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公开(公告)号:US10388870B2
公开(公告)日:2019-08-20
申请号:US15793247
申请日:2017-10-25
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Perumal Ratnam , Tanmay Kumar , Christopher Petti
Abstract: Systems and methods for reducing leakage currents through unselected memory cells of a memory array including setting an adjustable resistance bit line structure connected to the unselected memory cells into a high resistance state or a non-conducting state during a memory operation are described. The adjustable resistance bit line structure may comprise a bit line structure in which the resistance of an intrinsic (or near intrinsic) polysilicon portion of the bit line structure may be adjusted via an application of a voltage to a select gate portion of the bit line structure that is electrically isolated from the intrinsic polysilicon portion (e.g., via an oxide layer between the intrinsic polysilicon portion and the select gate portion). The memory cells may comprise a first conductive metal oxide (e.g., titanium oxide) that abuts a second conductive metal oxide (e.g., aluminum oxide) that abuts a layer of amorphous silicon.
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公开(公告)号:US10354710B2
公开(公告)日:2019-07-16
申请号:US15728840
申请日:2017-10-10
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Christopher Petti , Neil Robertson , Abhijit Bandyopadhyay
Abstract: A memory cell includes a VCMA magnetoelectric memory element and a two-terminal selector element connected in series to the magnetoelectric memory element.
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13.
公开(公告)号:US10056399B2
公开(公告)日:2018-08-21
申请号:US15445579
申请日:2017-02-28
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Xiying Costa , Daxin Mao , Christopher Petti , Dana Lee , Yao-Sheng Lee
IPC: H01L27/115 , H01L27/11524 , H01L27/11556 , H01L27/1157 , H01L27/11582 , H01L27/11519 , H01L27/11565
CPC classification number: H01L27/11565 , H01L27/1157 , H01L27/11582
Abstract: A three-dimensional memory device includes a first alternating stack of first insulating layers and first electrically conductive layers, a first memory opening fill structure extending through the first alternating stack and including a first memory film and a first vertical semiconductor channel, a joint-level electrically conductive layer overlying the first alternating stack, at least one joint-level doped semiconductor portion contacting a top surface of the first vertical semiconductor channel and located within, and electrically isolated from, the joint-level electrically conductive layer, a second alternating stack of second insulating layers and second electrically conductive layers located over the joint-level electrically conductive layer, and a second memory opening fill structure extending through the second alternating stack and including a second memory film and a second vertical semiconductor channel that is laterally surrounded by the second memory film and vertically extends into the at least one joint-level doped semiconductor portion.
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公开(公告)号:US09922709B2
公开(公告)日:2018-03-20
申请号:US14715566
申请日:2015-05-18
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Perumal Ratnam , Christopher Petti , Tianhong Yan
IPC: G11C16/02 , G11C13/00 , G06F11/10 , H01L27/24 , H01L29/786 , H01L45/00 , G11C16/08 , G11C16/10 , G11C16/24 , G11C16/26 , G11C7/12 , G11C7/18 , G11C29/02 , G11C29/12
CPC classification number: G11C13/004 , G06F11/1048 , G11C7/12 , G11C7/18 , G11C13/0002 , G11C13/0007 , G11C13/0021 , G11C13/0026 , G11C13/0028 , G11C13/0033 , G11C13/0069 , G11C13/0097 , G11C16/08 , G11C16/10 , G11C16/24 , G11C16/26 , G11C29/025 , G11C29/028 , G11C2029/1204 , G11C2213/71 , G11C2216/10 , H01L27/2436 , H01L27/2454 , H01L27/2481 , H01L27/249 , H01L29/786 , H01L45/04 , H01L45/06 , H01L45/085 , H01L45/122 , H01L45/1226 , H01L45/1246 , H01L45/146
Abstract: Methods for reducing leakage currents through unselected memory cells of a memory array during a memory operation are described. In some cases, the leakage currents through the unselected memory cells of the memory array may be reduced by setting an adjustable resistance bit line structure connected to the unselected memory cells into a non-conducting state. The adjustable resistance bit line structure may comprise a bit line structure in which the resistance of an intrinsic (or near intrinsic) polysilicon portion of the bit line structure may be adjusted via an application of a voltage to a select gate portion of the bit line structure that is not directly connected to the intrinsic polysilicon portion. The intrinsic polysilicon portion may be set into a conducting state or a non-conducting state based on the voltage applied to the select gate portion.
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公开(公告)号:US20170309681A1
公开(公告)日:2017-10-26
申请号:US15633054
申请日:2017-06-26
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Yoichiro Tanaka , Yangyin Chen , Chu-Chen Fu , Christopher Petti
CPC classification number: H01L27/249 , G11C13/0007 , G11C13/0011 , G11C13/0026 , G11C13/0028 , G11C13/0038 , G11C13/004 , G11C13/0069 , G11C2213/32 , G11C2213/51 , G11C2213/71 , G11C2213/72 , G11C2213/79 , H01L23/528 , H01L23/53257 , H01L27/1214 , H01L27/2427 , H01L27/2481 , H01L29/78642 , H01L45/04 , H01L45/08 , H01L45/085 , H01L45/1226 , H01L45/1233 , H01L45/124 , H01L45/1246 , H01L45/1253 , H01L45/141 , H01L45/146 , H01L45/1608 , H01L45/1683
Abstract: Systems and methods for improving performance of a non-volatile memory that utilizes a Vacancy Modulated Conductive Oxide (VMCO) structure are described. The VMCO structure may include a layer of amorphous silicon (e.g., a Si barrier layer) and a layer titanium oxide (e.g., a TiO2 switching layer). In some cases, the VMCO structure or VMCO stack may use bulk switching or switching O-ion movements across an area of the VMCO structure, as opposed to switching locally in a constriction of vacancy formed filamentary path. A VMCO structure may be partially or fully embedded within a word line layer of a memory array.
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公开(公告)号:US11456333B2
公开(公告)日:2022-09-27
申请号:US16903654
申请日:2020-06-17
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Yu-Chung Lien , Jiahui Yuan , Deepanshu Dutta , Christopher Petti
Abstract: A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive word line layers located over a substrate, and a plurality of vertical memory strings. Each vertical memory string includes a series connection of a memory stack structure and a selector element. Each of the memory stack structures extends through the alternating stack and includes a respective memory film and a respective vertical semiconductor channel. Each of the selector elements includes a two terminal device that is configured to provide at least two different resistivity states.
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公开(公告)号:US10885991B2
公开(公告)日:2021-01-05
申请号:US16359846
申请日:2019-03-20
Applicant: SanDisk Technologies LLC
Inventor: Ward Parkinson , Martin Hassner , Nathan Franklin , Christopher Petti
Abstract: Apparatuses, systems, methods, and computer program products are disclosed for data rewrite operations. A non-volatile memory device comprises a non-volatile memory medium. A non-volatile memory device is configured to determine an error metric for a non-volatile memory medium in response to a read request for the non-volatile memory medium. A non-volatile memory device is configured to receive a refresh command from a controller over a bus. A non-volatile memory device is configured to rewrite data from a non-volatile memory medium during a predefined time period after receiving a refresh command in response to an error metric satisfying an error threshold.
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公开(公告)号:US10727276B1
公开(公告)日:2020-07-28
申请号:US16422187
申请日:2019-05-24
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Yu-Chung Lien , Jiahui Yuan , Deepanshu Dutta , Christopher Petti
Abstract: A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive word line layers located over a substrate, and a plurality of vertical memory strings. Each vertical memory string includes a series connection of a memory stack structure and a selector element. Each of the memory stack structures extends through the alternating stack and includes a respective memory film and a respective vertical semiconductor channel. Each of the selector elements includes a two terminal device that is configured to provide at least two different resistivity states.
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19.
公开(公告)号:US20190319100A1
公开(公告)日:2019-10-17
申请号:US15951916
申请日:2018-04-12
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Yangyin Chen , Christopher Petti
IPC: H01L29/10 , H01L27/11556 , H01L27/11582 , H01L27/11524 , H01L27/1157 , H01L29/06 , H01L29/36 , H01L29/161 , H01L21/02
Abstract: An alternating stack of insulating layers and sacrificial material layers is formed over a substrate. The sacrificial material layers are formed as, or are subsequently replaced with, electrically conductive layers. Memory openings are formed through the alternating stack. A memory film is formed within each memory openings. A silicon-germanium alloy layer including germanium at an atomic concentration less than 25% is deposited within each memory opening. An oxidation process is performed on the silicon-germanium alloy layer. A vertical semiconductor channel including an unoxidized remaining material portion of the silicon-germanium alloy layer is formed, which includes germanium at an atomic concentration greater than 50%.
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公开(公告)号:US10109679B2
公开(公告)日:2018-10-23
申请号:US15432544
申请日:2017-02-14
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Yangyin Chen , Christopher Petti
IPC: H01L47/00 , H01L27/24 , G11C13/00 , H01L23/528 , H01L23/532 , H01L45/00 , H01L27/12 , H01L29/786
Abstract: Systems and methods for fabricating a non-volatile memory with integrated selector devices (or steering devices) are described. Each memory cell within a memory array may be placed in series with a selector device, such as a diode or other non-linear current-voltage device, in order to reduce leakage currents through unselected memory cells during a memory operation. In some cases, fabricating a selector device within a memory hole region may be difficult due to the dimensions of the selector device. A wordline sidewall recess process or a wordline sidewall recess with a replacement metal gate process may be used to integrate selector devices with memory cells outside of the memory hole region. By fabricating non-linear selector devices outside of the memory hole region, the area of the memory array may be reduced.
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