公开(公告)号：US08894249B2

公开(公告)日：2014-11-25

申请号：US14153347

申请日：2014-01-13

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Wei-Yu Yeh

IPC: F21V29/00 ,  H05K3/00 ,  H05K1/02 ,  H05K1/05

CPC classification number: F21V19/005 ,  B23K20/002 ,  B23K20/10 ,  B23K2101/36 ,  F21V29/70 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/05 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2203/0285 ,  H01L2924/00

Abstract: The present disclosure provides a method including providing a light-emitting diode (LED) device (e.g., a LED element and PCB) and a heat sink. The LED device is bonded to the heat sink by applying an ultrasonic energy. In an embodiment, the bonding may form a bond comprising copper and aluminum. The PCB may be a metal core PCB (MC-PCB).

公开(公告)号：US08889439B2

公开(公告)日：2014-11-18

申请号：US13788536

申请日：2013-03-07

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Chi-Xiang Tseng ,  Hsiao-Wen Lee ,  Min-Sheng Wu ,  Tien-Min Lin

IPC: H01L33/50 ,  H01L33/46

CPC classification number: H01L33/504 ,  H01L33/46 ,  H01L33/505 ,  H01L2933/0041

Abstract: The present disclosure involves a method of packaging light-emitting diodes (LEDs). According to the method, a plurality of LEDs is provided over an adhesive tape. The adhesive tape is disposed on a substrate. In some embodiments, the substrate may be a glass substrate, a silicon substrate, a ceramic substrate, and a gallium nitride substrate. A phosphor layer is coated over the plurality of LEDs. The phosphor layer is then cured. The tape and the substrate are removed after the curing of the phosphor layer. A replacement tape is then attached to the plurality of LEDs. A dicing process is then performed to the plurality of LEDs after the substrate has been removed. The removed substrate may then be reused for a future LED packaging process.

Abstract translation: 本公开涉及封装发光二极管（LED）的方法。 根据该方法，在胶带上设置多个LED。 粘合带设置在基板上。 在一些实施例中，衬底可以是玻璃衬底，硅衬底，陶瓷衬底和氮化镓衬底。 磷光体层被涂覆在多个LED上。 然后将磷光体层固化。 在荧光体层固化之后去除胶带和基材。 然后将替代胶带附接到多个LED。 然后在去除衬底之后，对多个LED进行切割处理。 然后可以将去除的衬底重新用于将来的LED封装工艺。

公开(公告)号：US08823049B2

公开(公告)日：2014-09-02

申请号：US13793198

申请日：2013-03-11

Applicant: Taiwan Semiconductor Manufacturing Company Ltd.

Inventor： Ding-Yuan Chen ,  Chen-Hua Yu ,  Wen-Chih Chiou

IPC: H01L33/00

CPC classification number: H01L33/145 ,  H01L33/0066 ,  H01L33/04 ,  H01L33/06 ,  H01L33/30 ,  H01L33/36 ,  H01L33/62 ,  H01L2933/0066

Abstract: A light-emitting diode (LED) device is provided. The LED device has a lower LED layer and an upper LED layer with a light-emitting layer interposed therebetween. A current blocking layer is formed in the upper LED layer such that current passing between an electrode contacting the upper LED layer flows around the current blocking layer. When the current blocking layer is positioned between the electrode and the light-emitting layer, the light emitted by the light-emitting layer is not blocked by the electrode and the light efficiency is increased. The current blocking layer may be formed by converting a portion of the upper LED layer into a resistive region. In an embodiment, ions such as magnesium, carbon, or silicon are implanted into the upper LED layer to form the current blocking layer.

Abstract translation: 提供了一种发光二极管（LED）装置。 LED装置具有较低的LED层和位于其间的发光层的上部LED层。 在上LED层中形成电流阻挡层，使得在与上层LED层接触的电极之间的电流流过电流阻挡层。 当电流阻挡层位于电极和发光层之间时，由发光层发射的光不被电极阻挡，并且光效率增加。 可以通过将上部LED层的一部分转换成电阻区域来形成电流阻挡层。 在一个实施方案中，诸如镁，碳或硅的离子注入上层LED层以形成电流阻挡层。

公开(公告)号：US20140231836A1

公开(公告)日：2014-08-21

申请号：US14261892

申请日：2014-04-25

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Chi Xiang Tseng ,  Hsiao-Wen Lee ,  Tien-Ming Lin ,  Min-Sheng Wu

IPC: H01L33/50 ,  H01L27/15

CPC classification number: H01L33/505 ,  H01L27/153 ,  H01L33/504 ,  H01L33/508 ,  H01L2933/0041

Abstract: The present disclosure provides a light emitting diode (LED) apparatus. The LED apparatus includes an LED emitter having a top surface; and a phosphor feature disposed on the LED emitter. The phosphor feature includes a first phosphor film disposed on the top surface of the LED emitter and having a first dimension defined in a direction parallel to the top surface of the LED emitter; a second phosphor film disposed on the first phosphor film and having a second dimension defined in the direction; and the second dimension is substantially less than the first dimension.

Abstract translation: 本公开提供了一种发光二极管（LED）装置。 LED装置包括具有顶表面的LED发射器; 以及设置在LED发射器上的荧光体特征。 荧光体特征包括设置在LED发射器的顶表面上并具有在平行于LED发射器的顶表面的方向上限定的第一尺寸的第一荧光膜; 第二荧光体膜，设置在所述第一荧光膜上并具有沿所述方向限定的第二尺寸; 并且第二尺寸基本上小于第一尺寸。

公开(公告)号：US08801228B2

公开(公告)日：2014-08-12

申请号：US13420927

申请日：2012-03-15

Applicant: Dong Jung Suen ,  Chih-Hsun Sun ,  Wei-Yu Yeh ,  Hsueh-Hung Fu

Inventor： Dong Jung Suen ,  Chih-Hsun Sun ,  Wei-Yu Yeh ,  Hsueh-Hung Fu

IPC: F21V9/16 ,  F21K99/00 ,  H01L33/50 ,  F21V3/04

CPC classification number: F21K9/56 ,  F21K9/64 ,  F21V3/049 ,  F21V3/10 ,  F21V7/005 ,  F21V29/673 ,  F21Y2115/10 ,  H01L33/504 ,  Y10T29/49002

Abstract: The present disclosure provides a lighting instrument. The lighting instrument includes a recessed light fixture, for example a troffer light or a batten light. The light fixture includes a plurality of light-emitting diode (LED) devices located on a board. The light fixture also includes a diffuser cap located on the board and housing the LED devices therein. The diffuser cap includes a plurality of coating regions. Each coating region is coated by a film containing white particles. The white particles can reflect and diffuse light emitted by the LED devices. The film in each coating region has a different white particle concentration level than other coating regions.

Abstract translation: 本公开提供了一种照明器具。 照明器具包括凹入的灯具，例如灯光或灯条灯。 灯具包括位于板上的多个发光二极管（LED）装置。 灯具还包括位于板上的扩散器帽，并将LED器件容纳在其中。 扩散器盖包括多个涂覆区域。 每个涂层区域被含有白色颗粒的膜包覆。 白色颗粒可以反射和漫射由LED器件发出的光。 每个涂层区域中的膜具有与其它涂覆区域不同的白色颗粒浓度水平。

公开(公告)号：US20140209930A1

公开(公告)日：2014-07-31

申请号：US13750097

申请日：2013-01-25

Applicant: TSMC SOLID STATE LIGHTING LTD.

Inventor： Jui-Ping Weng ,  Hsiao-Wen Lee ,  Chun-Chih Chang ,  Min-Sheng Wu ,  Hsin-Hsien Lee

IPC: H01L27/15 ,  H01L33/50

CPC classification number: H01L33/50 ,  H01L25/0753 ,  H01L27/15 ,  H01L27/153 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present disclosure involves a light-emitting diode (LED) packaging structure. The LED packaging structure includes a submount having a substrate and a plurality of bond pads on the substrate. The LED packaging structure includes a plurality of p-type LEDs bonded to the substrate through a first subset of the bond pads. The LED packaging structure includes a plurality of n-type LEDs bonded to the substrate through a second subset of the bond pads. Some of the bond pads belong to both the first subset and the second subset of the bond pads. The p-type LEDs and the n-type LEDs are arranged as alternating pairs. The LED packaging structure includes a plurality of transparent and conductive components each disposed over and electrically interconnecting one of the pairs of the p-type and n-type LEDs. The LED packaging structure includes one or more lenses disposed over the n-type LEDs and the p-type LEDs.

Abstract translation: 本公开涉及一种发光二极管（LED）封装结构。 LED封装结构包括具有衬底的基座和在衬底上的多个接合焊盘。 LED封装结构包括通过接合焊盘的第一子集结合到衬底的多个p型LED。 LED封装结构包括通过接合焊盘的第二子集结合到衬底的多个n型LED。 一些接合焊盘属于接合焊盘的第一子集和第二子集。 p型LED和n型LED布置为交替对。 LED封装结构包括多个透明和导电部件，每个透明和导电部件设置在一对p型和n型LED中的一个上并使其互连。 LED封装结构包括设置在n型LED和p型LED上的一个或多个透镜。

公开(公告)号：US08786165B2

公开(公告)日：2014-07-22

申请号：US11521828

申请日：2006-09-15

Applicant: Andreas Alfred Hase

Inventor： Andreas Alfred Hase

IPC: H01L41/00 ,  H02N2/00 ,  H01L23/06

CPC classification number: H01L24/11 ,  B81C1/00333 ,  H01L23/04 ,  H01L23/10 ,  H01L23/13 ,  H01L23/481 ,  H01L23/49805 ,  H01L23/49811 ,  H01L24/03 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/11614 ,  H01L2224/291 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/81801 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1532 ,  H01L2924/161 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/166 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A leadless package and method for manufacturing silicon based leadless QFN/SON compatible packages are described. In addition the package allows for hermetic sealing of devices while maintaining electrical and optical access. Micro-vias with feed-through metallization through a silicon structure facilitates a surface mount technology-compatible silicon package with bottom SMT pads and top surface device integration. Sloped edges on the SMT side enable solder filleting for post solder inspection. Hermetic seal can be attained for example using anodic bonding of a glass lid or using metal soldering. Metal soldering enables the use of solder bumps to provide electrical connections for the package to the lid with integrated device functionality used for sealing. Hermetically sealed silicon packages eliminates the need for an extra packaging layer required in plastic packages and provides a standard interface for enclosing one or more discrete devices.

Abstract translation: 描述了一种用于制造基于硅的无引脚QFN / SON兼容封装的无引线封装和方法。 此外，该封装允许在保持电和光学访问的同时对器件进行气密密封。 通过硅结构进行直通金属化的微通孔有利于具有底部SMT焊盘和顶部表面器件集成的表面贴装技术兼容的硅封装。 SMT侧边缘的边缘可以进行焊锡切割以进行焊后检测。 例如使用玻璃盖的阳极接合或使用金属焊接可以实现密封。 金属焊接使得可以使用焊料凸块为封装提供电连接，并具有用于密封的集成器件功能。 密封硅封装不需要塑料封装所需的额外封装层，并提供用于封装一个或多个分立器件的标准接口。

公开(公告)号：US20140159079A1

公开(公告)日：2014-06-12

申请号：US14181938

申请日：2014-02-17

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Chih-Lin Wang

IPC: H01L25/075

CPC classification number: H01L25/0753 ,  F21K9/00 ,  F21S6/005 ,  F21V9/30 ,  F21Y2105/10 ,  F21Y2105/12 ,  F21Y2115/10 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present disclosure involves a lighting instrument. The lighting instrument includes a board or substrate, for example, a printed circuit board. The lighting instrument also includes a plurality of light-emitting devices disposed on the substrate. The light-emitting devices may be light-emitting diode (LED) dies. The LED dies belong to a plurality of different bins. The bins are categorized based on the light output performance of the LED dies. In some embodiments, the LED dies may be binned based on the wavelength or radiant flux of the light output. The LED dies are distributed on the substrate according to a predefined pattern based on their bins. In some embodiments, the LED dies are bin-mixed in an interleaving manner.

Abstract translation: 本公开涉及一种照明器具。 照明器具包括板或基板，例如印刷电路板。 照明器具还包括设置在基板上的多个发光器件。 发光装置可以是发光二极管（LED）管芯。 LED管芯属于多个不同的箱体。 基于LED芯片的光输出性能分类。 在一些实施例中，可以基于光输出的波长或辐射通量来分组LED管芯。 LED芯片根据其基于预定义的图案分布在基板上。 在一些实施例中，LED管芯以交错方式进行二进制混合。

公开(公告)号：US08737073B2

公开(公告)日：2014-05-27

申请号：US13024017

申请日：2011-02-09

Applicant: Wei-Yu Yeh ,  Chih-Hsuan Sun

Inventor： Wei-Yu Yeh ,  Chih-Hsuan Sun

IPC: H05K7/20

CPC classification number: F21V29/20 ,  F21K9/20 ,  F21V29/70 ,  F21V29/763 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/0203 ,  H05K1/056 ,  H05K1/111 ,  H05K3/0061 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10969 ,  Y10T29/4913

Abstract: A Light Emitting Diode (LED) module includes a circuit board having a front side and a back side, a heat sink coupled to the back side of the circuit board, a thermal pad disposed on a front side of the circuit board, an LED disposed on the front side of the circuit board. The LED is in thermal contact with the thermal pad. The module further includes a heat spreading device placed over the thermal pad and in thermal contact with the thermal pad.

Abstract translation: 发光二极管（LED）模块包括具有前侧和后侧的电路板，耦合到电路板的背面的散热器，设置在电路板的前侧的散热垫，设置在LED 在电路板的正面。 LED与散热垫热接触。 模块还包括放置在热垫上并与热垫热接触的散热装置。

公开(公告)号：US08716723B2

公开(公告)日：2014-05-06

申请号：US12270309

申请日：2008-11-13

Applicant: Ding-Yuan Chen ,  Chia-Lin Yu ,  Chen-Hua Yu ,  Wen-Chih Chiou

Inventor： Ding-Yuan Chen ,  Chia-Lin Yu ,  Chen-Hua Yu ,  Wen-Chih Chiou

IPC: H01L29/18

CPC classification number: H01L33/62 ,  H01L27/15 ,  H01L27/156 ,  H01L33/06 ,  H01L33/08 ,  H01L33/30 ,  H01L33/32 ,  H01L33/42 ,  H01L33/60

Abstract: A system and method for manufacturing a light-generating device is described. A preferred embodiment comprises a plurality of LEDs formed on a substrate. Each LED preferably has spacers along the sidewalls of the LED, and a reflective surface is formed on the substrate between the LEDs. The reflective surface is preferably located lower than the active layer of the individual LEDs.

Abstract translation: 描述了用于制造发光装置的系统和方法。 优选实施例包括形成在基板上的多个LED。 每个LED优选地具有沿LED的侧壁的间隔物，并且在LED之间的基板上形成反射表面。 反射表面优选地位于比各个LED的有源层更低的位置。