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11.发明申请公开(公告)号：US20150060121A1
公开(公告)日：2015-03-05
申请号：US14137600
申请日：2013-12-20
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hai Joon LEE , Doo Young KIM , Byoung Hwa LEE , Eun Hyuk CHAE
CPC classification number: H05K1/185 , H01G4/008 , H01G4/012 , H01G4/12 , H01G4/232 , H01G4/30 , H01G4/40 , H05K2201/10015 , H05K2201/10636 , Y02P70/611
Abstract: There is provided a multilayer ceramic electronic part to be embedded in a board, including: a ceramic body including dielectric layers; first and second internal electrodes having first and second leads; and first and second external electrodes, wherein when lengths from edges of the first or second external electrode formed on first and second side surfaces of the ceramic body to points at which the first or second external electrode contacts the first and second leads are G1, lengths from the edges of the first or second external electrode formed on first and second side surfaces of the ceramic body to a corresponding end surface of the ceramic body are BW1, and lengths from the corresponding end surface of the ceramic body to points at which the first or second external electrode contacts the first and second leads are M1, 30 μm≦G1
Abstract translation: 提供了一种要嵌入板的多层陶瓷电子部件，包括：包括电介质层的陶瓷体; 第一和第二内部电极具有第一和第二引线; 以及第一外部电极和第二外部电极，其中当从陶瓷体的第一和第二侧表面上形成的第一或第二外部电极的边缘到第一或第二外部电极接触第一和第二引线的点的长度为G1时，长度 从形成在陶瓷体的第一和第二侧表面上的第一或第二外部电极的边缘到陶瓷体的相应端面的边缘为BW1，并且从陶瓷体的相应端面到第一 或第二外部电极接触第一和第二引线为M1，30μm和n1E; G1
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12.发明申请公开(公告)号：US20150041199A1
公开(公告)日：2015-02-12
申请号：US14213185
申请日：2014-03-14
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Byoung Hwa LEE , Hai Joon LEE , Eun Hyuk CHAE , Bae Gen LEE , Jin Man JUNG
CPC classification number: H05K1/185 , H01G2/06 , H01G4/005 , H01G4/232 , H01G4/30 , H05K1/0306 , H05K2201/10015 , H05K2201/10636 , Y02P70/611
Abstract: A multilayer ceramic electronic component to be embedded in a board includes: a ceramic body including dielectric layers; first and second internal electrodes formed in the ceramic body; and first-polarity external electrodes connected to the first internal electrodes, and second-polarity external electrodes connected to the second internal electrodes, wherein the number of the first-polarity external electrodes and the number of the second-polarity external electrodes may be two or more, the first-polarity and second-polarity external electrodes may include first-polarity and second-polarity base electrodes and first-polarity and second-polarity terminal electrodes formed on the first-polarity and second-polarity base electrodes, respectively, when L denotes a length of the ceramic body and W denotes a width thereof, W/L≧0.6 may be satisfied, and a width BW of each of the first-polarity and second-polarity external electrodes formed on the first and second main surfaces of the ceramic body may satisfy 150 μm≦BW≦350 μm.
Abstract translation: 嵌入板中的多层陶瓷电子部件包括：包含电介质层的陶瓷体; 在陶瓷体中形成的第一和第二内部电极; 连接到第一内部电极的第一极性外部电极和连接到第二内部电极的第二极性外部电极，其中第一极性外部电极的数量和第二极性外部电极的数量可以是两个或 此外，第一极性和第二极性外部电极可以包括分别在第一极性和第二极性基极上形成的第一极性和第二极性基极以及形成在第一极性和第二极性基极上的第一极性和第二极性端子电极，当L 表示陶瓷体的长度，W表示其宽度，W /L≥0.6，并且形成在第一和第二主表面上的第一极性和第二极性外部电极的宽度BW 陶瓷体可以满足150μm＆nlE; BW＆nlE;350μm。
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13.发明申请公开(公告)号：US20150041198A1
公开(公告)日：2015-02-12
申请号：US14174591
申请日：2014-02-06
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Byoung Hwa LEE , Doo Young KIM , Hai Joon LEE , Jin Man JUNG
CPC classification number: H01G2/06 , H01G4/005 , H01G4/232 , H01G4/30 , H05K1/185 , H05K2201/10015 , H05K2201/10636 , Y02P70/611
Abstract: There is provided a multilayer ceramic electronic part to be embedded in a board, the multilayer ceramic electronic part including: a ceramic body including dielectric layers; first and second internal electrodes disposed in the ceramic body; first and second external electrodes formed on the respective end portions of the ceramic body, and a third external electrode formed on first and second main surfaces of the ceramic body, wherein an outermost first internal electrode among the first internal electrodes is connected to the first and second external electrodes through at least one first via, and the second internal electrodes are connected to the third external electrode through at least one second via.
Abstract translation: 提供了一种要嵌入板中的多层陶瓷电子部件，所述多层陶瓷电子部件包括：陶瓷体，包括电介质层; 布置在陶瓷体中的第一和第二内部电极; 形成在陶瓷体的各个端部的第一外部电极和第二外部电极，以及形成在陶瓷体的第一和第二主表面上的第三外部电极，其中，第一内部电极中的最外部第一内部电极连接到第一内部电极， 通过至少一个第一通孔的第二外部电极，并且所述第二内部电极通过至少一个第二通孔连接到所述第三外部电极。
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14.发明申请公开(公告)号：US20150041196A1
公开(公告)日：2015-02-12
申请号：US14146590
申请日：2014-01-02
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hye Seong KIM , Eun Hyuk CHAE , Hai Joon LEE , Young Don CHOI , Jin Sung KIM
CPC classification number: H01G4/30 , H01G4/12 , H01G4/2325 , H05K1/185 , H05K2201/10015 , H05K2201/10636 , Y02P70/611
Abstract: There is provided an embedded multilayer ceramic electronic component including a ceramic body including a dielectric layer and having first and second main surfaces, first and second side surfaces, and first and second end surfaces, first and second internal electrodes, and first and second external electrodes, wherein the first external electrode includes a first base electrode electrically connected to the first internal electrode, a first intermediate layer, and a first terminal electrode, the second external electrode includes a second base electrode electrically connected to the second internal electrode, a second intermediate layer, and a second terminal electrode, the first and second base electrodes include a first conductive metal and glass, and the first and second terminal electrodes are formed of a second conductive metal.
Abstract translation: 提供了一种嵌入式多层陶瓷电子部件，其包括具有电介质层的陶瓷体，具有第一和第二主表面，第一和第二侧表面以及第一和第二端面，第一和第二内部电极以及第一和第二外部电极 其中，所述第一外部电极包括与所述第一内部电极电连接的第一基极电极，第一中间层和第一端子电极，所述第二外部电极包括与所述第二内部电极电连接的第二基极， 层和第二端子电极，第一和第二基极包括第一导电金属和玻璃，并且第一和第二端子电极由第二导电金属形成。
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15.发明申请公开(公告)号：US20150021079A1
公开(公告)日：2015-01-22
申请号：US14083189
申请日：2013-11-18
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Byoung Hwa LEE , Doo Young KIM , Hai Joon LEE , Jin Man JUNG
CPC classification number: H01G2/06 , H01G4/012 , H01G4/232 , H01G4/30 , H05K1/185 , H05K3/0035 , H05K2201/10015 , H05K2201/10636 , Y02P70/611
Abstract: There is provided a multilayer ceramic electronic component to be embedded in a board, including a ceramic body including dielectric layers and having first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second end surfaces facing each other, an active layer including a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body with the dielectric layers interposed therebetween, to form capacitance therein, upper and lower cover layers formed on upper and lower portions of the active layer, and first and second external electrodes formed on both end surfaces of the ceramic body, wherein when a thickness of the upper or lower cover layer is defined as tc, 4 μm≦tc≦20 μm may be satisfied.
Abstract translation: 本发明提供一种嵌入电路板的多层陶瓷电子元件，其包括：包含电介质层的陶瓷体，具有彼此相对的第一和第二主表面，彼此相对的第一和第二侧表面以及面向每个的第一和第二端面 另一方面，包括多个第一和第二内部电极的有源层，所述多个第一和第二内部电极通过陶瓷体的两个端面交替地暴露在介电层之间以形成电容，其中形成在活性物质的上部和下部的上部和下部覆盖层 层，以及形成在陶瓷体的两个端面的第一外部电极和第二外部电极，其中当上部或下部覆盖层的厚度被定义为tc时，可以满足4μm＆lt; nlE; tc＆nlE;20μm。
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Patent Agency Ranking
公开(公告)号：US20230178302A1
公开(公告)日：2023-06-08
申请号：US17720729
申请日：2022-04-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Young Soo YI , Kun Ho KOO , San KYEONG , Hai Joon LEE , Kyung Ryul LEE , Ho Yeol LEE
Abstract: A multilayer capacitor includes a body including a stack structure in which at least one first internal electrode and at least one second internal electrode are alternately stacked in a first direction with at least one dielectric layer interposed therebetween; and first and second external electrodes spaced apart from each other and disposed on the body to be respectively connected to the at least one first internal electrode and the at least one second internal electrode, wherein each of the first and second external electrodes includes a first conductive layer including a first conductive material and glass; and an oxide layer including an oxide and disposed on at least a portion of an external surface of the first conductive layer.
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公开(公告)号：US20220172898A1
公开(公告)日：2022-06-02
申请号：US17307388
申请日：2021-05-04
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jang Yeol LEE , Hye Min BANG , Tae Joon PARK , Hai Joon LEE
Abstract: A multilayer capacitor includes a body including a stack structure in which a plurality of dielectric layers are stacked and a plurality of internal electrodes are stacked with the dielectric layers interposed therebetween, external electrodes formed on an external surface of the body to be connected to the internal electrodes, and including a first electrode layer covering a first surface of the body to which the internal electrodes are exposed, and a second electrode layer covering the first electrode layer, a first metal oxide layer disposed between the first and second electrode layers and having a discontinuous region, and a second metal oxide layer covering at least a portion of a surface of the body on which the external electrodes are not disposed and having a multilayer structure.
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公开(公告)号：US20180144873A1
公开(公告)日：2018-05-24
申请号：US15651617
申请日：2017-07-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kyo Yeol LEE , Hai Joon LEE , Seung Mo LIM , Ho Phil JUNG , In Young KANG , Yun Hee KIM , Yun Sung KANG
CPC classification number: H01G4/33 , H01G4/008 , H01G4/1245 , H01G4/30
Abstract: A thin film capacitor includes a body including alternately stacked first and second electrode layers and dielectric layers on a substrate, the second electrode layer including a second lower electrode layer and a second upper electrode layer formed on the second lower electrode layer, the second lower electrode layer including a material having a higher band gap energy than the first electrode layer and the second upper electrode layer.
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公开(公告)号：US20170278637A1
公开(公告)日：2017-09-28
申请号：US15293944
申请日：2016-10-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ji Hyun PARK , Jong Bong LIM , Hai Joon LEE
CPC classification number: H01G4/306 , H01G4/01 , H01G4/012 , H01G4/12 , H01G4/232 , H01G4/236 , H01G4/33
Abstract: A multilayer ceramic capacitor (MLCC) includes: a ceramic body having a plurality of dielectric layers, first internal electrodes, and second internal electrodes; and a first external electrode and a second external electrode, disposed on an exterior of the ceramic body. A plurality of via electrodes are disposed in the ceramic body; a first via electrode connects the first internal electrodes to the first external electrode; a second via electrode connects the second internal electrodes to the second external electrode; and the plurality of via electrodes have a stepped shape, and a distance in a length direction from a first vertical edge of each step to a second vertical edge of each step in the plurality of via electrodes is increased in a direction from the substrate toward an upper portion of the ceramic body.
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公开(公告)号：US20170194419A1
公开(公告)日：2017-07-06
申请号：US15251565
申请日：2016-08-30
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hai Joon LEE , Makoto KOSAKI , Ji Hyun PARK , Jong Bong LIM
CPC classification number: H01L28/75 , H01L23/481 , H01L24/20 , H01L25/105 , H01L27/016 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/16227 , H01L2224/18 , H01L2224/48227 , H01L2224/73265 , H01L2224/73267 , H01L2225/1035 , H01L2225/1058 , H01L2924/15192 , H01L2924/15311 , H01L2924/19041 , H01L2924/19105
Abstract: An electronic component includes a body part and a via part. The body part includes first and second metal layers disposed with at least one dielectric layer interposed therebetween. The via part is disposed in the body part and includes first and second vias penetrating through the body part and selectively connected to the first and second metal layers, respectively. The first and second metal layers contain different metals. In some examples, a first insulating film is disposed between the first metal layer and the second via to electrically insulate the second via from the first metal layer, and a second insulating film is disposed between the second metal layer and the first via to electrically insulate the first via from the second metal layer. A method for forming the electronic component includes use of first and second etchants to selectively etch the first and second metal layers.
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