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公开(公告)号：US10304779B2
公开(公告)日：2019-05-28
申请号：US15791888
申请日：2017-10-24
Applicant: TDK Corporation
Inventor： Makoto Orikasa , Yuhei Horikawa , Hisayuki Abe , Yoshihiro Kanbayashi
IPC: H01L23/552 , H01L21/3205 , H01L21/56 , H01L21/288 , H01L23/31 , H01L23/00
Abstract: Disclosed herein is an electronic component module that includes, an electronic component, a mold resin that seals the electronic component, a conductive film that covers the mold resin, and a protective film that covers the conductive film. The protective film includes a protective layer and a low reflective layer, and the low reflective layer is free from contacting the conductive film.
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公开(公告)号：US20180174748A1
公开(公告)日：2018-06-21
申请号：US15840243
申请日：2017-12-13
Applicant: TDK Corporation
Inventor： Yuhei Horikawa , Makoto Orikasa , Yoshihiro Kanbayashi , Hisayuki Abe , Hirohumi Asou , Kosuke Kunitsuka
CPC classification number: H01F41/043 , C23C18/1607 , C23C18/1641 , C23C18/1653 , C25D5/48 , C25D13/12 , C25D13/22 , G06K19/07783 , H01F41/04 , H01F41/041 , H01F41/045 , H01F41/10 , H01Q1/36 , H01Q1/38 , H01Q1/48 , H01Q7/00 , H01Q9/27 , H05K3/181 , H05K3/188 , H05K3/241 , H05K3/242 , H05K3/246
Abstract: Disclosed herein is a method for manufacturing a planar coil, the method including forming a base conductive layer on a base material, the base conductive layer including: a coil wiring portion having one end, other end, and first to third connecting positions, the second connecting position being closer to the other end compared with the first connecting position, the third connecting position being closer to the one end compared with the second connecting position; a power-feed wiring portion that connects the first connecting position with an external power source; and a connection wiring portion that short-circuits the second connecting position and the third connecting position; forming a wiring conductive layer on the base conductive layer by electrolytic plating by feeding power from the external power source; and removing the power-feed wiring portion and the connection wiring portion.
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公开(公告)号：US09320146B2
公开(公告)日：2016-04-19
申请号：US13958887
申请日：2013-08-05
Applicant: TDK CORPORATION
Inventor： Miyuki Yanagida , Hisayuki Abe
CPC classification number: H05K1/18 , H01G2/065 , H01G4/232 , H01G4/30 , H05K3/3442 , H05K2201/10636 , Y02P70/611 , Y02P70/613
Abstract: One aspect of an electronic circuit module component is an electronic circuit module component formed by joining a board and an electronic component comprising an element body having a mounting surface and a plurality of side faces to each other with solder; the electronic component comprising a first terminal electrode formed on the mounting surface and one of the plurality of side faces, a second terminal electrode formed on the mounting surface and another side face in the plurality of side faces, and an oxide film covering at least a part of surfaces of side face parts of the first and second terminal electrodes formed on the side faces; wherein mounting parts of the first and second terminal electrodes formed on the mounting surface are joined to the board with the solder.
Abstract translation: 电子电路模块部件的一个方面是电子电路模块部件，该电子电路模块部件通过将焊料与包含具有安装面的元件体和多个侧面的电子部件接合而形成， 所述电子部件包括形成在所述安装面和所述多个侧面中的一个侧面上的第一端子电极，形成在所述安装面上的第二端子电极和所述多个侧面的另一侧面，以及覆盖至少一个 形成在侧面上的第一和第二端子电极的侧面部分的表面的一部分; 其中形成在安装表面上的第一和第二端子电极的安装部分与焊料接合到板上。
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公开(公告)号：US09293421B2
公开(公告)日：2016-03-22
申请号：US14591427
申请日：2015-01-07
Applicant: TDK CORPORATION
Inventor： Miyuki Yanagida , Makoto Orikasa , Susumu Taniguchi , Hisayuki Abe
IPC: H01L23/552 , H01L23/31
CPC classification number: H01L23/552 , H01L23/3114 , H01L23/562 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/06537 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: An electronic component module according to the present invention is provided with an electronic component, a sealing resin that seals the electronic component, and a metal film that covers a surface of the sealing resin. The sealing resin contains filler of oxide particles. Part of the filler in the sealing resin is exposed to the surface of the sealing resin. At least the part of the filler exposed to the surface of the sealing resin includes a crack that extends from an exposed surface of the filler into an inner portion. The crack is filled with at least one metal that constitutes the metal film.
Abstract translation: 根据本发明的电子部件模块设置有电子部件，密封电子部件的密封树脂和覆盖密封树脂的表面的金属膜。 密封树脂含有氧化物颗粒的填料。 密封树脂中的填料的一部分暴露于密封树脂的表面。 暴露于密封树脂表面的填料的至少一部分包括从填料的暴露表面延伸到内部的裂纹。 该裂纹填充有构成金属膜的至少一种金属。
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15.发明授权公开(公告)号：US10968519B2
公开(公告)日：2021-04-06
申请号：US16046359
申请日：2018-07-26
Applicant: TDK CORPORATION
Inventor： Makoto Orikasa , Yuhei Horikawa , Yoshihiro Kanbayashi , Hisayuki Abe
IPC: C23C18/16 , C23C18/32 , C23C18/38 , B32B27/08 , B32B27/36 , B32B15/09 , B32B15/20 , B32B3/30 , H01L23/52 , H01L27/15 , B32B27/18 , C23C18/30 , H01L23/498 , C23F1/02 , H01L33/62 , H01L23/14 , H01L25/075
Abstract: A sheet material includes a resin layer containing a binder and catalyst particles, an electroless plating film on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a base material on the side of the other main surface of the resin layer.
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Patent Agency Ranking
公开(公告)号：US10784122B2
公开(公告)日：2020-09-22
申请号：US16038711
申请日：2018-07-18
Applicant: TDK CORPORATION
Inventor： Takashi Daitoku , Susumu Taniguchi , Akiko Seki , Atsushi Sato , Yuhei Horikawa , Makoto Orikasa , Hisayuki Abe
IPC: H01L21/48 , C23C18/20 , H01L33/62 , G03F7/00 , C23C18/18 , C23C18/16 , C23C18/30 , C23C18/31 , C23C18/38 , H01L23/00 , H01L25/075
Abstract: A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.
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公开(公告)号：US10374301B2
公开(公告)日：2019-08-06
申请号：US15840192
申请日：2017-12-13
Applicant: TDK Corporation
Inventor： Yuhei Horikawa , Makoto Orikasa , Yoshihiro Kanbayashi , Hisayuki Abe , Hirohumi Asou , Kosuke Kunitsuka
Abstract: Disclosed herein is a wiring component that includes a base material and a planar coil pattern formed on the base material. The planar coil pattern includes a coil wiring portion having one end, other end, and first to third connecting positions, the second connecting position being closer to the other end compared with the first connecting position, the third connecting position being closer to the one end compared with the second connecting position; a power-feed wiring portion connected to the first connecting position; and a connection wiring portion that short-circuits the second connecting position and the third connecting position. A cross-section structure of the planar coil pattern has a base resin layer formed on the base material, and a conductive layer formed on the base resin layer.
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公开(公告)号：US09768154B2
公开(公告)日：2017-09-19
申请号：US15271521
申请日：2016-09-21
Applicant: TDK Corporation
Inventor： Toshio Tomonari , Hirohumi Asou , Hisayuki Abe
CPC classification number: H01L25/18 , H01L21/561 , H01L23/29 , H01L23/295 , H01L23/3128 , H01L23/3135 , H01L23/552 , H01L24/16 , H01L25/0655 , H01L25/16 , H01L25/50 , H01L2224/16227 , H01L2224/97 , H01L2924/141 , H01L2924/1432 , H01L2924/14335 , H01L2924/1436 , H01L2924/1438 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/3025 , H01L2224/81
Abstract: Disclosed herein is a semiconductor package that includes: a package substrate having a main surface; a plurality of semiconductor devices mounted on the main surface of the package substrate; a mold member formed on the main surface of the package substrate so as to cover the semiconductor devices, the mold member having an upper surface substantially parallel to the main surface of the package substrate; and an electromagnetic wave shield formed on the upper surface of the mold member. The mold member comprises a mold resin and metal magnetic particles dispersed in the mold resin. The metal magnetic particles are exposed to the upper surface of the mold member.
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公开(公告)号：US20170092633A1
公开(公告)日：2017-03-30
申请号：US15271521
申请日：2016-09-21
Applicant: TDK Corporation
Inventor： Toshio Tomonari , Hirohumi Asou , Hisayuki Abe
CPC classification number: H01L25/18 , H01L21/561 , H01L23/29 , H01L23/295 , H01L23/3128 , H01L23/3135 , H01L23/552 , H01L24/16 , H01L25/0655 , H01L25/16 , H01L25/50 , H01L2224/16227 , H01L2224/97 , H01L2924/141 , H01L2924/1432 , H01L2924/14335 , H01L2924/1436 , H01L2924/1438 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/3025 , H01L2224/81
Abstract: Disclosed herein is a semiconductor package that includes: a package substrate having a main surface; a plurality of semiconductor devices mounted on the main surface of the package substrate; a mold member formed on the main surface of the package substrate so as to cover the semiconductor devices, the mold member having an upper surface substantially parallel to the main surface of the package substrate; and an electromagnetic wave shield formed on the upper surface of the mold member. The mold member comprises a mold resin and metal magnetic particles dispersed in the mold resin. The metal magnetic particles are exposed to the upper surface of the mold member.
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公开(公告)号：US09224706B2
公开(公告)日：2015-12-29
申请号：US13960330
申请日：2013-08-06
Applicant: TDK CORPORATION
Inventor： Kenichi Yoshida , Makoto Orikasa , Hideyuki Seike , Yuhei Horikawa , Hisayuki Abe
Abstract: A preferred terminal structure comprises a base material; an electrode formed on the base material; an insulating covering layer formed on the base material and on the electrode and having an opening exposing at least part of the electrode; an under bump metal layer containing Ni, formed in a region in the opening on the electrode so that an upper surface of the metal layer is at a position lower than an upper surface of the insulating covering layer in a peripheral edge portion of the opening; and a dome-shaped bump containing Sn and Ti, formed in a region in the opening on the under bump metal layer, wherein an end portion of a boundary between the under bump metal layer and the bump is in contact with an inner wall of the opening portion in the insulating covering layer.
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