公开(公告)号：US09343432B2

公开(公告)日：2016-05-17

申请号：US14094996

申请日：2013-12-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chung-Sun Lee ,  Jung-Hwan Kim ,  Tae-Hong Kim ,  Hyun-Jung Song ,  Sun-Pil Youn

IPC: H01L23/48 ,  H01L21/82 ,  H01L21/56 ,  H01L25/065 ,  H01L23/31 ,  H01L25/10 ,  H01L25/00 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2224/81 ,  H01L2224/83

Abstract: A stack of semiconductor chips, a semiconductor device, and a method of manufacturing are disclosed. The stack of semiconductor chips may comprise a first chip of the stack, a second chip of the stack over the first chip, conductive bumps, a homogeneous integral underfill material, and a molding material. The conductive bumps may extend between an upper surface of the first chip and a lower surface of the second chip. The homogeneous integral underfill material may be interposed between the first chip and the second chip, encapsulate the conductive bumps, and extend along sidewalls of the second chip. The homogeneous integral underfill material may have an upper surface extending in a direction parallel to an upper surface of the second chip and located adjacent the upper surface of the second chip. The molding material may be on outer side surfaces of the homogeneous integral underfill material above the upper surface of the first chip, wherein, in view of a first cross sectional profile, the molding material is separated from sidewalls of the second chip by the homogeneous integral underfill material such that the molding material does not contact sidewalls of the second chip.

Abstract translation: 公开了一叠半导体芯片，半导体器件和制造方法。 堆叠的半导体芯片可以包括堆叠的第一芯片，第一芯片上的堆叠的第二芯片，导电凸块，均匀的整体底部填充材料和模制材料。 导电凸块可以在第一芯片的上表面和第二芯片的下表面之间延伸。 均匀整体的底部填充材料可以插入在第一芯片和第二芯片之间，封装导电凸块，并且沿着第二芯片的侧壁延伸。 均匀整体的底部填充材料可以具有在与第二芯片的上表面平行的方向上延伸并且位于第二芯片的上表面附近的上表面。 模制材料可以在第一芯片的上表面之上的均匀整体底部填充材料的外侧表面上，其中，从第一横截面轮廓的角度来看，模制材料通过均匀的积分与第二芯片的侧壁分离 底部填充材料，使得模制材料不接触第二芯片的侧壁。

公开(公告)号：US20230266876A1

公开(公告)日：2023-08-24

申请号：US18308859

申请日：2023-04-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joon-Kyu SEO ,  Kyung-A Kang ,  Ji-Yeon Kwak ,  Hyun-Jin Kim ,  Hyun-Jung Song ,  Sung-Sik Yoo ,  Ju-Youn Lee ,  Dong-Seok Ryu ,  Min-Kyu Park

IPC: G06F3/04883 ,  H04M1/02 ,  G06F1/16 ,  G06F3/04845 ,  G06F3/04847 ,  G06F3/0485 ,  G06F3/0486 ,  G09G5/14 ,  G06F3/14 ,  G06F3/041 ,  H04M1/724 ,  G06F3/0484 ,  G06F3/04842 ,  G06F3/0488 ,  G06F3/04817

CPC classification number: G06F3/04883 ,  H04M1/0241 ,  H04M1/0214 ,  G06F1/1641 ,  G06F1/1643 ,  G06F1/1647 ,  G06F3/04845 ,  G06F3/04847 ,  G06F3/0485 ,  G06F3/0486 ,  G09G5/14 ,  G06F3/1431 ,  G06F3/1438 ,  G06F3/0416 ,  H04M1/724 ,  G06F3/0484 ,  G06F1/1616 ,  G06F3/041 ,  G06F3/04842 ,  G06F3/0488 ,  G06F1/1652 ,  G06F3/04817 ,  G06F2203/04102 ,  G06F2203/04806 ,  G09G2380/14 ,  G06F3/0482

Abstract: A method of controlling a portable device including first and second touch screens is provided. The method includes displaying first information related to a first application on the first touch screen and displaying second information related to the first application on the second touch screen; receiving a first user input moving to the first touch screen on the second touch screen; and replacing the first information and the second information with a third information and a fourth information related to the first application on the first and second touch screens, in response to receiving the first user input, wherein each of the third information and the fourth information is displayed while being slidden from the second touch screen to the first touch screen and the third information is displayed over a boundary between the first and second screens during the sliding of the third and fourth information.

公开(公告)号：US11640238B2

公开(公告)日：2023-05-02

申请号：US17579276

申请日：2022-01-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joon-Kyu Seo ,  Kyung-A Kang ,  Ji-Yeon Kwak ,  Hyun-Jin Kim ,  Hyun-Jung Song ,  Sung-Sik Yoo ,  Ju-Youn Lee ,  Dong-Seok Ryu ,  Min-Kyu Park

IPC: G06F3/04883 ,  G06F3/041 ,  H04M1/02 ,  G06F1/16 ,  G06F3/04845 ,  G06F3/04847 ,  G06F3/0485 ,  G06F3/0486 ,  G09G5/14 ,  G06F3/14 ,  H04M1/724 ,  G06F3/0484 ,  G06F3/04842 ,  G06F3/0488 ,  G06F3/04817 ,  G06F3/0482 ,  G06F3/04886

Abstract: A method of controlling a portable device including first and second touch screens is provided. The method includes displaying first information related to a first application on the first touch screen and displaying second information related to the first application on the second touch screen; receiving a first user input moving to the first touch screen on the second touch screen; and replacing the first information and the second information with a third information and a fourth information related to the first application on the first and second touch screens, in response to receiving the first user input, wherein each of the third information and the fourth information is displayed while being slidden from the second touch screen to the first touch screen and the third information is displayed over a boundary between the first and second screens during the sliding of the third and fourth information.

公开(公告)号：US10776001B2

公开(公告)日：2020-09-15

申请号：US16834705

申请日：2020-03-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joon-kyu Seo ,  Kyung-a Kang ,  Ji-yeon Kwak ,  Hyun-Jin Kim ,  Hyun-Jung Song ,  Sung-Sik Yoo ,  Ju-youn Lee ,  Dong-Seok Ryu ,  Min-Kyu Park

IPC: G06F3/041 ,  G06F3/0488 ,  G06F1/16 ,  G06F3/0484 ,  G06F3/14 ,  G09G5/14 ,  G06F3/0486 ,  G06F3/0485 ,  H04M1/725 ,  H04M1/02 ,  G06F3/0481 ,  G06F3/0482

Abstract: A controlling a portable device comprising a first touch screen and a second touch screen is provided. The method includes displaying first information related to a first application on the first touch screen and displaying second information related to the first application on the second touch screen; receiving a first user input moving to the first touch screen on the second touch screen; and replacing the first information and the second information with a third information and a fourth information related to the first application on the first touch screen and the second touch screen, in response to receiving the first user input, wherein each of the third information and the fourth information is displayed while being slidden in direction from the second touch screen to the first touch screen and the third information is displayed over a boundary between the first touch screen and the second screen during the sliding of the third information and the fourth information.

公开(公告)号：US10459625B2

公开(公告)日：2019-10-29

申请号：US15344665

申请日：2016-11-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joon-kyu Seo ,  Kyung-A Kang ,  Ji-yeon Kwak ,  Hyun-jin Kim ,  Hyun-Jung Song ,  Sung-Sik Yoo ,  Ju-Youn Lee ,  Dong-Seok Ryu ,  Min-Kyu Park

IPC: G06F3/041 ,  G06F3/0488 ,  G06F1/16 ,  G06F3/0484 ,  G06F3/0485 ,  G06F3/0486 ,  G06F3/14 ,  G09G5/14 ,  G06F3/0481 ,  H04M1/02 ,  H04M1/725 ,  G06F3/0482

Abstract: A controlling a portable device comprising a first touch screen and a second touch screen is provided. The method includes displaying first information related to a first application on the first touch screen and displaying second information related to the first application on the second touch screen; receiving a first user input moving to the first touch screen on the second touch screen; and replacing the first information and the second information with a third information and a fourth information related to the first application on the first touch screen and the second touch screen, in response to receiving the first user input, wherein each of the third information and the fourth information is displayed while being slidden in direction from the second touch screen to the first touch screen and the third information is displayed over a boundary between the first touch screen and the second screen during the sliding of the third information and the fourth information.

公开(公告)号：US09159659B2

公开(公告)日：2015-10-13

申请号：US13835969

申请日：2013-03-15

Applicant: SAMSUNG Electronics Co., Ltd.

Inventor： Sang-Won Kim ,  Kwang-Chul Choi ,  Hyun-Jung Song ,  Cha-Jea Jo ,  Eun-Kyoung Choi ,  Ji-Seok Hong

IPC: H01L23/49 ,  H01L23/498 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  H01L23/48 ,  H01L25/065 ,  H01L29/06 ,  H01L21/768

CPC classification number: H01L23/49811 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/76898 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L29/0657 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2924/15156 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2924/00

Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip and a sealing member. The first semiconductor chip includes a substrate having a first surface and a second surface opposite to the first surface and having an opening that extends in a predetermined depth from the second surface, and a plurality of through electrodes extending in a thickness direction from the first surface, end portions of the through electrodes being exposed through a bottom surface of the opening. The second semiconductor chip is received in the opening and mounted on the bottom surface of the opening. The sealing member covers the second semiconductor chip in the opening.

Abstract translation: 半导体封装包括第一半导体芯片，第二半导体芯片和密封构件。 第一半导体芯片包括具有与第一表面相对的第一表面和第二表面的基板，并且具有从第二表面以预定深度延伸的开口，以及从厚度方向从第一表面延伸的多个贯穿电极 通孔的端部通过开口的底表面露出。 第二半导体芯片被容纳在开口中并安装在开口的底表面上。 密封构件覆盖开口中的第二半导体芯片。

公开(公告)号：US08816509B2

公开(公告)日：2014-08-26

申请号：US13733481

申请日：2013-01-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji-Seok Hong ,  Kwang-chul Choi ,  Sangwon Kim ,  Hyun-Jung Song ,  Eun-Kyoung Choi

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/02 ,  H01L23/00 ,  H01L21/56 ,  H01L23/29 ,  H01L25/065 ,  H01L25/00 ,  H01L23/31

CPC classification number: H01L23/29 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3114 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2224/29017 ,  H01L2224/29036 ,  H01L2224/29099 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/33051 ,  H01L2224/33505 ,  H01L2224/73104 ,  H01L2224/81191 ,  H01L2224/81201 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/83986 ,  H01L2224/84201 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/0665 ,  H01L2924/01014 ,  H01L2924/014 ,  H01L2924/00012

Abstract: A semiconductor package includes first and second semiconductor elements electrically interconnected by a connection structure. The first and second semiconductor elements are joined by a protection structure that includes an adhesive layer surrounded by a retention layer.

Abstract translation: 半导体封装包括通过连接结构电互连的第一和第二半导体元件。 第一和第二半导体元件通过保护结构连接，保护结构包括由保持层包围的粘合剂层。