公开(公告)号：US08901749B2

公开(公告)日：2014-12-02

申请号：US14170972

申请日：2014-02-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hye-Jin Kim ,  Byung-Seo Kim ,  Sun-Pil Youn

IPC: H01L23/48 ,  H01L23/02 ,  H01L25/065 ,  H01L25/18 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L24/48 ,  H01L24/49 ,  H01L25/18 ,  H01L2224/05553 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/4911 ,  H01L2225/06506 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A plurality of semiconductor chips may be stacked on the substrate, and each of them may include at least one electrode pad. At least one of the plurality of semiconductor chips may include at least one redistribution pad configured to electrically connect with the at least one electrode pad.

Abstract translation: 多个半导体芯片可以堆叠在基板上，并且它们中的每一个可以包括至少一个电极焊盘。 多个半导体芯片中的至少一个可以包括被配置为与至少一个电极焊盘电连接的至少一个再分布焊盘。

公开(公告)号：US08809888B2

公开(公告)日：2014-08-19

申请号：US13800188

申请日：2013-03-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yu-Sik Kim ,  Seong-Deok Hwang ,  Seung-Jae Lee ,  Sun-Pil Youn

IPC: H01L33/00

CPC classification number: H01L33/48 ,  H01L33/20 ,  H01L33/24 ,  H01L33/405 ,  H01L33/44 ,  H01L33/46 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/05186 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/13 ,  H01L2224/48091 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/0542 ,  H01L2924/0543 ,  H01L2924/0544

Abstract: Provided is a light emitting element, a light emitting device including the same, and fabrication methods of the light emitting element and light emitting device. The light emitting device comprises a substrate, a light emitting structure including a first conductive layer of a first conductivity type, a light emitting layer, and a second conductive layer of a second conductivity type which are sequentially stacked, a first electrode which is electrically connected with the first conductive layer; and a second electrode which is electrically connected with the second conductive layer and separated apart from the first electrode, wherein at least a part of the second electrode is connected from a top of the light emitting structure, through a sidewall of the light emitting structure, and to a sidewall of the substrate.

Abstract translation: 提供了一种发光元件，包括该发光元件的发光器件，以及发光元件和发光器件的制造方法。 发光装置包括基板，发光结构，其包括依次堆叠的第一导电类型的第一导电层，发光层和第二导电类型的第二导电层，电连接的第一电极 与第一导电层; 以及与所述第二导电层电连接并与所述第一电极分离的第二电极，其中所述第二电极的至少一部分通过所述发光结构的侧壁从所述发光结构的顶部连接， 和衬底的侧壁。

公开(公告)号：US09269877B2

公开(公告)日：2016-02-23

申请号：US14079177

申请日：2013-11-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yu-Sik Kim ,  Seong-Deok Hwang ,  Seung-Jae Lee ,  Sun-Pil Youn

IPC: H01L33/58 ,  H01L33/22 ,  H01L33/50 ,  H01L33/00 ,  H01L33/20 ,  H01L23/00

CPC classification number: H01L33/58 ,  H01L24/32 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/20 ,  H01L33/22 ,  H01L33/50 ,  H01L2224/06102 ,  H01L2224/13 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00011 ,  H01L2224/45099

Abstract: Provided are a method of fabricating a light-emitting apparatus with improved light extraction efficiency and a light-emitting apparatus fabricated using the method. The method includes: preparing a monocrystalline substrate; forming an intermediate structure on the substrate, the intermediate structure comprising a light-emitting structure which comprises a first conductive pattern of a first conductivity type, a light-emitting pattern, and a second conductive pattern of a second conductivity type stacked sequentially, a first electrode which is electrically connected to the first conductive pattern, and a second electrode which is electrically connected to the second conductive pattern; forming a polycrystalline region, which extends in a horizontal direction, by irradiating a laser beam to the substrate in the horizontal direction such that the laser beam is focused on a beam-focusing point within the substrate; and cutting the substrate in the horizontal direction along the polycrystalline region.

Abstract translation: 提供了一种制造具有改进的光提取效率的发光装置的方法和使用该方法制造的发光装置。 该方法包括：制备单晶衬底; 在所述基板上形成中间结构，所述中间结构包括发光结构，所述发光结构包括依次堆叠的第一导电类型的第一导电图案，发光图案和第二导电类型的第二导电图案，第一导电图案 电连接到第一导电图案的电极和与第二导电图案电连接的第二电极; 通过在水平方向上将激光束照射到基板上，使得激光束聚焦在基板内的光束聚焦点上，形成沿水平方向延伸的多晶区域; 以及沿着多晶区沿水平方向切割基板。

公开(公告)号：US09184156B2

公开(公告)日：2015-11-10

申请号：US14491302

申请日：2014-09-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hye-Jin Kim ,  Byung-seo Kim ,  Sun-Pil Youn

IPC: H01L23/52 ,  H01L25/065 ,  H01L23/00 ,  H01L25/18

CPC classification number: H01L25/0657 ,  H01L24/48 ,  H01L24/49 ,  H01L25/18 ,  H01L2224/05553 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/4911 ,  H01L2225/06506 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A plurality of semiconductor chips may be stacked on the substrate, and each of them may include at least one electrode pad. At least one of the plurality of semiconductor chips may include at least one redistribution pad configured to electrically connect with the at least one electrode pad.

Abstract translation: 多个半导体芯片可以堆叠在基板上，并且它们中的每一个可以包括至少一个电极焊盘。 多个半导体芯片中的至少一个可以包括被配置为与至少一个电极焊盘电连接的至少一个再分布焊盘。

公开(公告)号：US20150001737A1

公开(公告)日：2015-01-01

申请号：US14491302

申请日：2014-09-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hye-Jin Kim ,  Byung-seo Kim ,  Sun-Pil Youn

IPC: H01L25/065

CPC classification number: H01L25/0657 ,  H01L24/48 ,  H01L24/49 ,  H01L25/18 ,  H01L2224/05553 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/4911 ,  H01L2225/06506 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A plurality of semiconductor chips may be stacked on the substrate, and each of them may include at least one electrode pad. At least one of the plurality of semiconductor chips may include at least one redistribution pad configured to electrically connect with the at least one electrode pad.

Abstract translation: 多个半导体芯片可以堆叠在基板上，并且它们中的每一个可以包括至少一个电极焊盘。 多个半导体芯片中的至少一个可以包括被配置为与至少一个电极焊盘电连接的至少一个再分布焊盘。

公开(公告)号：US20140061710A1

公开(公告)日：2014-03-06

申请号：US14079177

申请日：2013-11-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yu-Sik Kim ,  Seong-Deok Hwang ,  Seung-Jae Lee ,  Sun-Pil Youn

IPC: H01L33/58 ,  H01L33/22 ,  H01L33/50

CPC classification number: H01L33/58 ,  H01L24/32 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/20 ,  H01L33/22 ,  H01L33/50 ,  H01L2224/06102 ,  H01L2224/13 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00011 ,  H01L2224/45099

Abstract: Provided are a method of fabricating a light-emitting apparatus with improved light extraction efficiency and a light-emitting apparatus fabricated using the method. The method includes: preparing a monocrystalline substrate; forming an intermediate structure on the substrate, the intermediate structure comprising a light-emitting structure which comprises a first conductive pattern of a first conductivity type, a light-emitting pattern, and a second conductive pattern of a second conductivity type stacked sequentially, a first electrode which is electrically connected to the first conductive pattern, and a second electrode which is electrically connected to the second conductive pattern; forming a polycrystalline region, which extends in a horizontal direction, by irradiating a laser beam to the substrate in the horizontal direction such that the laser beam is focused on a beam-focusing point within the substrate; and cutting the substrate in the horizontal direction along the polycrystalline region.

Abstract translation: 提供了一种制造具有改进的光提取效率的发光装置的方法和使用该方法制造的发光装置。 该方法包括：制备单晶基板; 在所述基板上形成中间结构，所述中间结构包括发光结构，所述发光结构包括依次堆叠的第一导电类型的第一导电图案，发光图案和第二导电类型的第二导电图案，第一导电图案 电连接到第一导电图案的电极和与第二导电图案电连接的第二电极; 通过在水平方向上将激光束照射到基板上，使得激光束聚焦在基板内的光束聚焦点上，形成沿水平方向延伸的多晶区域; 以及沿着多晶区沿水平方向切割基板。

公开(公告)号：US09343432B2

公开(公告)日：2016-05-17

申请号：US14094996

申请日：2013-12-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chung-Sun Lee ,  Jung-Hwan Kim ,  Tae-Hong Kim ,  Hyun-Jung Song ,  Sun-Pil Youn

IPC: H01L23/48 ,  H01L21/82 ,  H01L21/56 ,  H01L25/065 ,  H01L23/31 ,  H01L25/10 ,  H01L25/00 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2224/81 ,  H01L2224/83

Abstract: A stack of semiconductor chips, a semiconductor device, and a method of manufacturing are disclosed. The stack of semiconductor chips may comprise a first chip of the stack, a second chip of the stack over the first chip, conductive bumps, a homogeneous integral underfill material, and a molding material. The conductive bumps may extend between an upper surface of the first chip and a lower surface of the second chip. The homogeneous integral underfill material may be interposed between the first chip and the second chip, encapsulate the conductive bumps, and extend along sidewalls of the second chip. The homogeneous integral underfill material may have an upper surface extending in a direction parallel to an upper surface of the second chip and located adjacent the upper surface of the second chip. The molding material may be on outer side surfaces of the homogeneous integral underfill material above the upper surface of the first chip, wherein, in view of a first cross sectional profile, the molding material is separated from sidewalls of the second chip by the homogeneous integral underfill material such that the molding material does not contact sidewalls of the second chip.

Abstract translation: 公开了一叠半导体芯片，半导体器件和制造方法。 堆叠的半导体芯片可以包括堆叠的第一芯片，第一芯片上的堆叠的第二芯片，导电凸块，均匀的整体底部填充材料和模制材料。 导电凸块可以在第一芯片的上表面和第二芯片的下表面之间延伸。 均匀整体的底部填充材料可以插入在第一芯片和第二芯片之间，封装导电凸块，并且沿着第二芯片的侧壁延伸。 均匀整体的底部填充材料可以具有在与第二芯片的上表面平行的方向上延伸并且位于第二芯片的上表面附近的上表面。 模制材料可以在第一芯片的上表面之上的均匀整体底部填充材料的外侧表面上，其中，从第一横截面轮廓的角度来看，模制材料通过均匀的积分与第二芯片的侧壁分离 底部填充材料，使得模制材料不接触第二芯片的侧壁。

公开(公告)号：US20130193474A1

公开(公告)日：2013-08-01

申请号：US13800188

申请日：2013-03-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yu-Sik Kim ,  Seong-Deok Hwang ,  Seung-Jae Lee ,  Sun-Pil Youn

IPC: H01L33/48

CPC classification number: H01L33/48 ,  H01L33/20 ,  H01L33/24 ,  H01L33/405 ,  H01L33/44 ,  H01L33/46 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/05186 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/13 ,  H01L2224/48091 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/0542 ,  H01L2924/0543 ,  H01L2924/0544

Abstract: Provided is a light emitting element, a light emitting device including the same, and fabrication methods of the light emitting element and light emitting device. The light emitting device comprises a substrate, a light emitting structure including a first conductive layer of a first conductivity type, a light emitting layer, and a second conductive layer of a second conductivity type which are sequentially stacked, a first electrode which is electrically connected with the first conductive layer; and a second electrode which is electrically connected with the second conductive layer and separated apart from the first electrode, wherein at least a part of the second electrode is connected from a top of the light emitting structure, through a sidewall of the light emitting structure, and to a sidewall of the substrate.

Abstract translation: 提供了一种发光元件，包括该发光元件的发光器件，以及发光元件和发光器件的制造方法。 发光装置包括基板，发光结构，其包括依次堆叠的第一导电类型的第一导电层，发光层和第二导电类型的第二导电层，电连接的第一电极 与第一导电层; 以及与所述第二导电层电连接并与所述第一电极分离的第二电极，其中所述第二电极的至少一部分通过所述发光结构的侧壁从所述发光结构的顶部连接， 和衬底的侧壁。