip in the direction of radiation of the LED unit. The LED unit comprises a first conversion layer at least partially covering the first light-emitting surface and/or at least partially laterally surrounding the first LED chip. A second conversion layer at least partially covers the second LED chip.
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18.发明授权公开(公告)号：US10276752B2
公开(公告)日：2019-04-30
申请号：US15745240
申请日：2016-07-11
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Johannes Baur , Jürgen Moosburger , Lutz Höppel , Markus Maute , Thomas Schwarz , Matthias Sabathil , Ralph Wirth , Alexander Linkov
Abstract: An optoelectronic semiconductor component includes a light-emitting semiconductor body having a radiation side, a current expansion layer arranged on the radiation side of the semiconductor body and at least partially covers this side, wherein the current expansion layer includes an electrically-conductive material transparent to the light radiated by the semiconductor body, and particles of a further material, and an electrical contact arranged on a side of the current expansion layer facing away from the semiconductor body.
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19.发明申请公开(公告)号：US20190006562A1
公开(公告)日：2019-01-03
申请号：US15745240
申请日：2016-07-11
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Johannes Baur , Jurgen Moosburger , Lutz Hoppel , Markus Maute , Thomas Schwarz , Matthias Sabathil , Ralph Wirth , Alexander Linkov
IPC: H01L33/42
Abstract: An optoelectronic semiconductor component includes a light-emitting semiconductor body having a radiation side, a current expansion layer arranged on the radiation side of the semiconductor body and at least partially covers this side, wherein the current expansion layer includes an electrically-conductive material transparent to the light radiated by the semiconductor body, and particles of a further material, and an electrical contact arranged on a side of the current expansion layer facing away from the semiconductor body.
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公开(公告)号：US20170200869A1
公开(公告)日：2017-07-13
申请号：US15314084
申请日：2015-06-10
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Stefan Lange , Vera Stöppelkamp , Frank Jermann , Andreas Biebersdorf , Ralph Wirth
CPC classification number: H01L33/504 , H01L33/04 , H01L33/502 , H01L33/505 , H01L33/52 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/00014 , H01L2924/00
Abstract: An optoelectronic semiconductor component is disclosed. In an embodiment, the semiconductor component includes at least one optoelectronic semiconductor chip for generating primary radiation in a near-ultraviolet or in a visible spectral range, at least one phosphor for partial or complete conversion of the primary radiation into a longer-waved secondary radiation which is in the visible spectral range and at least one filter substance for partial absorption of the secondary radiation, wherein the phosphor and the filter substance are closely connected to the semiconductor chip.
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