利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

39 条记录 (耗时 0.028 秒)

    Method of making a printed circuit board having filled holes and fill member for use therewith
    12.
    发明授权
    Method of making a printed circuit board having filled holes and fill member for use therewith 失效
    制造具有填充孔和填充构件的印刷电路板的方法

    公开(公告)号：US6079100A

    公开(公告)日：2000-06-27

    申请号：US76649

    申请日：1998-05-12

    申请人： Donald S. Farquhar ,  Voya R. Markovich ,  Kostas I. Papathomas ,  Leonard L. Schmidt

    发明人： Donald S. Farquhar ,  Voya R. Markovich ,  Kostas I. Papathomas ,  Leonard L. Schmidt

    IPC分类号： H05K1/11 ,  H05K3/00 ,  H01K3/10 ,  H01R9/09

    CPC分类号： H05K3/0094 ,  H05K1/113 ,  H05K2201/0959 ,  H05K2203/0191 ,  H05K2203/025 ,  H05K2203/0278 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： A method of making a circuitized substrate such as a printed circuit board having at least one hole therein which comprises the steps of providing a layer of dielectric, forming at least one (and preferably several) holes therein, positioning a thin layer of support material atop the dielectric layer and over the hole(s), positioning a quantity of fill material on the thin layer of support material (preferably before positioning the thin layer on the dielectric) and thereafter applying a predetermined force sufficient to cause the thin support layer to rupture or otherwise deform (including melting from heat application thereto) such that the fill material is forcibly driven into the accommodating hole(s). Subsequent steps can include forming a layer of circuitry on the substrate's external surface and over the filled holes such that an electrical component such as a ball grid array (BGA), semiconductor chip, etc. may be directly positioned on and/or over the hole(s). A fill member usable with the method is also provided.

    摘要翻译： 一种制造诸如印刷电路板的电路化基板的方法，其中具有至少一个孔，其包括以下步骤：提供介电层，在其中形成至少一个（并且优选几个）孔，将薄层的支撑材料定位在顶部 电介质层和孔之上，将一定量的填充材料定位在支撑材料的薄层上（优选在将薄层定位在电介质上之前），然后施加足以使薄载体层破裂的预定力 或以其他方式变形（包括从其加热熔化）使得填充材料被强制地驱动到容纳孔中。 随后的步骤可以包括在衬底的外表面上和填充的孔上形成电路层，使得电子部件例如球栅阵列（BGA），半导体芯片等可以直接定位在孔的上和/或上方 （s）。 还提供了可用于该方法的填充构件。

    Photosensitive dielectric film
    13.
    发明申请
    Photosensitive dielectric film 审中-公开
    感光电介质膜

    公开(公告)号：US20110017498A1

    公开(公告)日：2011-01-27

    申请号：US12460975

    申请日：2009-07-27

    申请人： John M. Lauffer ,  Voya R. Markovich ,  Kostas I. Papathomas

    发明人： John M. Lauffer ,  Voya R. Markovich ,  Kostas I. Papathomas

    IPC分类号： H05K1/09 ,  C08J3/28 ,  B05D5/12

    CPC分类号： H05K3/4676 ,  H05K3/0023 ,  H05K2201/0209

    摘要： A photosensitive dielectric composition adapted for forming a dielectric film layer for use in a circuitized substrate is provided according to one embodiment of the invention, the composition including an epoxide bearing component including at least one polyepoxide resin curable by electromagnetic radiation, a cyanate ester, a flexibilizer, a nanostructured toughener, a photoinitiator in a predetermined amount by weight of the resin component, and a ceramic filler, the photosensitive dielectric composition forming the dielectric film layer having no solvent therein. In an alternative embodiment, a heat activated dielectric composition is provided which is curable by heat and includes an epoxide bearing component including at least one polyepoxide resin curable by heat, a cyanate ester, a flexibilizer, a nanostructured toughener, a heat activated curing agent for accelerating reaction of the cyanate ester and polyepoxide resin components, and a ceramic filler. Methods of making circuitized substrates from the above compositions are also provided.

    摘要翻译： 根据本发明的一个实施方案提供一种适用于形成用于电路化基底的电介质膜层的光敏电介质组合物，该组合物包括含环氧化物的组分，该组分包括至少一种可通过电磁辐射固化的聚环氧树脂，氰酸酯， 增韧剂，纳米结构增韧剂，预定量的树脂组分的光引发剂和陶瓷填料，所述光敏介电组合物形成在其中不溶剂的电介质膜层。 在另一个实施方案中，提供热活化电介质组合物，其可通过加热固化，并且包括含环氧化物的组分，其包含至少一种可热固化的聚环氧树脂，氰酸酯，增韧剂，纳米结构增韧剂，热活化固化剂 加速氰酸酯和聚环氧树脂组分的反应，以及陶瓷填料。 还提供了从上述组合物制备电路化基底的方法。

    Method of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement means
    20.
    发明授权
    Method of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement means 失效
    制造具有填充孔的印刷电路板和用于其的填充构件的方法，包括加强装置

    公开(公告)号：US06609296B1

    公开(公告)日：2003-08-26

    申请号：US09562580

    申请日：2000-05-01

    申请人： Donald S. Farquhar ,  Voya R. Markovich ,  Kostas I. Papathomas ,  Leonard L. Schmidt

    发明人： Donald S. Farquhar ,  Voya R. Markovich ,  Kostas I. Papathomas ,  Leonard L. Schmidt

    IPC分类号： H01K310

    CPC分类号： H05K3/0094 ,  H05K1/0366 ,  H05K1/113 ,  H05K3/246 ,  H05K3/4069 ,  H05K2201/0347 ,  H05K2201/0959 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/1453 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： A method of making a circuitized substrate such as a printed circuit board having at least one hole therein which comprises the steps of providing a layer of dielectric, forming at least one (and preferably several) holes therein, providing a fill member including a quantity of fill material and reinforcement means located within the fill material, positioning the fill member on the dielectric over the holes and thereafter applying a predetermined force sufficient to cause only the fill material to be forcibly driven into the accommodating hole(s), not the reinforcement means. Subsequent steps can include forming a layer of circuitry on the substrate's external surface and over the filled holes such that an electrical component such as a ball grid array (BGA), semiconductor chip, etc. may be directly positioned on and/or over the hole(s). A fill member usable with the method is also provided.

    摘要翻译： 一种制造电路化基板的方法，例如其中具有至少一个孔的印刷电路板，其包括以下步骤：提供介电层，在其中形成至少一个（并且优选几个）孔，提供填充构件，该填充构件包括一定量的 填充材料和加强装置，其位于填充材料内，将填充构件定位在电介质上的孔上，然后施加足以使填充材料被强制地驱动进入容纳孔的预定力，而不是加强装置 。 随后的步骤可以包括在衬底的外表面上和填充的孔上形成电路层，使得电子部件例如球栅阵列（BGA），半导体芯片等可以直接定位在孔的上和/或上方 （s）。 还提供了可用于该方法的填充构件。