公开(公告)号：US20090014871A1

公开(公告)日：2009-01-15

申请号：US11777694

申请日：2007-07-13

申请人： Thorsten Meyer ,  Markus Brunnbauer ,  Recai Sezi

发明人： Thorsten Meyer ,  Markus Brunnbauer ,  Recai Sezi

IPC分类号： H01L23/488 ,  H01L21/44

CPC分类号： H01L24/12 ,  B81B2207/07 ,  B81B2207/097 ,  B81C1/00301 ,  H01L21/568 ,  H01L23/3114 ,  H01L24/11 ,  H01L2224/02311 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05647 ,  H01L2224/1132 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01074 ,  H01L2924/013

摘要： A semiconductor device is disclosed. One embodiment includes a semiconductor substrate and at least two insulating elements located above the semiconductor substrate or above a mold compound embedding the semiconductor substrate. The at least two insulating elements have a first face facing the semiconductor substrate or the mold compound and a second face facing away from the semiconductor substrate or the mold compound. A conductive element for each of the at least two insulating elements extends from the first face of the insulating element to the second face of the insulating element.

摘要翻译： 公开了一种半导体器件。 一个实施例包括半导体衬底和位于半导体衬底之上或在嵌入半导体衬底的模具化合物上方的至少两个绝缘元件。 所述至少两个绝缘元件具有面对半导体衬底或模具化合物的第一面和背离半导体衬底或模具化合物的第二面。 用于至少两个绝缘元件中的每一个的导电元件从绝缘元件的第一面延伸到绝缘元件的第二面。

公开(公告)号：US20080265383A1

公开(公告)日：2008-10-30

申请号：US11939938

申请日：2007-11-14

申请人： Markus Brunnbauer ,  Jens Pohl ,  Klaus Pressel ,  Thorsten Meyer ,  Recai Sezi ,  Stephan Bradl ,  Ralf Plieninger

发明人： Markus Brunnbauer ,  Jens Pohl ,  Klaus Pressel ,  Thorsten Meyer ,  Recai Sezi ,  Stephan Bradl ,  Ralf Plieninger

IPC分类号： H01L23/552 ,  H01L21/56

CPC分类号： H01L23/552 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/5389 ,  H01L23/60 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/056 ,  H01L2224/12105 ,  H01L2224/82039 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/05099

摘要： A workpiece has at least two semiconductor chips, each semiconductor chip having a first main surface, which is at least partially exposed, and a second main surface. The workpiece also comprises an electrically conducting layer, arranged on the at least two semiconductor chips, the electrically conducting layer being arranged at least on regions of the second main surface, and a molding compound, arranged on the electrically conducting layer. In the molding compound a contact via is arranged.

摘要翻译： 工件具有至少两个半导体芯片，每个半导体芯片具有至少部分暴露的第一主表面和第二主表面。 所述工件还包括布置在所述至少两个半导体芯片上的导电层，所述导电层至少布置在所述第二主表面的区域上，所述模制化合物布置在所述导电层上。 在模塑料中配置有接触孔。

公开(公告)号：US08093711B2

公开(公告)日：2012-01-10

申请号：US12364340

申请日：2009-02-02

申请人： Frank Zudock ,  Thorsten Meyer ,  Markus Brunnbauer ,  Andreas Wolter

发明人： Frank Zudock ,  Thorsten Meyer ,  Markus Brunnbauer ,  Andreas Wolter

IPC分类号： H01L23/04

CPC分类号： H01L24/82 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/481 ,  H01L23/5389 ,  H01L24/25 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/2518 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15331 ,  H01L2224/82

摘要： A semiconductor device includes a semiconductor chip having a through-connection extending between a first main face of the semiconductor chip and a second main face of the semiconductor chip opposite the first main face, encapsulation material at least partially encapsulating the semiconductor chip, and a first metal layer disposed over the encapsulation material and connected with the through-connection.

摘要翻译： 一种半导体器件包括半导体芯片，其具有在半导体芯片的第一主面之间延伸的贯通连接和与第一主面相对的半导体芯片的第二主面，至少部分地封装半导体芯片的封装材料，以及第一 金属层设置在封装材料上并与通孔连接。

公开(公告)号：US07906860B2

公开(公告)日：2011-03-15

申请号：US11925312

申请日：2007-10-26

申请人： Thorsten Meyer ,  Markus Brunnbauer ,  Marcus Kastner ,  Stephan Bradl

发明人： Thorsten Meyer ,  Markus Brunnbauer ,  Marcus Kastner ,  Stephan Bradl

IPC分类号： H01L23/29

CPC分类号： H01L23/5389 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/293 ,  H01L23/3121 ,  H01L23/3135 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2224/82 ,  H01L2924/00

摘要： A semiconductor device is disclosed. One embodiment provides an arrangement of a plurality of semiconductor chips arranged side by side in a spaced apart relationship. A first material fills at least partly the spacings between adjacent semiconductor chips. A second material is arranged over the semiconductor chips and the first material. A coefficient of thermal expansion of the first material is selected to adapt the lateral thermal expansion of the arrangement in a plane intersecting the first material and the semiconductor chips to the lateral thermal expansion of the arrangement in a plane intersecting the second material.

摘要翻译： 公开了一种半导体器件。 一个实施例提供了以间隔开的关系并排布置的多个半导体芯片的布置。 第一材料至少部分地填充相邻半导体芯片之间的间距。 第二材料布置在半导体芯片和第一材料上。 选择第一材料的热膨胀系数以使布置的横向热膨胀在与第一材料和半导体芯片相交的平面中适应布置在与第二材料相交的平面中的横向热膨胀。

公开(公告)号：US20100193928A1

公开(公告)日：2010-08-05

申请号：US12364340

申请日：2009-02-02

申请人： Frank Zudock ,  Thorsten Meyer ,  Markus Brunnbauer ,  Andreas Wolter

发明人： Frank Zudock ,  Thorsten Meyer ,  Markus Brunnbauer ,  Andreas Wolter

IPC分类号： H01L25/11 ,  H01L23/538 ,  H01L21/768

CPC分类号： H01L24/82 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/481 ,  H01L23/5389 ,  H01L24/25 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/2518 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15331 ,  H01L2224/82

摘要： A semiconductor device includes a semiconductor chip having a through-connection extending between a first main face of the semiconductor chip and a second main face of the semiconductor chip opposite the first main face, encapsulation material at least partially encapsulating the semiconductor chip, and a first metal layer disposed over the encapsulation material and connected with the through-connection.

摘要翻译： 一种半导体器件包括半导体芯片，其具有在半导体芯片的第一主面之间延伸的贯通连接和与第一主面相对的半导体芯片的第二主面，至少部分地封装半导体芯片的封装材料，以及第一 金属层设置在封装材料上并与通孔连接。

公开(公告)号：US20090261468A1

公开(公告)日：2009-10-22

申请号：US12105837

申请日：2008-04-18

申请人： Werner Kroeninger ,  Josef Schwaiger ,  Ludwig Schneider ,  Ottmar Geitner ,  Markus Brunnbauer ,  Thorsten Meyer ,  Ralf Otremba ,  Josef Hoeglauer ,  Helmut Strack ,  Xaver Schloegel

发明人： Werner Kroeninger ,  Josef Schwaiger ,  Ludwig Schneider ,  Ottmar Geitner ,  Markus Brunnbauer ,  Thorsten Meyer ,  Ralf Otremba ,  Josef Hoeglauer ,  Helmut Strack ,  Xaver Schloegel

IPC分类号： H01L21/50 ,  H01L23/00

CPC分类号： H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/25 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L25/072 ,  H01L2221/68345 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/12105 ,  H01L2224/2518 ,  H01L2224/32245 ,  H01L2224/73153 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/82102 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12032 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/82 ,  H01L2924/00

摘要： A semiconductor module. One embodiment provides at least two semiconductor chips placed on a carrier. The at least two semiconductor chips are then covered with a molding material to form a molded body. The molded body is thinned until the at least two semiconductor chips are exposed. Then, the carrier is removed from the at least two semiconductor chips. The at least two semiconductor chips are singulated.

摘要翻译： 半导体模块。 一个实施例提供放置在载体上的至少两个半导体芯片。 然后将至少两个半导体芯片用模制材料覆盖以形成模制体。 成型体变薄，直到暴露出至少两个半导体芯片。 然后，从至少两个半导体芯片移除载体。 将至少两个半导体芯片分割。

公开(公告)号：US20090045511A1

公开(公告)日：2009-02-19

申请号：US11839129

申请日：2007-08-15

申请人： Thorsten Meyer ,  Markus Brunnbauer ,  Stephan Bradl

发明人： Thorsten Meyer ,  Markus Brunnbauer ,  Stephan Bradl

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L24/11 ,  H01L23/525 ,  H01L23/5329 ,  H01L2224/02311 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/01074 ,  H01L2924/013

摘要： An integrated circuit includes a substrate including a contact pad, a redistribution line coupled to the contact pad, and a dielectric material layer between the substrate and the redistribution line. The integrated circuit includes a solder ball coupled to the redistribution line and a parylene material layer sealing the dielectric material layer and the redistribution line.

摘要翻译： 集成电路包括包括接触焊盘，耦合到接触焊盘的再分配线以及衬底和再分配线之间的介电材料层的衬底。 集成电路包括耦合到再分配线的焊球和密封介电材料层和再分配线的聚对二甲苯材料层。

公开(公告)号：US20080135977A1

公开(公告)日：2008-06-12

申请号：US11614579

申请日：2006-12-21

申请人： Thorsten Meyer ,  Bernd Waidhas ,  Markus Brunnbauer ,  Grit Sommer ,  Thomas Wagner

发明人： Thorsten Meyer ,  Bernd Waidhas ,  Markus Brunnbauer ,  Grit Sommer ,  Thomas Wagner

IPC分类号： H01L21/20 ,  H01L29/00

CPC分类号： H01L23/645 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/24195 ,  H01L2224/82039 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012

摘要： Semiconductor element having a semiconductor chip and a passive component, as well as a method for its productionThe invention relates to a semiconductor component (1) having a semiconductor chip (2), and a passive component (3), with the semiconductor component (1) having a coil (6) as the passive component (3). The semiconductor chip (2) and the passive component (3) are embedded in a plastic encapsulation compound (4) with connection elements to external contacts (31).

摘要翻译： 具有半导体芯片和无源元件的半导体元件及其制造方法本发明涉及具有半导体芯片（2）的半导体元件（1）和具有半导体元件（2）的无源元件（3） 1）具有线圈（6）作为被动部件（3）。 将半导体芯片（2）和无源部件（3）嵌入塑料封装化合物（4）中，其中连接元件连接到外部触点（31）。

公开(公告)号：US20070249102A1

公开(公告)日：2007-10-25

申请号：US11738213

申请日：2007-04-20

申请人： Markus Brunnbauer ,  Edward Fuergut ,  Thorsten Meyer

发明人： Markus Brunnbauer ,  Edward Fuergut ,  Thorsten Meyer

IPC分类号： H01L21/00 ,  H01L21/82

CPC分类号： H01L23/5389 ,  H01L21/568 ,  H01L23/3128 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00

摘要： A panel and a semiconductor device, in one embodiment composed of a composite plate with semiconductor chips and plastic housing composition and to a method for producing the same is disclosed. The embodiments include a wiring structure with interconnects and dielectric layers composed of a low-k dielectric is arranged on the top side of the composite plate.

摘要翻译： 公开了一种面板和半导体器件，在一个实施例中，由具有半导体芯片的复合板和塑料外壳组成构成，以及其制造方法。 这些实施例包括具有互连的布线结构和由低k电介质构成的电介质层布置在复合板的顶侧上。

公开(公告)号：US20140197530A1

公开(公告)日：2014-07-17

申请号：US13739045

申请日：2013-01-11

申请人： Thorsten Meyer ,  Sven Albers ,  Christian Geissler ,  Andreas Wolter ,  Markus Brunnbauer ,  David O'Sullivan ,  Frank Zudock ,  Jan Proschwitz

发明人： Thorsten Meyer ,  Sven Albers ,  Christian Geissler ,  Andreas Wolter ,  Markus Brunnbauer ,  David O'Sullivan ,  Frank Zudock ,  Jan Proschwitz

IPC分类号： H01L23/29 ,  H01L21/56

CPC分类号： H01L23/315 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/562 ,  H01L24/19 ,  H01L2224/02375 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device is described having at least one semiconductor chip, the chip having an active area on a top side thereof, the active area formed at least in part of low-k material, said low-k material defining a low-k subarea of said active area; an embedding material, in which said at least one semiconductor chip is embedded, at least part of the embedding material forming a coplanar area with said active area; at least one contact area within the low-k subarea; a redistribution layer on the coplanar area, the redistribution layer connected to said contact areas; at least one first-level interconnect, located outside said low-k subarea, the first-level interconnect electrically connected to at least one of said contact areas via the redistribution layer.

摘要翻译： 描述了半导体器件，其具有至少一个半导体芯片，该芯片在其顶侧具有有源区，至少部分形成在低k材料上的有源区，所述低k材料限定低k分区 说活跃区; 嵌入材料，其中所述至少一个半导体芯片被嵌入，所述嵌入材料的至少一部分与所述有源区域形成共面区域; 低k子区域内的至少一个接触区域; 在共面区域上的再分配层，再分配层连接到所述接触区域; 位于所述低k子区域外的至少一个第一级互连，所述第一级互连经由再分配层电连接到所述接触区域中的至少一个。