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    Photosensitive dielectric film
    2.
    发明申请
    Photosensitive dielectric film 审中-公开
    感光电介质膜

    公开(公告)号：US20110017498A1

    公开(公告)日：2011-01-27

    申请号：US12460975

    申请日：2009-07-27

    申请人： John M. Lauffer ,  Voya R. Markovich ,  Kostas I. Papathomas

    发明人： John M. Lauffer ,  Voya R. Markovich ,  Kostas I. Papathomas

    IPC分类号： H05K1/09 ,  C08J3/28 ,  B05D5/12

    CPC分类号： H05K3/4676 ,  H05K3/0023 ,  H05K2201/0209

    摘要： A photosensitive dielectric composition adapted for forming a dielectric film layer for use in a circuitized substrate is provided according to one embodiment of the invention, the composition including an epoxide bearing component including at least one polyepoxide resin curable by electromagnetic radiation, a cyanate ester, a flexibilizer, a nanostructured toughener, a photoinitiator in a predetermined amount by weight of the resin component, and a ceramic filler, the photosensitive dielectric composition forming the dielectric film layer having no solvent therein. In an alternative embodiment, a heat activated dielectric composition is provided which is curable by heat and includes an epoxide bearing component including at least one polyepoxide resin curable by heat, a cyanate ester, a flexibilizer, a nanostructured toughener, a heat activated curing agent for accelerating reaction of the cyanate ester and polyepoxide resin components, and a ceramic filler. Methods of making circuitized substrates from the above compositions are also provided.

    摘要翻译： 根据本发明的一个实施方案提供一种适用于形成用于电路化基底的电介质膜层的光敏电介质组合物，该组合物包括含环氧化物的组分，该组分包括至少一种可通过电磁辐射固化的聚环氧树脂，氰酸酯， 增韧剂，纳米结构增韧剂，预定量的树脂组分的光引发剂和陶瓷填料，所述光敏介电组合物形成在其中不溶剂的电介质膜层。 在另一个实施方案中，提供热活化电介质组合物，其可通过加热固化，并且包括含环氧化物的组分，其包含至少一种可热固化的聚环氧树脂，氰酸酯，增韧剂，纳米结构增韧剂，热活化固化剂 加速氰酸酯和聚环氧树脂组分的反应，以及陶瓷填料。 还提供了从上述组合物制备电路化基底的方法。

    Two signal one power plane circuit board
    7.
    发明授权
    Two signal one power plane circuit board 有权
    两个信号一个电源平面电路板

    公开(公告)号：US06204453B1

    公开(公告)日：2001-03-20

    申请号：US09203956

    申请日：1998-12-02

    申请人： Kenneth Fallon ,  Miguel A. Jimarez ,  Ross W. Keesler ,  John M. Lauffer ,  Roy H. Magnuson ,  Voya R. Markovich ,  Irv Memis ,  Jim P. Paoletti ,  Marybeth Perrino ,  John A. Welsh ,  William E. Wilson

    发明人： Kenneth Fallon ,  Miguel A. Jimarez ,  Ross W. Keesler ,  John M. Lauffer ,  Roy H. Magnuson ,  Voya R. Markovich ,  Irv Memis ,  Jim P. Paoletti ,  Marybeth Perrino ,  John A. Welsh ,  William E. Wilson

    IPC分类号： H05K103

    CPC分类号： H05K3/44 ,  H05K1/056 ,  H05K3/0023 ,  H05K3/108 ,  H05K3/426 ,  H05K3/445 ,  H05K2201/09554 ,  H05K2203/0733

    摘要： A method of forming a printed circuit board or circuit card is provided with a metal layer which serves as a power plane sandwiched between a pair of photoimageable dielectric layers. Photoformed metal filled vias and photoformed plated through holes are in the photopatternable material, and signal circuitry is on the surfaces of each of the dielectric materials and connected to the vias and plated through holes. A border may be around the board or card including a metal layer terminating in from the edge of one of the dielectric layers. A copper foil is provided with clearance holes. First and second layers of photoimageable curable dielectric material is disposed on opposite sides of the copper which are photoimageable material. The patterns are developed on the first and second layers of the photoimageable material to reveal the metal layer through vias. At the clearance holes in the copper, through holes are developed where holes were patterned in both dielectric layers. Thereafter, the surfaces of the photoimageable material, vias and through holes are metalized by copper plating. This is preferably done by protecting the remainder of the circuitry with photoresist and utilizing photolithographic techniques. The photoresist is thereafter removed, leaving a circuit board or card having metalization on both sides, vias extending from both sides to the copper layer in the center, plated through holes connecting the two outer circuitized copper layers.

    摘要翻译： 形成印刷电路板或电路卡的方法设置有用作夹在一对可光成像的电介质层之间的电力平面的金属层。 光刻图形金属填充的通孔和光成像的电镀通孔位于光图案化材料中，信号电路位于每个介电材料的表面上，并连接到通孔和电镀通孔。 边界可以在板或卡周围，包括从电介质层之一的边缘终止的金属层。 铜箔上设有间隙孔。 可光成像的可固化介电材料的第一和第二层设置在作为可光成像的材料的铜的相对侧上。 图案在可光成象材料的第一层和第二层上显影，以通过通孔显露金属层。 在铜中的间隙孔处，通孔被开发成在两个电介质层中图案化孔。 此后，可光成像材料，通孔和通孔的表面通过镀铜进行金属化。 这优选通过用光致抗蚀剂和利用光刻技术保护电路的其余部分来实现。 然后去除光致抗蚀剂，留下在两侧具有金属化的电路板或卡，其中心的两侧延伸到铜层，通孔连接两个外部电路化的铜层。