公开(公告)号：US20060264112A1

公开(公告)日：2006-11-23

申请号：US11432334

申请日：2006-05-12

Applicant: Haruki Nagahashi

Inventor： Haruki Nagahashi

IPC: H01R24/00

CPC classification number: H01R12/721 ,  H05K1/0263 ,  H05K3/325 ,  H05K3/366 ,  H05K2201/10333

Abstract: A mother board mounts a memory module via a plug-socket coupling, wherein the edge of the memory module has a plug member mounted on a socket member of the mother board. The mother board has a plurality of abutment members abutting the edge surface of the bottom edge of the memory module for which the plug is formed. The abutment members act as ground terminals for connecting the ground layer of the memory module to the ground layer of the mother board, and also act as heat radiation members.

Abstract translation: 母板通过插座联接器安装存储器模块，其中存储器模块的边缘具有安装在母板的插座构件上的插头构件。 母板具有邻接形成有插头的存储器模块的底部边缘的边缘表面的多个邻接构件。 抵靠构件用作将存储器模块的接地层连接到母板的接地层的接地端子，并且还用作散热构件。

公开(公告)号：US20060141825A1

公开(公告)日：2006-06-29

申请号：US11290558

申请日：2005-12-01

Applicant: Tooru Nakagawa ,  Kazuhiro Yamamoto

Inventor： Tooru Nakagawa ,  Kazuhiro Yamamoto

IPC: H01R12/00

CPC classification number: H01R12/58 ,  H01R13/112 ,  H05K3/301 ,  H05K2201/10333 ,  H05K2201/10651 ,  H05K2201/10962

Abstract: In a structure for attaching a circuit board terminal to a circuit board, stress is minimized in a soldered portion on a circuit section upon inserting and drawing an electrical element into and from the circuit board. The attaching structure including a holding member mounted on and secured to a circuit board, a bus bar that has a base portion supported on the holding member and a leg portion that passes one or more through-holes and to be soldered on a circuit section, and a circuit board terminal that has a base portion to be connected to the bus bar and a connection portion adapted to be coupled to a terminal of an electrical element. The bus bar is provided on the base portion with elastic tongue pieces that can contact elastically with a circuit board terminal. The circuit board terminal is connected through the bus bar to the circuit section.

公开(公告)号：US20010036063A1

公开(公告)日：2001-11-01

申请号：US09796469

申请日：2001-03-02

Applicant: IBIDEN CO., LTD.

Inventor： Kunio Nagaya ,  Hiroaki Hayashi

IPC: H05K007/00

CPC classification number: H01L23/32 ,  H01L25/105 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/15312 ,  H01R12/52 ,  H05K1/141 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/10333 ,  H05K2201/10704 ,  H01L2224/0401

Abstract: An electronic part module which is configured to electrically connect an electronic component to a motherboard via a socket, including a conversion board and a sub board. The conversion board is configured to convert a signal from the electronic component and has a plurality of pins projected from the conversion board. The plurality of pins are configured to contact the socket. The sub board is provided between the conversion board and the socket and has a plurality of holes each having a diameter same as or larger than that of each of the plurality of pins which pass through the plurality of holes, respectively.

Abstract translation: 一种电子部件模块，其被配置为经由插座将电子部件电连接到主板，所述插座包括转换板和子板。 转换板被配置为转换来自电子部件的信号，并且具有从转换板投影的多个引脚。 多个销被配置为接触插座。 子板设置在转换板和插座之间，并且具有分别具有与通过多个孔的多个销中的每一个的直径相同或更大的多个孔。

公开(公告)号：US06300164B1

公开(公告)日：2001-10-09

申请号：US09559314

申请日：2000-04-27

Applicant: Anson J. Call ,  Stephen Anthony DeLaurentis ,  Shaji Farooq ,  Sung Kwon Kang ,  Sampath Purushothaman ,  Kathleen Ann Stalter

Inventor： Anson J. Call ,  Stephen Anthony DeLaurentis ,  Shaji Farooq ,  Sung Kwon Kang ,  Sampath Purushothaman ,  Kathleen Ann Stalter

IPC: H01L2144

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K3/321 ,  H05K3/3447 ,  H05K3/4015 ,  H05K2201/10234 ,  H05K2201/10333 ,  H05K2201/10962 ,  Y02P70/613 ,  Y10S428/901 ,  Y10T428/12528 ,  Y10T428/24917 ,  Y10T428/256 ,  H01L2924/00

Abstract: A socketable ball grid array structure is disclosed which comprises mechanically rigid (compared to solder alloys) balls coated with noble contact metals joined to the chip carrier terminals by means of a novel electrically conducting adhesive. Because of the nature of the filler that includes conducting particles with a fusible coating and the appropriate selection of the polymer resin used in the adhesive, the balls are attached to the module in a compliant and resilient manner while leaving the majority of the bottom surface of the balls pristine. The array of balls can therefore be plugged into mating sockets in a printed circuit board forming a demountable contact. This facilitates easy removal of the socketable BGA from a board for repair or upgrade purposes as well as allows ease of plugging and unplugging of these BGA's into test and burn-in boards.

Abstract translation: 公开了一种可插座的球栅阵列结构，其包括通过新颖的导电粘合剂机械地刚性（与焊料合金相比）涂覆有接合到芯片载体端子的贵金属接触金属的球。 由于包括具有可熔涂层的导电颗粒和粘合剂中使用的聚合物树脂的适当选择的填料的性质，球以顺应性和弹性方式附着到模块上，同时留下了大部分的底表面 球原始。 因此，球阵可以插入形成可拆卸接触的印刷电路板中的配合插座中。 这样便于从板上轻松取出可插拔的BGA，以进行修理或升级，同时也可以方便地将这些BGA插入测试和老化板。

公开(公告)号：US5825630A

公开(公告)日：1998-10-20

申请号：US744964

申请日：1996-11-07

Applicant: Billy K. Taylor ,  Richard I. Mellitz

Inventor： Billy K. Taylor ,  Richard I. Mellitz

IPC: H05K1/14 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K7/02 ,  H01R23/72 ,  H05K7/06

CPC classification number: H05K1/141 ,  H05K7/023 ,  H05K2201/10333 ,  H05K2201/10689 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/368

Abstract: A computer baseboard providing localized support for high pin count, high density components. The baseboard includes a first circuit board capable of supporting low pin count electrical components. The first circuit board has a surface onto which the low pin count electrical components are mounted, and an area to which a second, smaller, circuit board is connected in a parallel arrangement with the first circuit board. The second circuit board has a first surface onto which high pin count electrical components are mounted, and a second surface physically and electrically connected to the area on said first substrate. The first and second circuit boards together provide support for electrical components having higher pin counts and densities than the first circuit board can support individually, such as high performance microprocessors and chipsets. The first circuit board may be a low circuit density substrate while the second circuit board is a high circuit density substrate or multiple substrate layer board. Additionally, the second circuit board can be constructed of materials with better electrical characteristics, such as Cyanate Ester or other material having a low relative permeability, providing an advantage in meeting the tight timing characteristics of new, high performance microprocessors and chipsets.

Abstract translation: 电脑底板为高引脚数，高密度元件提供本地化支持。 该基板包括能够支持低引脚数的电气部件的第一电路板。 第一电路板具有安装有低引脚数电气部件的表面和与第一电路板并联连接的第二较小电路板的区域。 第二电路板具有安装有高引脚数电气部件的第一表面和与第一基板上的区域物理和电连接的第二表面。 第一和第二电路板一起为具有比第一电路板可以单独支持的更高的引脚数和密度的电部件提供支持，例如高性能微处理器和芯片组。 第一电路板可以是低电路密度衬底，而第二电路板是高电路密度衬底或多个衬底层板。 此外，第二电路板可以由具有更好电气特性的材料构成，例如氰酸酯或具有低相对磁导率的其它材料，提供了满足新的高性能微处理器和芯片组的紧密定时特性的优点。

公开(公告)号：US5801925A

公开(公告)日：1998-09-01

申请号：US693731

申请日：1996-08-07

Applicant: Joan M. Boada Fonts

Inventor： Joan M. Boada Fonts

IPC: H05K5/00 ,  B60R16/02 ,  B60R16/023 ,  H05K1/00 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34 ,  H05K3/36 ,  H05K5/02 ,  H05K7/10

CPC classification number: B60R16/0239 ,  H05K1/0265 ,  H05K1/141 ,  H05K1/144 ,  H05K1/148 ,  H05K1/0298 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/0352 ,  H05K2201/098 ,  H05K2201/10053 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10333 ,  H05K3/3447 ,  H05K3/361 ,  H05K3/366 ,  H05K3/368

Abstract: An automotive junction box for controlling the flow of power and control signals throughout the interior of an automobile having controllable features. The junction box includes a housing and a first printed circuit board disposed within the housing. The first printed circuit board having a plurality of first conductive elements with a first thickness for carrying power from and through the housing. The first printed circuit board further having a plurality of second conductive elements with a second thickness for relaying control signals from the housing for actuating the features. The junction box further includes componentry attaching to the board and/or the conductive elements. As a result of using these two conducting element thicknesses, the junction box operates as an electrical distribution center and a center for electronic functions.

Abstract translation: 一种用于控制整个汽车内部的功率和控制信号流动的汽车接线盒，具有可控特征。 接线盒包括壳体和布置在壳体内的第一印刷电路板。 所述第一印刷电路板具有多个第一导电元件，所述第一导电元件具有第一厚度，用于承载和穿过所述壳体的电力。 第一印刷电路板还具有多个具有第二厚度的第二导电元件，用于中继来自壳体的控制信号以致动特征。 接线盒还包括连接到板和/或导电元件的组件。 作为使用这两个导电元件厚度的结果，接线盒用作配电中心和用于电子功能的中心。

公开(公告)号：US5538433A

公开(公告)日：1996-07-23

申请号：US292500

申请日：1994-08-18

Applicant: Hiroshi Arisaka

Inventor： Hiroshi Arisaka

IPC: H01R11/01 ,  H01L23/053 ,  H01R12/51 ,  H01R33/76 ,  H05K1/02 ,  H05K1/14 ,  H05K3/36 ,  H05K3/42 ,  H05K7/10 ,  H01R23/76

CPC classification number: H05K1/141 ,  H01R12/523 ,  H05K1/0218 ,  H05K7/1084 ,  H05K2201/049 ,  H05K2201/09309 ,  H05K2201/10333 ,  H05K2201/10704 ,  H05K3/368 ,  H05K3/429

Abstract: A PGA connector for a microprocessor has a multilayer base board assembly with alternating conductive and dielectric layers of preselected thicknesses through which signal pins, current source pins and a grounding pin extend. The signal pins are insulated from the conductive layers and the current and grounding pin are connected to preselected conductive layers. A series of connecting apertures formed by holes with respective conductive linings extend through the layers at selected locations between pins to interconnect selected conductive layers. The connecting apertures interconnect all conductive layers of the base board or, in another example, alternately positioned connecting apertures interconnect only respective different sets of alternately positioned conductive layers of the base board enabling improved shielding and impedance regulation and matching.

Abstract translation: 用于微处理器的PGA连接器具有多层基板组件，其具有预定厚度的交替导电和介电层，信号引脚，电流源引脚和接地引脚通过该预选厚度延伸。 信号引脚与导电层绝缘，电流和接地引脚连接到预选的导电层。 由具有相应导电衬里的孔形成的一系列连接孔在引脚之间的选定位置处延伸穿过层以互连所选择的导电层。 连接孔互连基板的所有导电层，或者在另一示例中，交替地定位的连接孔仅互连的基板的交替定位的导电层的互不相同的组合，从而能够改善屏蔽和阻抗调节和匹配。

公开(公告)号：US5343359A

公开(公告)日：1994-08-30

申请号：US983086

申请日：1992-11-19

Applicant: David M. Morton ,  Stephen A. Bowen

Inventor： David M. Morton ,  Stephen A. Bowen

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/36 ,  H05K7/20

CPC classification number: H05K7/20254 ,  H05K1/141 ,  H05K1/0206 ,  H05K2201/066 ,  H05K2201/10303 ,  H05K2201/10333 ,  H05K2201/2036 ,  H05K3/368

Abstract: The present invention discloses a method and apparatus for conductively transferring heat away from electrical devices located on daughter boards attached to mother boards. The preferred method involves the steps of conductively transferring heat from each electrical device to a conductive layer located within the daughter board, transferring heat from the conductive layer within the daughter board to a conductive structure located on the surface of the daughter board, and transferring heat from the conductive structure to a cooling surface located on the cold plate. The preferred apparatus includes a mother board, a cold plate adjacent the mother board and attached to the mother board, a daughter board with an electrical device attached thereto, the daughter board attached to the mother board opposite the cold plate. The daughter board lies in a plane which is adjacent and substantially parallel to the plane of the mother board. Also included is conductive heat transfer means for conductively transferring heat energy from the electrical device on the daughter board to the cold plate.

Abstract translation: 本发明公开了一种从位于母板上的子板上的电气设备导电地传导热量的方法和装置。 优选的方法包括以下步骤：将热量从每个电气设备传导到位于子板内的导电层，将热量从子板内的导电层转移到位于子板表面上的导电结构，并传递热量 从导电结构到位于冷板上的冷却表面。 优选的装置包括母板，与母板相邻的冷板并附着在母板上，附着有电子装置的子板，附着在与冷板相对的母板上的子板。 子板位于与母板平面相邻且基本平行的平面中。 还包括用于将热能从子板上的电气装置传导到冷板的导热传热装置。

公开(公告)号：US5303466A

公开(公告)日：1994-04-19

申请号：US855243

申请日：1992-03-23

Applicant: Kazuyuki Ozai ,  Tomonari Ohtsuki ,  Takakatsu Inoue

Inventor： Kazuyuki Ozai ,  Tomonari Ohtsuki ,  Takakatsu Inoue

IPC: H01R43/20 ,  H05K3/30 ,  H05K7/10

CPC classification number: H05K3/303 ,  H01R43/205 ,  H05K7/1084 ,  H05K2201/10204 ,  H05K2201/10333 ,  H05K2201/10704 ,  H05K2201/10962 ,  Y02P70/613 ,  Y10S269/903 ,  Y10T29/49139 ,  Y10T29/49149 ,  Y10T29/49895

Abstract: A surface mounting method for mounting an electronic part having a great number of contacts onto a circuit board. A jig provided with dummy contacts is prepared whose size, number and arrangement are substantially the same as those of contacts of an electronic part to be mounted on a circuit board. The dummy contacts of the jig are then fitted with mating contacts which are to be fitted with the contacts of the electronic part. Thereafter, the jig provided with the dummy contacts fitted with the mating contacts is mounted onto the circuit board at a predetermined position thereon. The mating contacts are then mounted and fixed onto the circuit board. The jig is then removed from the circuit board. The contacts of the electronic part are then fitted with the mating contacts fixed to the circuit board. As an alternative, double ended socket contact members are prepared, each having socket contacts on both ends. Pin contacts of a circuit board are fitted in the socket contacts of the double ended socket contact members on their one ends and then pin contacts of an electronic part are fitted in the socket contacts of the members on their other ends.

Abstract translation: 一种用于将具有大量触点的电子部件安装到电路板上的表面安装方法。 准备设置有虚拟触点的夹具，其尺寸，数量和布置与要安装在电路板上的电子部件的触点基本相同。 然后，夹具的虚拟触点装配有与电子部件的触点配合的配合触头。 此后，设置有装配有配合触点的虚拟触头的夹具在其上的预定位置安装到电路板上。 然后将配合触点安装并固定在电路板上。 然后将夹具从电路板上取出。 然后将电子部件的触点与固定到电路板的配合触头配合。 作为替代方案，准备双端插座接触构件，每个具有两端的插座触点。 电路板的引脚触点在其一端安装在双端插座触头构件的插座触点中，然后将电子部件的针触点安装在其另一端的构件的插座触点中。

公开(公告)号：US5303123A

公开(公告)日：1994-04-12

申请号：US994273

申请日：1992-12-21

Applicant: Kirk R. Chandler ,  William C. Sherard, Jr.

Inventor： Kirk R. Chandler ,  William C. Sherard, Jr.

IPC: H01R9/05 ,  H05K3/30 ,  H01R23/68

CPC classification number: H01R9/0503 ,  H05K3/301 ,  H05K2201/10333 ,  H05K2201/10393 ,  H05K2201/10446 ,  H05K2203/176

Abstract: A retainer for removable components that plug into a printed circuit board retains the removable component in an associated sockets on a printed circuit board. The retainer has the form of a clip including a retaining surface that applies a retaining force to the component. The retaining force is largely a spring force that directs the leads into the associated sockets by applying pressure to the top of the component. The retainer further has a positioning surface that positions the retaining surface in association with the component. This is done by the positioning surface engaging the exposed exterior surface of the associated sockets. A connecting surface connects the retaining surface to the positioning surface around the circuit board. In the preferred embodiment, the component is a crystal oscillator that plugs into the printed circuit board. Such crystal oscillators are removable to permit changing the operating frequency of an associated microwave transmission circuit.

Abstract translation: 用于插入印刷电路板的可拆卸部件的保持器将可拆卸部件保持在印刷电路板上的相关插座中。 保持器具有夹子的形式，该夹子包括向构件施加保持力的保持表面。 保持力主要是弹簧力，通过向部件的顶部施加压力来将引线引导到相关联的插座中。 保持器还具有定位表面，其将保持表面与部件相关联地定位。 这通过定位表面接合相关插座的暴露的外表面来完成。 连接表面将保持表面连接到电路板周围的定位表面。 在优选实施例中，该部件是插入印刷电路板的晶体振荡器。 这种晶体振荡器是可去除的，以允许改变相关联的微波传输电路的工作频率。