公开(公告)号：US08049515B2

公开(公告)日：2011-11-01

申请号：US12791495

申请日：2010-06-01

Applicant: Florian Schoen ,  Markus Loehndorf

Inventor： Florian Schoen ,  Markus Loehndorf

IPC: G01R23/04

CPC classification number: H03H9/2457 ,  B60C23/0488 ,  B60C23/064 ,  G01P15/08 ,  G01P15/125 ,  G01P2015/0862 ,  H03H2009/02527

Abstract: The invention relates to MEMS resonators. In one embodiment, an integrated resonator and sensor device includes a micro-electromechanical system (MEMS) resonator, and an anchor portion coupled to the MEMS resonator and configured to allow resonance of the MEMS resonator in a first plane of motion and movement of the MEMS resonator in a second plane of motion. In other embodiments, additional apparatuses, devices, systems and methods are disclosed.

Abstract translation: 本发明涉及MEMS谐振器。 在一个实施例中，集成谐振器和传感器装置包括微机电系统（MEMS）谐振器和耦合到MEMS谐振器并被配置为允许MEMS谐振器在第一运动平面和MEMS的移动中的谐振的锚定部分 谐振器在第二运动平面。 在其他实施例中，公开了附加的装置，装置，系统和方法。

公开(公告)号：US11860184B2

公开(公告)日：2024-01-02

申请号：US17447876

申请日：2021-09-16

Applicant: Robert Bosch GmbH

Inventor： Cristian Nagel ,  Johannes Classen ,  Lars Tebje ,  Rolf Scheben ,  Rudy Eid

IPC: G01P15/08 ,  G01P15/125 ,  B81B3/00

CPC classification number: G01P15/0802 ,  B81B3/001 ,  B81B3/0051 ,  G01P15/125 ,  B81B2201/0235 ,  B81B2203/0163 ,  B81B2203/04 ,  G01P2015/0831 ,  G01P2015/0862 ,  G01P2015/0871

Abstract: A micromechanical structure including a substrate, a moveable seismic mass, a detection structure, and a main spring. The seismic mass is connected to the substrate using the main spring. A first direction and a second direction perpendicular thereto define a main extension plane of the substrate. The detection structure detects a deflection of the seismic mass and includes first electrodes mounted at the seismic mass and second electrodes mounted at the substrate. The first electrodes and second electrodes have a two-dimensional extension in the first and second directions. The micromechanical structure has a graduated stop structure including a first spring stop, a second spring stop, and a fixed stop.

公开(公告)号：US11761977B1

公开(公告)日：2023-09-19

申请号：US17733495

申请日：2022-04-29

Applicant: InvenSense, Inc.

Inventor： Varun Subramaniam Kumar ,  Mrigank Sharma ,  Giacomo Laghi ,  Luca Coronato ,  Matthew Julian Thompson

IPC: G01P15/125 ,  G01P15/08

CPC classification number: G01P15/125 ,  G01P2015/0862

Abstract: A MEMS sensor includes a central anchoring region that maintains the relative position of an attached proof mass relative to sense electrodes in the presence of undesired forces and stresses. The central anchoring region includes one or more first anchors that rigidly couple to a cover substrate and a base substrate. One or more second anchors are rigidly coupled to only the cover substrate and are connected to the one or more first anchors within the MEMS layer via an isolation spring. The proof mass in turn is connected to the one or more second anchors via one or more compliant springs.

公开(公告)号：US11733263B2

公开(公告)日：2023-08-22

申请号：US16138091

申请日：2018-09-21

Applicant: Analog Devices, Inc.

Inventor： Jianglong Zhang ,  Xin Zhang

IPC: G01P15/125 ,  G01P15/08 ,  G01P15/18

CPC classification number: G01P15/125 ,  G01P15/0802 ,  G01P15/18 ,  G01P2015/084 ,  G01P2015/0862

Abstract: A three-axis accelerometer includes a single, integrated mass including at least one lateral (x-y) proof mass and at least one vertical (z) proof mass. The vertical proof mass is arranged as a teeter-totter mass, which is located within the lateral proof mass. The vertical proof mass is mechanically coupled to the lateral proof mass with one or more torsional springs, and the lateral proof mass is mechanically coupled to one or more anchors with one or more lateral springs. The at least one vertical proof mass may be symmetrically positioned about one or more axes of the three-axis accelerometer, so that the 3-axis accelerometer has in-plane symmetry. The three-axis accelerometer may be less susceptible for mechanical cross-talk or noise and may provide a smaller packaged solution for sensing acceleration in three directions.

公开(公告)号：US20180321274A1

公开(公告)日：2018-11-08

申请号：US15756279

申请日：2016-11-08

Applicant: HITACHI, LTD.

Inventor： Yuudai KAMADA ,  Atsushi ISOBE ,  Noriyuki SAKUMA ,  Takashi SHIOTA ,  Chisaki TAKUBO

IPC: G01P15/125 ,  G01V1/18 ,  G01R19/00 ,  G01V1/30

CPC classification number: G01P15/125 ,  G01P15/08 ,  G01P15/13 ,  G01P2015/0862 ,  G01R19/0084 ,  G01V1/18 ,  G01V1/181 ,  G01V1/28 ,  G01V1/30

Abstract: Provided are acceleration sensor, geophone and seismic prospecting system with high sensitivity and low power consumption. The acceleration sensor includes a mass body displaceable with respect to a rotation shaft. The acceleration sensor includes a first AC servo control facing a first symmetrical region of the first movable portion, a second AC servo control electrode facing a second symmetrical region of the second movable portion, and a DC servo control electrode facing an asymmetrical region of the second movable portion. A first AC servo capacitive element is formed by the first movable portion and the first AC servo control electrode, a second AC servo capacitive element is formed by the second movable portion and the second AC servo control electrode, and a DC servo capacitive element is formed by the second movable portion and the DC servo control electrode.

公开(公告)号：US20180252743A1

公开(公告)日：2018-09-06

申请号：US15912532

申请日：2018-03-05

Applicant: Jahangir S Rastegar

Inventor： Jahangir S Rastegar

IPC: G01P15/08 ,  H02N2/18 ,  G01B5/06 ,  G01B7/06

CPC classification number: G01P15/08 ,  F42C1/10 ,  F42C11/02 ,  F42C15/24 ,  G01B5/06 ,  G01B7/06 ,  G01B21/08 ,  G01P15/0802 ,  G01P15/0891 ,  G01P2015/0828 ,  G01P2015/0862 ,  G01P2015/0871 ,  H02N2/181 ,  H02N2/183

Abstract: A method for detecting hardened bunkers within a target, the method including: producing a first output from a sensor fired to travel through the hardened bunkers, the first output being different from a second output when the sensor travels in a void between the hardened bunkers or encounters other objects outside of the hardened bunkers; and determining one or more of the number of hardened bunkers, a thickness of the hardened bunkers and a strength of the hardened bunkers based on the first and second outputs of the sensor over time. The sensor can include one of a piezoelectric generator for producing a voltage output and a circuit input by the voltage output or an accelerometer having a locking member for locking a proof mass during periods of impact with the one or more hardened bunkers.

公开(公告)号：US09568491B2

公开(公告)日：2017-02-14

申请号：US13936938

申请日：2013-07-08

Applicant: Honeywell International Inc.

Inventor： Mark W. Weber ,  Timothy J. Hanson

IPC: G01P15/08 ,  B81C1/00

CPC classification number: G01P15/08 ,  B81C1/00698 ,  G01P2015/0862 ,  G01P2015/0871 ,  G01P2015/0874

Abstract: A method of controlling exposed glass charging in a micro-electro-mechanical systems (MEMS) device is disclosed. The method includes providing a MEMS device comprising a proof mass positioned apart from at least one sense plate and at least one outboard metallization layer, wherein at least one conductive glass layer is coupled to the sense plate and the outboard metallization layer, the conductive glass layer including at least one exposed glass portion near the proof mass; and applying a first voltage to the sense plate and a second voltage to the outboard metallization layer. The first voltage is separated from the second voltage by a predetermined voltage level such that the exposed glass portion has an average voltage corresponding to a voltage midway between the first voltage and the second voltage.

Abstract translation: 公开了一种在微机电系统（MEMS）装置中控制暴露的玻璃充电的方法。 该方法包括提供MEMS器件，其包括与至少一个感测板和至少一个外侧金属化层隔开的检测质量块，其中至少一个导电玻璃层耦合到感测板和外侧金属化层，导电玻璃层 包括靠近证明物质的至少一个暴露的玻璃部分; 以及向所述感测板施加第一电压，并向所述外侧金属化层施加第二电压。 第一电压与第二电压分开预定的电压电平，使得暴露的玻璃部分具有对应于第一电压和第二电压之间的电压的平均电压。

公开(公告)号：US20130335011A1

公开(公告)日：2013-12-19

申请号：US13910979

申请日：2013-06-05

Applicant: Ruamoko MEMS, Inc.

Inventor： Karl Böhringer ,  John Reif

IPC: H02N11/00 ,  B81C3/00

CPC classification number: H02N11/002 ,  B81C3/00 ,  G01P2015/0862 ,  H02J7/328 ,  H02K7/1876 ,  H02K35/02 ,  Y10T29/49128

Abstract: Microelectronic devices for harvesting kinetic energy and/or detecting motion, and associated systems and methods. Particular embodiments include an energy harvesting device for generating electrical energy for use by microelectronic devices, where the energy harvesting device converts to electrical energy the kinetic energy among or within the microelectronic devices and their packaging, and provides this electrical energy to power the microelectronic devices.

Abstract translation: 用于收集动能和/或检测运动的微电子装置，以及相关的系统和方法。 具体实施例包括用于产生用于微电子器件的电能的能量收集装置，其中能量收集装置将微电子器件及其封装内的动能转换为电能，并提供该电能以对微电子器件供电。

公开(公告)号：US20120160029A1

公开(公告)日：2012-06-28

申请号：US13197104

申请日：2011-08-03

Applicant: Yasuo YAMAGUCHI ,  Mika Okumura ,  Takeshi Murakami

Inventor： Yasuo YAMAGUCHI ,  Mika Okumura ,  Takeshi Murakami

IPC: G01P15/125 ,  G01P15/00

CPC classification number: G01P15/125 ,  G01P2015/0814 ,  G01P2015/0851 ,  G01P2015/0862 ,  G01P2015/0874

Abstract: An acceleration sensor of the present invention comprises a first mass body which is held by first beams and can be displaced by acceleration, fixed electrodes which are so arranged as to convert the displacement of the first mass body into the quantity of electricity, and a displaceability changing member for changing the displaceability of the first mass body when the displacement of the first mass body exceeds a predetermined range.

Abstract translation: 本发明的加速度传感器包括：第一质量体，其由第一梁保持并且能够被加速度位移，固定电极被布置成将第一质量体的位移转换成电量，并且可移动性 改变构件，用于当第一质量体的位移超过预定范围时改变第一质量体的位移性。

公开(公告)号：US20240295582A1

公开(公告)日：2024-09-05

申请号：US18583130

申请日：2024-02-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Matti LIUKKU

IPC: G01P15/125 ,  G01P15/08

CPC classification number: G01P15/125 ,  G01P15/0802 ,  G01P2015/0862

Abstract: A MEMS structure is provided that includes a mechanical layer that extends parallel to a reference device plane. The mechanical layer is patterned to include a static electrode and a movable electrode configured to move in relation to the static electrode parallel to the reference device plane. The static electrode and the movable electrode are connected to form a capacitor having capacitance that varies according to an overlap of the static electrode and the movable electrode. The mechanical layer includes a first silicon layer and a second silicon layer. Parts of the first silicon layer and the second silicon layer are directly bonded to each other. The movable electrode is in the first silicon layer and the static electrode is in the second silicon layer. The movable electrode is separated from the static electrode by a first gap in the interface between the first and second silicon layers.