公开(公告)号：US20250157995A1

公开(公告)日：2025-05-15

申请号：US19025166

申请日：2025-01-16

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Kazunori WATANABE ,  Koji KUSUNOKI ,  Taiki NONAKA ,  Hiroki ADACHI ,  Koichi TAKESHIMA

IPC: H01L25/075 ,  H10D30/67 ,  H10D86/40 ,  H10D86/60 ,  H10D87/00 ,  H10H20/857

Abstract: A display device with high display quality and low power consumption is provided. In the display device, a first transistor, a second transistor, a first conductive layer, and a light-emitting diode package are included in a pixel, and then the light-emitting diode package includes a first light-emitting diode, a second light-emitting diode, a second conductive layer, a third conductive layer, and a fourth conductive layer. One of a source and a drain of the first transistor is electrically connected to the first light-emitting diode through the second conductive layer. One of a source and a drain of the second transistor is electrically connected to the second light-emitting diode through the third conductive layer. The first conductive layer supplied with a constant potential is electrically connected to the other electrodes of the first and second light-emitting diodes through the fourth conductive layer.

公开(公告)号：US20240413130A1

公开(公告)日：2024-12-12

申请号：US18679945

申请日：2024-05-31

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Kazunori WATANABE ,  Koji KUSUNOKI ,  Taiki NONAKA ,  Hiroki ADACHI ,  Koichi TAKESHIMA

IPC: H01L25/075 ,  H01L27/12 ,  H01L29/786 ,  H01L33/62

Abstract: A display device with high display quality is provided. A display device with low power consumption is provided. In the display device, a first transistor, a second transistor, a first conductive layer, and a light-emitting diode package are included in a pixel. The light-emitting diode package includes a first light-emitting diode, a second light-emitting diode, a second conductive layer, a third conductive layer, and a fourth conductive layer. The first light-emitting diode includes a first electrode and a second electrode. The second light-emitting diode includes a third electrode and a fourth electrode. One of a source and a drain of the first transistor is electrically connected to the first electrode through the second conductive layer.
10 One of a source and a drain of the second transistor is electrically connected to the third electrode through the third conductive layer. The first conductive layer is electrically connected to each of the second electrode and the fourth electrode through the fourth conductive layer. A constant potential is supplied to the first conductive layer.

公开(公告)号：US20220216243A1

公开(公告)日：2022-07-07

申请号：US17701961

申请日：2022-03-23

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Yasuharu HOSAKA ,  Satoru IDOJIRI ,  Kenichi OKAZAKI ,  Hiroki ADACHI ,  Daisuke KUBOTA

IPC: H01L27/12 ,  H01L21/683 ,  H01L29/66 ,  H01L29/786

Abstract: A peeling method at low cost with high mass productivity is provided. A resin layer having a thickness greater than or equal to 0.1 μm and less than or equal to 3 μm is formed over a formation substrate using a photosensitive and thermosetting material, a transistor including an oxide semiconductor in a channel formation region is formed over the resin layer, the resin layer is irradiated with light using a linear laser device, and the transistor and the formation substrate are separated from each other. A first region and a second region which is thinner than the first region or an opening can be formed in the resin layer. In the case of forming a conductive layer functioning as an external connection terminal or the like to overlap with the second region or the opening of the resin layer, the conductive layer is exposed.

公开(公告)号：US20200251547A1

公开(公告)日：2020-08-06

申请号：US16856139

申请日：2020-04-23

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Masakatsu OHNO ,  Hiroki ADACHI ,  Satoru IDOJIRI ,  Koichi TAKESHIMA

IPC: H01L27/32 ,  H01L51/00 ,  H01L51/56 ,  H01L51/52 ,  H01L27/12 ,  H01L29/24 ,  H01L29/66 ,  H01L29/786 ,  B23K26/0622 ,  B23K26/04 ,  B23K26/06 ,  B23K26/08

Abstract: A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

公开(公告)号：US20170334187A1

公开(公告)日：2017-11-23

申请号：US15610890

申请日：2017-06-01

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Kayo KUMAKURA ,  Tomoya AOYAMA ,  Akihiro CHIDA ,  Kohei YOKOYAMA ,  Masakatsu OHNO ,  Satoru IDOJIRI ,  Hisao IKEDA ,  Hiroki ADACHI ,  Yoshiharu HIRAKATA ,  Shingo EGUCHI ,  Yasuhiro JINBO

IPC: B32B43/00 ,  H01L21/67 ,  H01L51/56 ,  G02B6/00 ,  B26D1/04 ,  B26D1/00 ,  H01L27/32 ,  H01L27/12 ,  B32B38/10

CPC classification number: B32B43/006 ,  B26D1/04 ,  B26D2001/006 ,  B32B38/10 ,  B32B2457/00 ,  G02B6/00 ,  H01L21/67092 ,  H01L27/1248 ,  H01L27/3258 ,  H01L27/3262 ,  H01L51/56 ,  H01L2221/68327 ,  H01L2227/323 ,  H01L2251/5338 ,  Y10T156/1126 ,  Y10T156/1132 ,  Y10T156/1168 ,  Y10T156/1179 ,  Y10T156/1184 ,  Y10T156/1928 ,  Y10T156/1933 ,  Y10T156/1944 ,  Y10T156/1961 ,  Y10T156/1967 ,  Y10T156/1989

Abstract: A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.

公开(公告)号：US20170309731A1

公开(公告)日：2017-10-26

申请号：US15486545

申请日：2017-04-13

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Junpei YANAKA ,  Seiji YASUMOTO ,  Masakatsu OHNO ,  Hiroki ADACHI

IPC: H01L29/66 ,  H01L21/02 ,  H01L21/311

CPC classification number: H01L29/66969 ,  H01L21/02532 ,  H01L21/02609 ,  H01L21/02623 ,  H01L21/31116

Abstract: A low-cost separation method with high mass productivity is provided. A first layer with a thickness of 0.1 μm or more and 3 μm or less can be formed by using a photosensitive and thermosetting material over the formation substrate, a resin layer comprising an opening is formed by forming an opening in the first layer by using a photolithography method, a silicon layer or an oxide layer is formed so as to overlap with the opening of the resin layer, a transistor including a metal oxide is formed over the resin layer, a conductive layer formed in the same manufacturing steps as the source or drain of the transistor is formed over the silicon layer or the oxide layer, the resin layer and one of the silicon layer and the oxide layer are irradiated with the laser light, and the transistor and the conductive layer are separated from the formation substrate.

公开(公告)号：US20170133450A1

公开(公告)日：2017-05-11

申请号：US15416166

申请日：2017-01-26

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Masakatsu OHNO ,  Hiroki ADACHI ,  Satoru IDOJIRI ,  Koichi TAKESHIMA

IPC: H01L27/32 ,  H01L51/00 ,  H01L51/52 ,  H01L51/56

CPC classification number: H01L27/3272 ,  B23K26/04 ,  B23K26/0617 ,  B23K26/0622 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/083 ,  H01L27/1225 ,  H01L27/1266 ,  H01L27/322 ,  H01L27/3244 ,  H01L27/3258 ,  H01L27/3262 ,  H01L29/24 ,  H01L29/66969 ,  H01L29/78603 ,  H01L29/7869 ,  H01L41/314 ,  H01L51/0024 ,  H01L51/0027 ,  H01L51/003 ,  H01L51/0097 ,  H01L51/5096 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5284 ,  H01L51/56 ,  H01L2227/323 ,  H01L2227/326 ,  H01L2251/5338 ,  H01L2251/558 ,  Y02E10/549 ,  Y02P70/521

Abstract: A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

公开(公告)号：US20170102598A1

公开(公告)日：2017-04-13

申请号：US15285096

申请日：2016-10-04

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Masataka NAKADA ,  Masahiro KATAYAMA ,  Seiji YASUMOTO ,  Hiroki ADACHI ,  Masataka SATO ,  Koji KUSUNOKI ,  Yoshiharu HIRAKATA

IPC: G02F1/1362 ,  G06F3/01 ,  G02F1/1335 ,  G06F3/041 ,  G02F1/1345 ,  G02F1/1333

CPC classification number: G02F1/136286 ,  G02F1/13338 ,  G06F3/0412 ,  G06F2203/04103 ,  H01L27/1225 ,  H01L27/124 ,  H01L27/1255

Abstract: Provided is a novel display panel that is highly convenient or highly reliable, a novel input/output device that is highly convenient or highly reliable, or a method for manufacturing a novel display panel that is highly convenient or highly reliable. The present inventors conceived a structure including a first intermediate film, a first electrode including a region in contact with the first intermediate film, a pixel that includes a first display element including the first electrode and a pixel circuit electrically connected to the first display element, a signal line electrically connected to the pixel, and a terminal that includes a third conductive film electrically connected to the signal line and a second intermediate film including a region in contact with the third conductive film.

公开(公告)号：US20170040402A1

公开(公告)日：2017-02-09

申请号：US15221733

申请日：2016-07-28

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Seiji YASUMOTO ,  Hiroki ADACHI ,  Masataka SATO ,  Koji KUSUNOKI ,  Yoshiharu HIRAKATA

IPC: H01L27/32 ,  G02F1/1362 ,  G09G3/20 ,  G02F1/1335 ,  G06F3/01 ,  H01L27/12 ,  G02F1/1368

CPC classification number: H01L29/7869 ,  G02F1/133553 ,  G02F2201/44 ,  G09G3/2092 ,  G09G3/3648 ,  G09G5/34 ,  G09G2300/023 ,  G09G2300/046 ,  G09G2300/0465 ,  G09G2310/0205 ,  G09G2320/0242 ,  G09G2320/0626 ,  G09G2320/066 ,  G09G2320/0666 ,  G09G2320/103 ,  G09G2330/021 ,  G09G2340/0435 ,  G09G2360/144 ,  H01L27/1225 ,  H01L27/1237 ,  H01L27/124 ,  H01L27/1248 ,  H01L27/1255 ,  H01L27/1262 ,  H01L27/3258 ,  H01L27/3276 ,  H01L29/78648 ,  H01L29/78696

Abstract: A novel display panel that is highly convenient or reliable is provided. A structure in invented which includes a first display element, a first conductive film, a second conductive film, a first insulating film, an intermediate film, a pixel circuit, and a second display element. The first conductive film is electrically connected to the first display element. The second conductive film includes a region overlapping with the first conductive film. The first insulating film includes a region located between the second conductive film and the first conductive film. The first conductive film is located between the second conductive film and part of the intermediate film. The pixel circuit is electrically connected to the second conductive film. The second display element is electrically connected to the pixel circuit. The first insulating film has an opening. The second conductive film is electrically connected to the first conductive film through the opening.

Abstract translation: 提供了一种非常方便或可靠的新型显示面板。 本发明的一种结构包括第一显示元件，第一导电膜，第二导电膜，第一绝缘膜，中间膜，像素电路和第二显示元件。 第一导电膜电连接到第一显示元件。 第二导电膜包括与第一导电膜重叠的区域。 第一绝缘膜包括位于第二导电膜和第一导电膜之间的区域。 第一导电膜位于第二导电膜和中间膜的一部分之间。 像素电路与第二导电膜电连接。 第二显示元件电连接到像素电路。 第一绝缘膜具有开口。 第二导电膜通过开口与第一导电膜电连接。

公开(公告)号：US20160347047A1

公开(公告)日：2016-12-01

申请号：US15165099

申请日：2016-05-26

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Saki Eguchi ,  Koichi TAKESHIMA ,  Hiroki ADACHI

IPC: B32B43/00 ,  H01L21/683

CPC classification number: B32B43/006 ,  B32B37/003 ,  B32B37/22 ,  B32B38/10 ,  B32B2457/14 ,  B32B2457/20 ,  H01L21/67132 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/6835 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2221/6839 ,  H01L2221/68395

Abstract: A yield in a separation process is improved. A separation apparatus which enables easy separation in a large-area substrate is provided. The separation apparatus has a function of dividing a process member into a first member and a second member and includes a support body supply unit, a support body hold unit, a transfer mechanism, a direction changing mechanism, and a structure body. The structure body bonds a support body to a surface of the first member. When at least part of the process member is located between the direction changing mechanism and the structure body or the pressure applying mechanism, the shortest distance between the direction changing mechanism and a first plane including the surface of the first member is longer than the shortest distance between the first plane and the structure body or the pressure applying mechanism.

Abstract translation: 提高分离过程中的产率。 提供了一种能够在大面积基板中容易分离的分离装置。 分离装置具有将处理构件分割成第一构件和第二构件的功能，并且包括支撑体供给单元，支撑体保持单元，转移机构，方向改变机构和结构体。 结构体将支撑体结合到第一构件的表面。 当处理构件的至少一部分位于方向改变机构和结构体或压力施加机构之间时，方向改变机构与包括第一构件的表面的第一平面之间的最短距离比最短距离 在第一平面和结构体或压力施加机构之间。