公开(公告)号：US10161045B2

公开(公告)日：2018-12-25

申请号：US15217717

申请日：2016-07-22

Applicant: BYD COMPANY LIMITED

Inventor： Qing Gong ,  Wei Zhou ,  Yongliang Sun

IPC: B05D3/00 ,  C08J7/18 ,  G21H5/00 ,  C23C18/18 ,  C23C18/16 ,  C23C18/20 ,  C23C18/40 ,  C08K3/20 ,  C23C18/36 ,  C23C18/54 ,  C08K3/22

Abstract: A method for metalizing a polymer substrate and a polymer article prepared by the method are provided. First, a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. Then, a surface of the polymer substrate is irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. The surface of the polymer substrate is then subjected to chemical plating.

公开(公告)号：US09805847B2

公开(公告)日：2017-10-31

申请号：US14762078

申请日：2014-01-24

Applicant: BYD Company Limited

Inventor： Yanshuai Zhao ,  Wei Zhou

IPC: H01B1/02 ,  H01C7/02 ,  C04B35/468 ,  C04B35/626 ,  C04B35/634 ,  C01G23/00 ,  C04B35/462 ,  C04B35/64 ,  H01C7/00 ,  H01C17/065 ,  C04B35/653

CPC classification number: H01C7/023 ,  C01G23/006 ,  C04B35/462 ,  C04B35/4682 ,  C04B35/6261 ,  C04B35/62685 ,  C04B35/62695 ,  C04B35/63416 ,  C04B35/64 ,  C04B35/653 ,  C04B2235/32 ,  C04B2235/3201 ,  C04B2235/3203 ,  C04B2235/3217 ,  C04B2235/3224 ,  C04B2235/3232 ,  C04B2235/3236 ,  C04B2235/34 ,  C04B2235/3409 ,  C04B2235/3418 ,  C04B2235/449 ,  C04B2235/5427 ,  C04B2235/6562 ,  C04B2235/6565 ,  C04B2235/6567 ,  C04B2235/785 ,  H01C7/008 ,  H01C7/025 ,  H01C17/06533

Abstract: A thermistor material and a method for preparing a thermistor material are provided. The thermistor material is prepared by mixing and heating a mixture containing BaTiO3, B2O3, SiO2, Li2O, P2O5, Cs2O, Nd2O3, Al2O3 and TiO2.

公开(公告)号：US10085351B2

公开(公告)日：2018-09-25

申请号：US14657823

申请日：2015-03-13

Applicant: BYD COMPANY LIMITED

Inventor： Qing Gong ,  Wei Zhou ,  Xinping Lin ,  Weifeng Miao ,  Xiaofang Chen

IPC: H05K3/18 ,  C23C18/16 ,  C23C18/18 ,  C23C18/20 ,  H05K1/03

CPC classification number: H05K3/185 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1868 ,  C23C18/1882 ,  C23C18/204 ,  C23C18/2066 ,  H05K1/0373 ,  H05K3/188 ,  Y10T428/24917

Abstract: A coating composition, a composite prepared by using the coating composition, and a method for preparing the composite are provided. The coating composition includes a solvent, an adhesive, and a catalyst precursor including at least one chosen from SnO2, ZnSnO3 and ZnTiO3.

公开(公告)号：US10173399B2

公开(公告)日：2019-01-08

申请号：US15633009

申请日：2017-06-26

Applicant: BYD COMPANY LIMITED

Inventor： Xiong Zhang ,  Shouping Bai ,  Qianrong Zhang ,  Wei Zhou ,  Qing Gong

IPC: B32B27/06 ,  B32B15/08 ,  C08K3/32 ,  C08K5/372 ,  C08K7/14 ,  C08K13/02 ,  C08L23/08 ,  C08L23/26 ,  C08L67/02 ,  C08L71/12 ,  C08L81/02 ,  C08K5/103 ,  C08K5/523 ,  C08K5/00

Abstract: The present disclosure discloses an anti-yellowing composition comprising at least a phosphorus-containing compound and at least a pentaerythritol ester, wherein the phosphorus-containing compound is selected from a phosphate salt, and a concentration of the phosphorus-containing compound is 100-1600 parts by weight, relative to 100 parts by weight of the pentaerythritol ester. The present disclosure also discloses a resin composition containing the anti-yellowing composition, and a metal-resin composite formed with the resin composition and a metal substrate, and a preparation method and use thereof. The present disclosure further discloses an electronic product shell formed with the resin composition and a metal shell body.

公开(公告)号：US10161044B2

公开(公告)日：2018-12-25

申请号：US15447522

申请日：2017-03-02

Applicant: BYD COMPANY LIMITED

Inventor： Wei Zhou ,  Bifeng Mao

IPC: B01J23/20 ,  C23C18/16 ,  C08K3/22 ,  C08L77/06 ,  C23C18/20 ,  C23C18/40 ,  H05K3/18 ,  C09D11/10 ,  C09D11/322 ,  B01J35/00 ,  B01J35/02 ,  B01J37/00 ,  B01J37/08 ,  C23C18/18 ,  C09D11/03 ,  C09D11/102 ,  C09D11/38 ,  C09D11/52 ,  C09D167/02 ,  C09D169/00 ,  C09D177/10 ,  C25D3/12 ,  C08K9/02

Abstract: A polymer product with a metal layer coated on the surface thereof is provided. The polymer product includes a polymer substrate and a metal layer formed on at least a part of a surface of the polymer substrate. The surface of the polymer substrate covered by the metal layer is formed by a polymer composition comprising a polymer and a doped tin oxide. A doping element of the doped tin oxide comprises niobium. The doped tin oxide has a coordinate L* value of about 70 to about 100, a coordinate a value of about −5 to about 5, and a coordinate b value of about −5 to about 5 in a CIELab color space.

公开(公告)号：US09869025B2

公开(公告)日：2018-01-16

申请号：US14943861

申请日：2015-11-17

Applicant: BYD COMPANY LIMITED

Inventor： Qing Gong ,  Wei Zhou ,  Weifeng Miao

IPC: C23C18/38 ,  C01G19/02 ,  C01G31/00 ,  C08K3/22 ,  C09D11/03 ,  C23C18/16 ,  H05K1/03 ,  H05K3/10 ,  H05K3/18 ,  C23C18/20 ,  B29C37/00 ,  C23C18/28 ,  C01G19/00 ,  C01G30/00 ,  C01G39/00 ,  B29C35/08

CPC classification number: C23C18/1608 ,  B29C37/0025 ,  B29C2035/0838 ,  B29C2035/0872 ,  B29C2035/0877 ,  C01G19/006 ,  C01G19/02 ,  C01G30/002 ,  C01G31/00 ,  C01G39/00 ,  C01P2002/50 ,  C01P2002/52 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/64 ,  C08K3/22 ,  C08K2003/2231 ,  C08K2003/2255 ,  C09D11/03 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/285 ,  C23C18/38 ,  H05K1/0373 ,  H05K3/107 ,  H05K3/185 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/0236 ,  H05K2203/107

Abstract: Embodiments of the present disclosure are directed to a doped tin oxide. The doped tin oxide includes a tin oxide and at least one oxide of a doping element. The doping element includes at least one of vanadium and molybdenum. The doped tin oxide includes an amount of the tin oxide ranging from 90 mol % to 99 mol %, and an amount of the at least one oxide ranging from 1 mol % to 10 mol %.

公开(公告)号：US20160333481A1

公开(公告)日：2016-11-17

申请号：US15217730

申请日：2016-07-22

Applicant: BYD COMPANY LIMITED

Inventor： Qing Gong ,  Wei Zhou ,  Yongliang Sun

IPC: C23C18/18 ,  C23C18/40 ,  C23C18/16

CPC classification number: C23C18/1862 ,  C08K3/20 ,  C08K2003/2248 ,  C08K2003/2262 ,  C08K2003/2265 ,  C23C18/1603 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/18 ,  C23C18/1851 ,  C23C18/204 ,  C23C18/36 ,  C23C18/40 ,  C23C18/54

Abstract: A method for metalizing a polymer substrate and a polymer article prepared thereof. First, a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. Then, a surface of the polymer substrate is irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. The surface of the polymer substrate is then subjected to chemical plating.

Abstract translation: 一种聚合物基材金属化方法及其制备的聚合物制品。 首先，提供具有分散在基础聚合物中的基础聚合物和至少一种金属化合物的聚合物基材。 然后，用能量束照射高分子基板的表面，使得聚合物基板的表面的水接触角为至少120°。 然后将聚合物基材的表面进行化学镀。

公开(公告)号：US20160326653A1

公开(公告)日：2016-11-10

申请号：US15217717

申请日：2016-07-22

Applicant: BYD COMPANY LIMITED

Inventor： Qing Gong ,  Wei Zhou ,  Yongliang Sun

IPC: C23C18/18 ,  C23C18/40 ,  C23C18/16

CPC classification number: C23C18/1862 ,  C08K3/20 ,  C08K2003/2248 ,  C08K2003/2262 ,  C08K2003/2265 ,  C23C18/1603 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/18 ,  C23C18/1851 ,  C23C18/204 ,  C23C18/36 ,  C23C18/40 ,  C23C18/54

Abstract: A method for metalizing a polymer substrate and a polymer article prepared by the method are provided. First, a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. Then, a surface of the polymer substrate is irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. The surface of the polymer substrate is then subjected to chemical plating.

Abstract translation: 提供了通过该方法制备的聚合物基材和聚合物制品的金属化方法。 首先，提供具有分散在基础聚合物中的基础聚合物和至少一种金属化合物的聚合物基材。 然后，用能量束照射高分子基板的表面，使得聚合物基板的表面的水接触角为至少120°。 然后将聚合物基材的表面进行化学镀。

公开(公告)号：US20150371742A1

公开(公告)日：2015-12-24

申请号：US14762078

申请日：2014-01-24

Applicant: BYD COMPANY LIMITED

Inventor： Yanshuai Zhao ,  Wei Zhou

IPC: H01C7/02 ,  C04B35/64 ,  H01C7/00 ,  C04B35/634 ,  C04B35/462 ,  C04B35/626 ,  C04B35/653

CPC classification number: H01C7/023 ,  C01G23/006 ,  C04B35/462 ,  C04B35/4682 ,  C04B35/6261 ,  C04B35/62685 ,  C04B35/62695 ,  C04B35/63416 ,  C04B35/64 ,  C04B35/653 ,  C04B2235/32 ,  C04B2235/3201 ,  C04B2235/3203 ,  C04B2235/3217 ,  C04B2235/3224 ,  C04B2235/3232 ,  C04B2235/3236 ,  C04B2235/34 ,  C04B2235/3409 ,  C04B2235/3418 ,  C04B2235/449 ,  C04B2235/5427 ,  C04B2235/6562 ,  C04B2235/6565 ,  C04B2235/6567 ,  C04B2235/785 ,  H01C7/008 ,  H01C7/025 ,  H01C17/06533

Abstract: A thermistor material and a method for preparing a thermistor material are provided. The thermistor material is prepared by mixing and heating a mixture containing BaTiO3, B2O3, SiO2, Li2O, P2O5, Cs2O, Nd2O3, Al2O3 and TiO2.

Abstract translation: 提供一种热敏电阻材料和一种制备热敏电阻材料的方法。 通过混合和加热含有BaTiO3，B2O3，SiO2，Li2O，P2O5，Cs2O，Nd2O3，Al2O3和TiO2的混合物制备热敏电阻材料。