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    Two signal one power plane circuit board
    4.
    发明授权
    Two signal one power plane circuit board 有权
    两个信号一个电源平面电路板

    公开(公告)号：US06204453B1

    公开(公告)日：2001-03-20

    申请号：US09203956

    申请日：1998-12-02

    申请人： Kenneth Fallon ,  Miguel A. Jimarez ,  Ross W. Keesler ,  John M. Lauffer ,  Roy H. Magnuson ,  Voya R. Markovich ,  Irv Memis ,  Jim P. Paoletti ,  Marybeth Perrino ,  John A. Welsh ,  William E. Wilson

    发明人： Kenneth Fallon ,  Miguel A. Jimarez ,  Ross W. Keesler ,  John M. Lauffer ,  Roy H. Magnuson ,  Voya R. Markovich ,  Irv Memis ,  Jim P. Paoletti ,  Marybeth Perrino ,  John A. Welsh ,  William E. Wilson

    IPC分类号： H05K103

    CPC分类号： H05K3/44 ,  H05K1/056 ,  H05K3/0023 ,  H05K3/108 ,  H05K3/426 ,  H05K3/445 ,  H05K2201/09554 ,  H05K2203/0733

    摘要： A method of forming a printed circuit board or circuit card is provided with a metal layer which serves as a power plane sandwiched between a pair of photoimageable dielectric layers. Photoformed metal filled vias and photoformed plated through holes are in the photopatternable material, and signal circuitry is on the surfaces of each of the dielectric materials and connected to the vias and plated through holes. A border may be around the board or card including a metal layer terminating in from the edge of one of the dielectric layers. A copper foil is provided with clearance holes. First and second layers of photoimageable curable dielectric material is disposed on opposite sides of the copper which are photoimageable material. The patterns are developed on the first and second layers of the photoimageable material to reveal the metal layer through vias. At the clearance holes in the copper, through holes are developed where holes were patterned in both dielectric layers. Thereafter, the surfaces of the photoimageable material, vias and through holes are metalized by copper plating. This is preferably done by protecting the remainder of the circuitry with photoresist and utilizing photolithographic techniques. The photoresist is thereafter removed, leaving a circuit board or card having metalization on both sides, vias extending from both sides to the copper layer in the center, plated through holes connecting the two outer circuitized copper layers.

    摘要翻译： 形成印刷电路板或电路卡的方法设置有用作夹在一对可光成像的电介质层之间的电力平面的金属层。 光刻图形金属填充的通孔和光成像的电镀通孔位于光图案化材料中，信号电路位于每个介电材料的表面上，并连接到通孔和电镀通孔。 边界可以在板或卡周围，包括从电介质层之一的边缘终止的金属层。 铜箔上设有间隙孔。 可光成像的可固化介电材料的第一和第二层设置在作为可光成像的材料的铜的相对侧上。 图案在可光成象材料的第一层和第二层上显影，以通过通孔显露金属层。 在铜中的间隙孔处，通孔被开发成在两个电介质层中图案化孔。 此后，可光成像材料，通孔和通孔的表面通过镀铜进行金属化。 这优选通过用光致抗蚀剂和利用光刻技术保护电路的其余部分来实现。 然后去除光致抗蚀剂，留下在两侧具有金属化的电路板或卡，其中心的两侧延伸到铜层，通孔连接两个外部电路化的铜层。

    Multi-voltage plane, multi-signal plane circuit card with photoimageable dielectric
    9.
    发明授权
    Multi-voltage plane, multi-signal plane circuit card with photoimageable dielectric 有权
    多电平面，多信号平面电路卡，带有可光成像电介质

    公开(公告)号：US06201194B1

    公开(公告)日：2001-03-13

    申请号：US09203978

    申请日：1998-12-02

    申请人： John M. Lauffer ,  Roy H. Magnuson ,  Voya R. Markovich ,  John A. Welsh

    发明人： John M. Lauffer ,  Roy H. Magnuson ,  Voya R. Markovich ,  John A. Welsh

    IPC分类号： H01R909

    CPC分类号： H05K3/429 ,  H01R12/523 ,  H05K3/0023 ,  H05K3/4602 ,  H05K3/4608 ,  H05K3/4641 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/0554 ,  Y10T29/49165

    摘要： A technique for forming an organic chip carrier or circuit board, having two voltage planes and at least two signal planes is provided which includes bonding a first layer of photolithographic dielectric material to a first metal layer and exposing the first layer of dielectric material to a pattern of radiation to provide at least one opening through the first layer of the dielectric material. A second metal layer is bonded to the first layer of photoimageable material on the opposite side from the first metal layer. Holes are etched in the first and second metal layers which correspond to and are larger than each of the patterns on said openings in the first layer of dielectric material. The exposed pattern on the first layer of dielectric material is then developed, with the openings in the first and second metal layers being larger than the corresponding developed opening in the first dielectric material. Second and third layers of photoimageable dielectric material are applied on the first and second metal layers, respectively and are photopatterned and developed to provide openings in each of the second and third layers of dielectric material some of which correspond to each of the holes in the first layer of dielectric material and the holes in the first and second metal layers, some of which terminate at the underlying metal layer. The exposed surfaces of both the second and third dielectric material, are circuitized and the holes plated or filled with metal.

    摘要翻译： 提供了一种用于形成具有两个电压平面和至少两个信号面的有机芯片载体或电路板的技术，其包括将第一层光刻电介质材料结合到第一金属层并将第一介电材料层暴露于图案 的辐射以提供通过电介质材料的第一层的至少一个开口。 第二金属层在与第一金属层相对的一侧上结合到可光成像材料的第一层。 在第一和第二金属层中蚀刻孔，其对应于并且大于第一介电材料层中的所述开口上的每个图案。 然后显影第一层介电材料上的暴露图案，其中第一和第二金属层中的开口大于第一介电材料中对应的显影开口。 将第二和第三层可光成像介电材料分别施加在第一和第二金属层上，并对其进行光刻图案化和显影以在第二和第三层介电材料中的每一个中提供开口，其中的第一和第三层对应于第一和第二金属层中的每个孔 介电材料层和第一和第二金属层中的孔，其中一些终止于下面的金属层。 第二和第三介电材料的暴露表面被电路化，并且孔被镀金或填充金属。