公开(公告)号：US20150236233A1

公开(公告)日：2015-08-20

申请号：US14422990

申请日：2013-12-20

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yoshihisa Yamashita ,  Seiichi Nakatani ,  Koji Kawakita ,  Susumu Sawada

IPC: H01L33/64 ,  C23C14/58 ,  H01L33/56 ,  C23C14/34 ,  H01L33/58 ,  H01L33/62

CPC classification number: H01L33/647 ,  C23C14/34 ,  C23C14/5846 ,  H01L21/76873 ,  H01L21/76879 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3735 ,  H01L24/19 ,  H01L24/97 ,  H01L25/167 ,  H01L33/52 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/0346 ,  H01L2224/03825 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8203 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method for manufacturing an electronic component package comprises: (i) preparing a metal foil having opposed principal surface “A” for placement of an electronic component and principal surface “B”, and a through-hole located in an electronic component-placement region of the principal surface “A”; (ii) placing the electronic component on the metal foil such that the electronic component is positioned in the electronic component-placement region, and an opening of the through-hole is capped with an electrode of the electronic component; (iii) forming a sealing resin layer on the principal surface “A” such that the electronic component is covered with the sealing resin layer; and (iv) forming a metal plating layer on the principal surface “B”. A dry plating process and a subsequent wet plating process are performed to form the metal plating layer in the (iv) such that the through-hole is filled with the metal plating layer, and the metal foil and the metal plating layer are integrated with each other.

Abstract translation: 一种电子部件封装的制造方法，其特征在于，具备：（i）制作具有相对的主面“A”用于配置电子部件和主面“B”的金属箔，以及位于电子部件配置区域 主面“A”; （ii）将电子部件放置在金属箔上使得电子部件位于电子部件放置区域中，并且通孔的开口用电子部件的电极封盖; （iii）在主表面“A”上形成密封树脂层，使得电子部件被密封树脂​​层覆盖; 和（iv）在主表面“B”上形成金属镀层。 进行干电镀处理和随后的湿式电镀处理，以在（iv）中形成金属镀层，使得通孔填充有金属镀层，金属箔和金属镀层与每个 其他。

公开(公告)号：US20150214129A1

公开(公告)日：2015-07-30

申请号：US14422505

申请日：2013-12-20

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Koji Kawakita ,  Seiichi Nakatani ,  Susumu Sawada ,  Yoshihisa Yamashita

IPC: H01L23/367 ,  H01L33/62 ,  H01L21/48 ,  H01L23/31 ,  H01L21/56 ,  H01L33/64 ,  H01L33/50 ,  H01L33/52

CPC classification number: H01L23/367 ,  H01L21/4846 ,  H01L21/4871 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/36 ,  H01L23/49575 ,  H01L23/5389 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/507 ,  H01L33/52 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0075 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: There is provided a method for manufacturing an electronic component package, wherein a package precursor is provided, in which an electronic component is embedded in a sealing resin layer such that an electrode of the electronic component is exposed at a surface of the sealing resin layer. In the manufacturing method of the present invention, a combination of a formation process of a plurality of metal plating layers and a patterning process of the metal plating layers is provided to form a step-like metal plating layer, the formation process being performed by sequential dry and wet plating processes with respect to the package precursor, the patterning process being performed by a patterning of at least two of the metal plating layers.

Abstract translation: 提供一种电子部件封装的制造方法，其中提供封装前体，其中将电子部件嵌入密封树脂层中，使得电子部件的电极在密封树脂层的表面露出。 在本发明的制造方法中，提供多个金属镀层的形成工艺和金属镀层的图案化工艺的组合以形成阶梯状金属镀层，形成工序通过顺序 相对于封装前体进行干法和湿式电镀处理，所述图案化工艺通过图案化至少两个所述金属镀层进行。

公开(公告)号：US09595651B2

公开(公告)日：2017-03-14

申请号：US14422990

申请日：2013-12-20

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yoshihisa Yamashita ,  Seiichi Nakatani ,  Koji Kawakita ,  Susumu Sawada

IPC: H01L23/02 ,  H01L21/00 ,  H01L33/64 ,  H01L33/58 ,  H01L33/62 ,  H01L33/56 ,  C23C14/34 ,  C23C14/58 ,  H01L21/768

CPC classification number: H01L33/647 ,  C23C14/34 ,  C23C14/5846 ,  H01L21/76873 ,  H01L21/76879 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3735 ,  H01L24/19 ,  H01L24/97 ,  H01L25/167 ,  H01L33/52 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/0346 ,  H01L2224/03825 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8203 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method for manufacturing an electronic component package comprises: (i) preparing a metal foil having opposed principal surface “A” for placement of an electronic component and principal surface “B”, and a through-hole located in an electronic component-placement region of surface “A”; (ii) placing the electronic component on the metal foil such that the electronic component is positioned in the electronic component-placement region, and an opening of the through-hole is capped with an electrode of the electronic component; (iii) forming a sealing resin layer on surface “A” such that the electronic component is covered with the sealing resin layer; and (iv) forming a metal plating layer on surface “B”. A dry plating process and a wet plating process are performed to form the metal plating layer in step (iv) such that the through-hole is filled with the metal plating layer, and the metal foil and the metal plating layer are integrated.

Abstract translation: 一种电子部件封装的制造方法，其特征在于，具备：（i）制作具有相对的主面“A”用于配置电子部件和主面“B”的金属箔，以及位于电子部件配置区域 表面“A”; （ii）将电子部件放置在金属箔上使得电子部件位于电子部件放置区域中，并且通孔的开口用电子部件的电极封盖; （iii）在表面“A”上形成密封树脂层，使得电子部件被密封树脂​​层覆盖; 和（iv）在表面“B”上形成金属镀层。 在步骤（iv）中进行干电镀处理和湿式电镀处理以形成金属镀层，使得通孔填充有金属镀层，并且金属箔和金属镀层一体化。

公开(公告)号：US09425122B2

公开(公告)日：2016-08-23

申请号：US14422505

申请日：2013-12-20

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Koji Kawakita ,  Seiichi Nakatani ,  Susumu Sawada ,  Yoshihisa Yamashita

IPC: H01L33/00 ,  H01L23/367 ,  H01L33/62 ,  H01L33/64 ,  H01L33/52 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/538 ,  H01L33/50 ,  H01L23/36 ,  H01L25/075 ,  H01L23/495

CPC classification number: H01L23/367 ,  H01L21/4846 ,  H01L21/4871 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/36 ,  H01L23/49575 ,  H01L23/5389 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/507 ,  H01L33/52 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0075 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method for manufacturing an electronic component packages is provided, wherein a package precursor is provided, in which an electronic component is embedded in a sealing resin layer such that an electrode of the electronic component is exposed at a surface of the sealing resin layer. A combination of a formation process of a plurality of metal plating layers and a patterning process of the plurality of metal plating layers is provided to form a step-like metal plating layer, the formation process being performed by sequential dry and wet plating processes with respect to the package precursor, and the patterning process being performed by a patterning of at least two of the plurality of metal plating layers.

Abstract translation: 提供了一种电子部件封装的制造方法，其中提供封装前体，其中将电子部件嵌入到密封树脂层中，使得电子部件的电极在密封树脂层的表面露出。 提供多个金属镀层的形成过程和多个金属镀层的图案化工艺的组合以形成阶梯状金属镀层，形成工艺通过相继的干式和湿式电镀工艺进行， 并且通过图案化多个金属镀层中的至少两个来执行图案化工艺。

公开(公告)号：US09320155B2

公开(公告)日：2016-04-19

申请号：US14128954

申请日：2012-12-21

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Taiji Kuroiwa ,  Seiichi Nakatani ,  Yoshihisa Yamashita ,  Susumu Sawada

IPC: H05K3/46 ,  H05K1/03 ,  H05K3/40 ,  H05K3/22

CPC classification number: H05K3/22 ,  H05K1/0306 ,  H05K3/4007 ,  H05K3/4629 ,  H05K2201/017 ,  H05K2201/09481 ,  H05K2201/09881 ,  H05K2203/0139 ,  Y10T29/49155

Abstract: A ceramic substrate composite includes a conductor pattern composite and an insulating layer on a ceramic substrate. The ceramic substrate composite is formed such that the conductor pattern composite and the insulating layer are provided on the ceramic substrate with each other so that the insulating layer overlaps a part of the conductor pattern composite. The conductor pattern composite is composed of a conductor portion and an insulating portion that exists locally in the conductor portion, and the insulating portion is an insulating material that constitutes the insulating layer.

Abstract translation: 陶瓷基板复合体包括导体图案复合体和陶瓷基板上的绝缘层。 形成陶瓷基板复合体，使得导体图案复合体和绝缘层彼此设置在陶瓷基板上，使得绝缘层与导体图案复合体的一部分重叠。 导体图案复合体由导体部分和局部存在于导体部分中的绝缘部分组成，绝缘部分是构成绝缘层的绝缘材料。

公开(公告)号：US20150228619A1

公开(公告)日：2015-08-13

申请号：US14422615

申请日：2013-12-20

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Susumu Sawada ,  Seiichi Nakatani ,  Yoshihisa Yamashita ,  Koji Kawakita

IPC: H01L25/065 ,  H01L33/54 ,  H01L33/62 ,  H01L25/16 ,  H01L21/288 ,  H01L23/31 ,  H01L23/538 ,  H01L21/56 ,  H01L23/00 ,  H01L33/50 ,  H01L25/00

CPC classification number: H01L25/0655 ,  H01L21/288 ,  H01L21/4878 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/367 ,  H01L23/433 ,  H01L23/5386 ,  H01L24/83 ,  H01L24/96 ,  H01L25/0753 ,  H01L25/167 ,  H01L25/50 ,  H01L33/507 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2224/96 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2924/20642 ,  H01L2924/20643 ,  H01L2924/20644 ,  H01L2924/20645 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2224/32225 ,  H01L2924/00014 ,  H01L2224/32245 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2224/11

Abstract: There is provided a method for manufacturing an electronic component package, wherein a first electronic component and a second electronic component are placed on a carrier, and a sealing resin layer is formed on the carrier, followed by the carrier being peeled away to be removed, and thereby providing a package precursor in which the first and second electronic components are embedded such that an electrode of at least one of the first and second electronic components is exposed at a surface of the sealing resin layer. Upon the placing of the first and second electronic components, the first and second electronic components are positioned such that their height levels differ from each other. After the removal of the carrier, a metal plating layer is formed such that the metal plating layer is in contact with the exposed surface of the electrode of the at least one of the first and second electronic components.

Abstract translation: 提供了一种制造电子部件封装的方法，其中第一电子部件和第二电子部件被放置在载体上，并且在载体上形成密封树脂层，随后将载体剥离以除去， 从而提供封装前体，其中嵌入第一和第二电子部件，使得第一和第二电子部件中的至少一个的电极在密封树脂层的表面露出。 在放置第一和第二电子部件时，第一和第二电子部件被定位成使得它们的高度水平彼此不同。 在移除载体之后，形成金属镀层，使得金属镀层与第一和第二电子部件中的至少一个的电极的暴露表面接触。

公开(公告)号：US20150206819A1

公开(公告)日：2015-07-23

申请号：US14422294

申请日：2013-12-20

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Takashi Ichiryu ,  Seiichi Nakatani ,  Yoshihisa Yamashita

IPC: H01L23/34 ,  H01L23/50 ,  H01L23/28 ,  H01L21/56 ,  H01L21/768

CPC classification number: H01L23/34 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/76877 ,  H01L23/28 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/50 ,  H01L24/19 ,  H01L24/96 ,  H01L33/52 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/92144 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: There is provided a method for manufacturing an electronic component package. The method comprises the steps: (i) forming a package precursor in which an electronic component is embedded in a sealing resin layer such that an electrode of the electronic component is exposed at a surface of the sealing resin layer; (ii) disposing a metal foil having a through-hole on the surface of the sealing resin layer such that the through-hole of the metal foil is positioned in an opposed relation to the electrode of the electronic component; and (iii) forming a metal plating layer on the metal foil, wherein the formation of the metal plating layer in the step (iii) is performed by a dry plating process and a subsequent wet plating process, whereby the through-hole is filled with the metal plating layer, and the metal foil and the metal plating layer are integrated with each other.

Abstract translation: 提供一种电子部件封装的制造方法。 该方法包括以下步骤：（i）形成封装前体，其中将电子部件嵌入到密封树脂层中，使得电子部件的电极在密封树脂层的表面露出; （ii）在密封树脂层的表面上设置具有通孔的金属箔，使得金属箔的通孔与电子部件的电极相对置; 和（iii）在金属箔上形成金属镀层，其中在步骤（iii）中形成金属镀层通过干式电镀工艺和随后的湿式电镀工艺进行，由此填充通孔 金属镀层和金属箔和金属镀层彼此一体化。