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公开(公告)号：US09166765B2
公开(公告)日：2015-10-20
申请号：US13963775
申请日：2013-08-09
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Hiroshi Nakamura , Tomohiro Igarashi
CPC classification number: H04L5/1461 , H01L23/3735 , H01L2224/16225 , H03H7/463 , H03H9/0547 , H03H9/08 , H04B1/0057 , H05K1/0207 , H05K1/0216 , H05K1/0237
Abstract: Provided is a high-frequency circuit module that has high mounting density. In a high-frequency circuit module, an RFIC that performs transmission and reception processes for high-frequency signals, a power amplifier IC that amplifies a transmission signal from the RFIC, and a duplexer that separates a transmission signal outputted from the power amplifier IC to an antenna and a reception signal that is inputted from the antenna to the RFIC are formed on the top surface thereof. The duplexer is disposed between the RFIC and the power amplifier IC.
Abstract translation: 提供了具有高安装密度的高频电路模块。 在高频电路模块中，执行高频信号的发送和接收处理的RFIC，放大来自RFIC的发送信号的功率放大器IC以及将从功率放大器IC输出的发送信号分离成的双工器 从天线向RFIC输入的天线和接收信号形成在其顶表面上。 双工器设置在RFIC和功率放大器IC之间。
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公开(公告)号：US09160825B2
公开(公告)日：2015-10-13
申请号：US14481779
申请日：2014-09-09
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Tetsuo Saji , Yohei Ichikawa , Hiroshi Nakamura
CPC classification number: H04M1/026 , H01L24/20 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/73267 , H01L2924/0002 , H01L2924/19105 , H04B1/38 , H04B1/3888 , H04B15/02 , H04B15/04 , H05K1/0218 , H05K1/0243 , H05K3/284 , H05K9/0022 , H05K9/0045 , H05K2201/0715 , H05K2201/10371 , H01L2924/00
Abstract: A communication module includes a circuit substrate having a first high-frequency processing section related to mobile phone communication, a second high-frequency processing section that processes reception signals related to satellite positioning systems, a system section having a baseband processing section and application processing section, and a power circuit section, a sealing member covering the electronic components mounted on the circuit substrate, a conductive shield layer formed on a surface of the sealing member, and a shield wall formed in the sealing member so as to demarcate a mounting area of the first high-frequency processing section and a mounting area of the second high-frequency processing section.
Abstract translation: 通信模块包括具有与移动电话通信相关的第一高频处理部分的电路基板，处理与卫星定位系统相关的接收信号的第二高频处理部分，具有基带处理部分和应用处理部分的系统部分 以及电源电路部，覆盖安装在电路基板上的电子部件的密封部件，形成在密封部件的表面上的导电性屏蔽层和形成在密封部件中的屏蔽壁， 第一高频处理部和第二高频处理部的安装区域。
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公开(公告)号：US20140051368A1
公开(公告)日：2014-02-20
申请号：US14056721
申请日：2013-10-17
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Tetsuo Saji , Hiroshi Nakamura
IPC: H04B15/00
Abstract: Provided is a high-frequency module that can prevent a transmission signal from reaching a reception circuit and that can achieve high mounting density. A first duplexer for a first frequency band is mounted on a circuit substrate, and a second transmission filter and a second reception filter that constitute a second duplexer for a second frequency band are embedded in the circuit substrate. The second transmission filter and the second reception filter are embedded in the circuit substrate in locations that overlap at least a part of a projection region that is formed by projecting the first duplexer in a thickness direction of the circuit substrate. The first frequency band and the second frequency band are separated from each other by at least a prescribed frequency range.
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公开(公告)号：US09641155B2
公开(公告)日：2017-05-02
申请号：US14565093
申请日：2014-12-09
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Shogo Inoue , Hiroshi Nakamura
CPC classification number: H03H9/725 , H03H9/0023 , H03H9/0071 , H03H9/0085 , H03H9/02669 , H03H9/542 , H03H9/585 , H03H9/6436 , H03H9/644 , H03H9/6483 , H03H9/6489 , H03H9/706
Abstract: A duplexer includes a reception filter that is connected between a reception terminal and an antenna terminal and includes one or a plurality of series resonators that are acoustic wave resonators, and a transmission filter that is connected between a transmission terminal and the antenna terminal and includes one or a plurality of acoustic wave resonators, a resonance frequency of a first series resonator that is one of the one or the plurality of series resonators and is closest to the antenna terminal in the reception filter being higher than an upper limit frequency of a reception band of the reception filter.
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公开(公告)号：US09590288B2
公开(公告)日：2017-03-07
申请号：US14701171
申请日：2015-04-30
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Tetsuo Saji , Hiroshi Nakamura
CPC classification number: H01P3/08 , H01P3/003 , H05K1/025 , H05K1/0253 , H05K1/0298 , H05K2201/09245
Abstract: A multilayer circuit substrate includes: a first signal line and a first ground conductor formed in a first conductive layer; and a second signal line and a second ground conductor formed in a second conductive layer, the second conductive layer facing the first conductive layer across an insulating layer. The first signal line intersects with the second signal line in a plan view of the multilayer circuit substrate, a space between the first ground conductor and first signal line is smaller in an intersection area of the first and second signal lines than a space in a non-intersection area, a space between the second ground conductor and second signal line is smaller in the intersection area than a space in the non-intersection area, and the first signal line is formed at a smaller line width in the intersection area than in the non-intersection area.
Abstract translation: 多层电路基板包括：第一信号线和形成在第一导电层中的第一接地导体; 以及形成在第二导电层中的第二信号线和第二接地导体，所述第二导电层跨过绝缘层面向所述第一导电层。 第一信号线在多层电路基板的俯视图中与第二信号线相交，在第一和第二信号线的交叉区域中，第一接地导体与第一信号线之间的间隔比非非空 在第二接地导体和第二信号线之间的空间在交叉区域中比非交叉区域中的空间小，并且第一信号线形成在交叉区域中比在 非交叉区域。
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Patent Agency Ranking
公开(公告)号：US09456488B2
公开(公告)日：2016-09-27
申请号：US14090445
申请日：2013-11-26
Applicant: Taiyo Yuden Co., Ltd.
Inventor： Masaya Shimamura , Takehiko Kai , Eiji Mugiya , Tetsuo Saji , Hiroshi Nakamura
CPC classification number: H05K1/0216 , H01L21/561 , H01L23/3135 , H01L23/552 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/12042 , H01L2924/15159 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , H05K1/0215 , H05K1/0269 , H05K3/284 , H05K5/065 , H05K9/0037 , H05K9/0083 , H05K2201/09036 , H05K2201/09145 , H05K2201/09972 , H05K2201/1056 , H01L2224/81 , H01L2924/00 , H01L2924/00012
Abstract: There is provided a circuit module including a circuit substrate having a mount surface; a mount component mounted on the mount surface; a sealing body formed on the mount surface, the sealing body covering the mount component and having a trench formed from a main surface of the sealing body to the mount surface; and a shield having an inner shield section formed within the trench and an outer shield section that covers the sealing body and the inner shield section, the outer shield section including a first section having a flat surface formed on the main surface of the shielding body and a second section formed on the inner shield section and protruded or sagged from the first section.
Abstract translation: 提供一种电路模块，包括具有安装表面的电路基板; 安装在安装表面上的安装部件; 所述密封体形成在所述安装表面上，所述密封体覆盖所述安装部件，并且具有从所述密封体的主表面到所述安装表面形成的沟槽; 以及屏蔽体，其具有形成在所述沟槽内的内屏蔽部和覆盖所述密封体和所述内屏蔽部的外屏蔽部，所述外屏蔽部具有形成在所述屏蔽体的主表面上的平坦面的第一部， 形成在所述内屏蔽部上并从所述第一部分突出或下垂的第二部分。
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公开(公告)号：US09101050B2
公开(公告)日：2015-08-04
申请号：US14090387
申请日：2013-11-26
Applicant: Taiyo Yuden Co., Ltd.
Inventor： Masaya Shimamura , Kenzo Kitazaki , Eiji Mugiya , Tatsuro Sawatari , Tetsuo Saji , Hiroshi Nakamura
CPC classification number: H05K1/0216 , H01L21/561 , H01L23/3135 , H01L23/552 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/12042 , H01L2924/15159 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , H05K1/0218 , H05K3/107 , H05K3/284 , H05K2201/0715 , H05K2201/09036 , H05K2201/09827 , H05K2201/09972 , H01L2924/00
Abstract: A circuit module includes a circuit substrate, a mount component, a sealing body, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench formed from a main surface of the sealing body to the mount surface. The trench includes side walls configured of a first side wall at a mount surface side and a second side wall at a main surface side. A straight line connecting the first point and the second point has a second slope gentler than the first slope against the mount surface. The shield covers the sealing body and has an inner shield section formed within the trench and an outer shield section disposed on the main surface and the inner shield.
Abstract translation: 电路模块包括电路基板，安装部件，密封体和屏蔽件。 电路基板包括安装表面。 安装部件安装在安装表面上。 密封体形成在安装表面上，覆盖安装部件，并且具有从密封体的主表面到安装表面形成的沟槽。 沟槽包括由安装表面侧的第一侧壁和主表面侧的第二侧壁构成的侧壁。 连接第一点和第二点的直线具有比靠着安装表面的第一斜坡更缓和的第二斜率。 屏蔽罩覆盖密封体并具有形成在沟槽内的内屏蔽部分和设置在主表面和内屏蔽上的外屏蔽部分。
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公开(公告)号：US09007782B1
公开(公告)日：2015-04-14
申请号：US14566470
申请日：2014-12-10
Applicant: Taiyo Yuden Co., Ltd.
Inventor： Tatsuro Sawatari , Yuichi Sugiyama , Hiroshi Nakamura , Masaki Naganuma , Tetsuo Saji
CPC classification number: H05K1/185 , H05K1/0213 , H05K1/0271 , H05K1/0298 , H05K2201/09063 , H05K2203/1178
Abstract: In a first conductive layer and a third conductive layer that are respectively closest to a core layer having a storage portion that penetrates therethrough, four first penetrating holes and four first penetrating holes are formed so as to overlap part of an opening edge of the storage portion that is projected onto the first conductive layer and the third conductive layer, respectively.
Abstract translation: 在分别与具有穿过其的存储部分的芯层最靠近的第一导电层和第三导电层中，形成四个第一穿透孔和四个第一穿透孔，以与存储部分的开口边缘的一部分重叠 其分别投影到第一导电层和第三导电层上。
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公开(公告)号：US08849362B1
公开(公告)日：2014-09-30
申请号：US14199824
申请日：2014-03-06
Applicant: Taiyo Yuden Co., Ltd.
Inventor： Tetsuo Saji , Yohei Ichikawa , Hiroshi Nakamura
IPC: H04M1/00 , H04M1/02 , H01L23/552
CPC classification number: H04B15/04 , H01L2224/16227 , H01L2924/0002 , H01L2924/3025 , H04B1/3888 , H05K1/0218 , H05K3/284 , H05K2201/0715 , H05K2201/10371 , H01L2924/00
Abstract: A communication module includes a circuit substrate having a first high-frequency processing section related to mobile phone communication, a system section having a baseband processing section and application processing section, and a power circuit section, a sealing member covering the electronic components mounted on the circuit substrate, a conductive shield layer formed on a surface of the sealing member, and a shield wall formed in the sealing member so as to demarcate one or both mounting areas of the system section and power circuit section and the mounting area of the first high-frequency processing section. The circuit substrate includes a core layer that is a conductive layer thicker than the other conductive layers and that functions as a ground. Electronic components are arranged in through-holes formed in the core layer.
Abstract translation: 通信模块包括具有与移动电话通信相关的第一高频处理部分的电路基板，具有基带处理部分和应用处理部分的系统部分，以及电源电路部分，覆盖安装在所述电子部件上的电子部件的密封部件 电路基板，形成在密封构件的表面上的导电屏蔽层和形成在密封构件中的屏蔽壁，以便划分系统部分和电源电路部分的一个或两个安装区域以及第一高度的安装区域 频率处理部分。 电路基板包括芯层，该芯层是比其他导电层更厚的导电层，并且用作接地。 电子部件布置在形成在芯层中的通孔中。
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公开(公告)号：US08706056B2
公开(公告)日：2014-04-22
申请号：US14056721
申请日：2013-10-17
Applicant: Taiyo Yuden Co., Ltd.
Inventor： Tetsuo Saji , Hiroshi Nakamura
IPC: H04B1/44
Abstract: Provided is a high-frequency module that can prevent a transmission signal from reaching a reception circuit and that can achieve high mounting density. A first duplexer for a first frequency band is mounted on a circuit substrate, and a second transmission filter and a second reception filter that constitute a second duplexer for a second frequency band are embedded in the circuit substrate. The second transmission filter and the second reception filter are embedded in the circuit substrate in locations that overlap at least a part of a projection region that is formed by projecting the first duplexer in a thickness direction of the circuit substrate. The first frequency band and the second frequency band are separated from each other by at least a prescribed frequency range.
Abstract translation: 提供了可以防止发送信号到达接收电路并且可以实现高安装密度的高频模块。 用于第一频带的第一双工器安装在电路基板上，并且构成用于第二频带的第二双工器的第二发送滤波器和第二接收滤波器被嵌入在电路基板中。 第二透射滤光器和第二接收滤光器在与电路基板的厚度方向突出形成的突起区域的至少一部分重叠的位置嵌入电路基板。 第一频带和第二频带彼此分开至少规定的频率范围。
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