摘要:
A semiconductor memory device is proposed wherein at least an array comprising a plurality of memory cells each having at least one capacity, a select mechanism for specifying the position of each memory cell, data lines connected to said memory cells for transmitting the data and a data writing and a data reading mechanisms are provided. The feature of this device lies in that the voltage generator for serially generating three or more values of the voltage which are different from each other and the means for applying said voltage to said memory cells are provided on the same semiconductor board as the same said memory cells, and as the said reading mechanism the column register is provided which, as said reading mechanism, has the mechanism for deciding the data, transfer gate which is provided between said deciding means and said data line, and the bias charge transfer mechanism which is provided between said transfer gate and said deciding mechanism, and having at least two or more memory elements for temporarily storing said decided data.
摘要:
A semiconductor memory using a dynamic memory device, wherein a battery supplies a power source voltage and a substrate bias voltage when the memory is cut off from an external device, and a refresh control circuit changes in refresh timing of the memory device in accordance with the leakage current of the memory device. The power consumption of the memory can thus be reduced and the data can be kept for an extended period without an external power source.
摘要:
A semiconductor memory device having a memory plane defined by a plurality of memory cells, a decoder line for accessing the memory cells, a common data line on which a signal output from an accessed memory cell is collected, and a sense amplifier for amplifying the signal collected on the common data line. The sense amplifier has an amplifying circuit portion which is composed of a pair of common-collector type bipolar transistors supplied with the signal collected on the common data line as a differential input, and a plurality of MOS transistors for converting a change in current into a change in voltage. Each of the MOS transistors has a lightly-doped drain structure.
摘要:
Disclosed is a semiconductor integrated circuit which comprises an n-type silicon substrate, a p-type well region having an opening at a part thereof, which is formed on the surface portion of the substrate, an MOS transistor formed in the p-type region and a resistance layer extended from the drain region of the MOS transistor to the opening of the p-type well region through a insulating film formed on the surface of the substrate, in which the drain region of the MOS transistor is electrically connected to the silicon substrate through the resistance layer so that a current is supplied to the MOS transistor.
摘要:
Disclosed is an MOSIC including a plurality of silicon gate type MOSFET's in which, after the polycrystalline silicon wirings are formed simultaneously with polycrystalline silicon gates, electrodes contacted with the source and drain regions are made of polycrystalline silicon so as to be connected to the polycrystalline silicon wirings, thereby to prevent the shallow pn junctions of the source and drain regions from being destroyed by the contacts and to provide a high degree of integration to one silicon chip.
摘要:
A semiconductor device including at least a resistance element formed of polycrystalline silicon having a high resistivity. An electrode is provided on the high resistance polycrystalline silicon region with a silicon dioxide film and a silicon nitride film being interposed therebetween. The electrode is coupled to the ground potential. In this manner, high stability is obtained in the behavior of the resistance element inasmuch as the formation of a parasitic MOS device under said high resistance region is suppressed, and the threshold voltage of any such MOS device is made raised.
摘要:
Disclosed is an MOSIC including a plurality of silicon gate type MOSFET's in which, after polycrystalline silicon wirings are formed simultaneously with polycrystalline silicon gates, the electrodes contacted with the source and drain regions are made of polycrystalline silicon so as to be connected to the polycrystalline silicon wirings, thereby to prevent the shallow pn junctions of the source and drain regions from being destroyed by the contacts and to provide a high degree of integration to one silicon chip.
摘要:
A semiconductor integrated circuit device is provided to include a vertical type MOSFET and a gate protection element for the MOSFET. The vertical type MOSFET is made up of a silicon layer of n-type conductivity formed on an n.sup.+ -type silicon substrate, a base region of p-type conductivity formed in the surface of the silicon layer of n-type conductivity, an n.sup.+ -type source region provided in the base region, and a gate electrode formed on a portion of the base region through a gate insulating film. The silicon substrate serves as the drain. The gate protection element is formed of a polycrystalline silicon layer which is provided on the base region through an insulating film and includes at least one pn junction. By virtue of forming the gate protection element over the base region rather than directly over the substrate, a more stable operation is achieved.
摘要:
On the surface of an insulating film formed on the surface of a semiconductor substrate on which an MOS type semiconductor device to be protected is formed, there are formed a first polycrystal silicon member having input and output terminals and a resistivity lower than 1 K.OMEGA./.quadrature. and a second polycrystalline silicon member having a resistivity lower than 1 K.OMEGA./.quadrature. and being maintained at a fixed potential. This second polycrystalline silicon member faces at least a part of the first silicon member with polycrystalline silicon of a resistivity higher than 100 K.OMEGA./.quadrature. interposed therebetween. The input terminal of the first polycrystalline silicon member is connected to an input pad of the MOS type semiconductor device to be protected and the output terminal of the first polycrystalline silicon member is connected to an input gate of the semiconductor device to be protected. The input gate of the semiconductor device is protected by utilizing the punch-through effect in the interior of the polycrystalline silicon having a resistivity higher than 100 K.OMEGA./.quadrature..
摘要:
A memory cell of the type employing a pair of cross-coupled CMOS inverters of a SRAM is disclosed in which the load MISFETs are stacked above the semiconductor substrate and over the drive MISFETs. Each load MISFET of a memory cell consists of a source, drain and channel region formed of a semiconductor strip, such as a polycrystalline silicon film strip, and a gate electrode consisting of a different layer conductive film than that of the drive MISFETs. In a memory cell having such a stacked arrangement, the source region and gate electrode of each load MISFET thereof are patterned to have a widely overlapping relationship with each other to form a capacitor element thereacross such that an increase in the overall capacitance associated with each of the memory cell storage nodes is effected thereby decreasing occurrence of soft error. The overlapping relationship for effecting the large capacitor element across the source and gate of the respective load MISFETs is provided by an ion implanting scheme of a p-type impurity into the semiconductor strip. A separate mask for ion-implantation for the formation of the source region of the load MISFET is added followed by the addition of the gate electrode thereof in a manner so as to have a widely overlapping relationship with that of the source region.