公开(公告)号：US20120326203A1

公开(公告)日：2012-12-27

申请号：US13603096

申请日：2012-09-04

Applicant: Kyong Jun KIM

Inventor： Kyong Jun KIM

IPC: H01L33/62

CPC classification number: F21V23/00 ,  F21K9/00 ,  G02B6/0031 ,  G02B6/0068 ,  G02B6/0083 ,  G02B6/0085 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49107 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/281 ,  H05K3/3426 ,  H05K3/3452 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/2009 ,  H05K2203/0577 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Provides are a light emitting apparatus and a light unit having the same. The light emitting apparatus comprises a light emitting device comprising a light emitting element and a plurality of external leads, and a plurality of electrode pads under the light emitting device.

公开(公告)号：US20120318564A1

公开(公告)日：2012-12-20

申请号：US13552153

申请日：2012-07-18

Applicant: Ki-Geon Lee

Inventor： Ki-Geon Lee

IPC: H05K7/20

CPC classification number: H05K1/0206 ,  H05K1/116 ,  H05K3/0061 ,  H05K3/3447 ,  H05K3/42 ,  H05K2201/09609 ,  H05K2201/09781 ,  H05K2201/0979 ,  H05K2201/10106 ,  H05K2201/10303 ,  H05K2201/10651

Abstract: In the a circuit board, a plurality of conductive layer regions coated with a conductor are separately formed on both sides of an insulating substrate, the conductive layer region formed on either side of an insulating region on each of the both sides of the insulating substrate. The plurality of the conductive layer regions include a plurality of through holes which penetrate through the insulating substrate and are coated with a conductor over an inner wall, the conductor in the through hole electrically conducts the coated conductor of the plurality of the conductive layer regions, one of the lead pins is connected to one of the separated conductive layer regions on the both sides based on the insulating region, and the other lead pin is connected to the other conductive layer region.

Abstract translation: 在电路基板中，在绝缘基板的两面分别形成涂布有导体的多个导电层区域，该导电层区域形成于绝缘基板的两侧的绝缘区域的两侧。 多个导电层区域包括穿过绝缘基板并在内壁上涂覆有导体的多个通孔，通孔中的导体导电多个导电层区域的涂覆导体， 基于绝缘区域，引线引线之一连接到两侧的分离的导电层区域中的一个，另一个引脚与另一导电层区域连接。

公开(公告)号：US20120292093A1

公开(公告)日：2012-11-22

申请号：US13541947

申请日：2012-07-05

Applicant: Ki-Geon Lee

Inventor： Ki-Geon Lee

IPC: H05K1/11

CPC classification number: H05K1/0206 ,  H05K1/116 ,  H05K3/0061 ,  H05K3/3447 ,  H05K3/42 ,  H05K2201/09609 ,  H05K2201/09781 ,  H05K2201/0979 ,  H05K2201/10106 ,  H05K2201/10303 ,  H05K2201/10651

Abstract: In a circuit board, a plurality of conductive layer regions coated with a conductor are separately formed on both sides of an insulating substrate, the conductive layer region formed on either side of an insulating region on each of the both sides of the insulating substrate. The plurality of the conductive layer regions include a plurality of through holes which penetrate through the insulating substrate and are coated with a conductor over an inner wall, the conductor in the through hole electrically conducts the coated conductor of the plurality of the conductive layer regions, one of the lead pins is connected to one of the separated conductive layer regions on the both sides based on the insulating region, and the other lead pin is connected to the other conductive layer region.

Abstract translation: 在电路基板中，在绝缘基板的两面分别形成涂覆有导体的多个导电层区域，导电层区域形成在绝缘基板的两侧的绝缘区域的两侧的任一侧。 多个导电层区域包括穿过绝缘基板并在内壁上涂覆有导体的多个通孔，通孔中的导体导电多个导电层区域的涂覆导体， 基于绝缘区域，引线引线之一连接到两侧的分离的导电层区域中的一个，另一个引脚与另一导电层区域连接。

公开(公告)号：US20120088335A1

公开(公告)日：2012-04-12

申请号：US13313908

申请日：2011-12-07

Applicant: Masayuki ITOH ,  Takao ISHIKAWA ,  Tomokazu NAKASHIMA

Inventor： Masayuki ITOH ,  Takao ISHIKAWA ,  Tomokazu NAKASHIMA

IPC: H01L21/50

CPC classification number: H05K1/182 ,  H01L33/483 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H05K2201/10106 ,  H05K2201/10651 ,  H01L2924/00

Abstract: Manufacturing method of an electronic component including connecting one lead of a pair of leads to a surface parallel with a pn connection layer of an electronic element having a structure where the p-type layer and the n-type layer are connected by the pn connection layer provided between the p-type layer and the n-type layer, connecting another lead to another surface parallel with the pn connection layer; and forming a supporting part of the pair of the leads that is connected to and supporting the electronic element, and an electrode part functioning as an electrode, by bending the pair of the leads to an outside.

Abstract translation: 一种电子部件的制造方法，包括将一对引线的一个引线连接到与pn连接层与p型层和n型层连接的电子元件的pn连接层平行的表面 设置在p型层和n型层之间，将另一引线连接到与pn连接层平行的另一表面; 并且通过将一对引线弯曲到外部，形成连接并支撑电子元件的一对引线的支撑部分和用作电极的电极部分。

公开(公告)号：US20100302745A1

公开(公告)日：2010-12-02

申请号：US12787376

申请日：2010-05-25

Applicant: FU-BIAU HSU ,  CHUN-JUNG KUO

Inventor： FU-BIAU HSU ,  CHUN-JUNG KUO

IPC: H05K1/00 ,  H05K7/18

CPC classification number: H05K3/326 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H05K1/038 ,  H05K3/32 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10598 ,  H05K2201/10651 ,  H05K2201/1084 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention discloses a lead frame having stitching-assisting structures, an electronic device having such lead frame, and an apparatus having such electronic device. The apparatus according to the invention also includes a flexible substrate and a plurality of conductive threads. Particularly, the conductive threads are sewn through the flexible substrate and the stitching-assisting structures to fix the electronic device on the flexible substrate, and the conductive threads electrically contact with the stitching-assisting structures of the electronic device.

Abstract translation: 本发明公开了一种具有缝合辅助结构的引线框架，具有该引线框架的电子设备以及具有该电子设备的设备。 根据本发明的装置还包括柔性基板和多个导电线。 特别地，导电线通过柔性基板和缝合辅助结构缝合，以将电子装置固定在柔性基板上，并且导电线与电子装置的缝合辅助结构电接触。

公开(公告)号：US07820920B2

公开(公告)日：2010-10-26

申请号：US12284036

申请日：2008-09-17

Applicant: Yong Dong ,  Jiebing Pan ,  Tieming Luo

Inventor： Yong Dong ,  Jiebing Pan ,  Tieming Luo

IPC: H01L23/495

CPC classification number: H05K3/301 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/2036 ,  H05K2203/167 ,  H05K2203/304

Abstract: The present application discloses a casing and a corresponding mounting device, for protecting pins of an element from melting during a process flow in which the element is soldered on a circuit board, while saving an area required for soldering the element on the circuit board. The casing comprises a hollow body provided with at least one opening.

Abstract translation: 本申请公开了一种壳体和相应的安装装置，用于在将元件焊接在电路板上的工艺流程期间保护元件的销钉熔化，同时节省了将元件焊接在电路板上所需的面积。 壳体包括设置有至少一个开口的中空主体。

公开(公告)号：US07677763B2

公开(公告)日：2010-03-16

申请号：US11541314

申请日：2006-09-29

Applicant: Timothy Chan

Inventor： Timothy Chan

IPC: F21V21/00 ,  F21S4/00 ,  F21V29/00

CPC classification number: H01R33/09 ,  F21K9/00 ,  F21V19/0025 ,  F21V19/042 ,  F21Y2105/10 ,  F21Y2107/00 ,  F21Y2107/30 ,  F21Y2115/10 ,  H05K3/107 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/09472 ,  H05K2201/09981 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10765 ,  Y10S362/80

Abstract: A method and system for attaching LEDs to circuitry which would protect the LEDs from heat damage and allows for individual LEDs to be removed.

Abstract translation: 一种用于将LED附接到电路的方法和系统，其将保护LED免受热损伤并且允许去除各个LED。

公开(公告)号：US20090231818A1

公开(公告)日：2009-09-17

申请号：US12471405

申请日：2009-05-24

Applicant: Liang-Ming Yu ,  Chien-Lung Tsou ,  Hsin-Li Lin ,  Yuming Liu

Inventor： Liang-Ming Yu ,  Chien-Lung Tsou ,  Hsin-Li Lin ,  Yuming Liu

IPC: H05K1/18

CPC classification number: H05K1/18 ,  H05K1/0271 ,  H05K3/305 ,  H05K3/3442 ,  H05K2201/09418 ,  H05K2201/10522 ,  H05K2201/10537 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10977 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic element module and an electronic device using the same are provided. The electronic element module includes a circuit board and at least a capacitor. In one embodiment, the circuit board has a plurality of contacts. The capacitor is disposed on the circuit board with a gap therebetween. Besides, the capacitor has a plurality of terminals electrically connected to the contacts correspondingly. The gap is filled with a glue.

Abstract translation: 提供一种电子元件模块和使用其的电子装置。 电子元件模块包括电路板和至少一个电容器。 在一个实施例中，电路板具有多个触点。 电容器设置在电路板上，其间具有间隙。 此外，电容器具有相应地电连接到触点的多个端子。 间隙充满了胶水。

公开(公告)号：US20090185096A1

公开(公告)日：2009-07-23

申请号：US12196306

申请日：2008-08-22

Applicant: Yong-Eun PARK

Inventor： Yong-Eun PARK

IPC: H05K1/16 ,  B23K1/00 ,  G02F1/1333

CPC classification number: H05K1/111 ,  H05K1/0269 ,  H05K1/0295 ,  H05K3/3421 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/09954 ,  H05K2201/10651 ,  Y02P70/611 ,  Y02P70/613

Abstract: A printed circuit board includes; first and second pads spaced apart from each other; and a dielectric region which surrounds the first and second pads, wherein each of the first and second pads includes a main region and an expansion region which extends from the main region, and wherein the main regions of the first and second pads are configured to have a first surface mount device mounted thereon, wherein the expansion regions and portions of the main regions which directly adjoin the expansion regions of the first and second pads are configured to have a second surface mount device mounted thereon, and wherein the first and second surface mount devices have different sizes.

Abstract translation: 印刷电路板包括： 第一和第二垫彼此间隔开; 以及围绕所述第一和第二焊盘的电介质区域，其中所述第一和第二焊盘中的每一个包括主区域和从所述主区域延伸的扩展区域，并且其中所述第一和第二焊盘的主区域被配置为具有 安装在其上的第一表面安装装置，其中所述扩展区域和与所述第一和第二焊盘的所述扩展区域直接相邻的所述主要区域的部分被配置为具有安装在其上的第二表面安装装置，并且其中所述第一和第二表面安装 设备具有不同的尺寸。

公开(公告)号：US07561437B2

公开(公告)日：2009-07-14

申请号：US11160393

申请日：2005-06-22

Applicant: Liang-Ming Yu ,  Chien-Lung Tsou ,  Hsin-Li Lin ,  Yuming Liu

Inventor： Liang-Ming Yu ,  Chien-Lung Tsou ,  Hsin-Li Lin ,  Yuming Liu

IPC: H05K7/00

CPC classification number: H05K1/18 ,  H05K1/0271 ,  H05K3/305 ,  H05K3/3442 ,  H05K2201/09418 ,  H05K2201/10522 ,  H05K2201/10537 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10977 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic element module and an electronic device using the same are provided. The electronic element module includes a circuit board and a plurality of electronic elements. In one embodiment, the circuit board has a plurality of leg-holes. Each of the electronic elements includes a body and a plurality of legs that connected to the body. Wherein, the bodies of the electronic elements are glued each other, and the legs of the electronic elements are partially plugged in the leg-holes. In another one embodiment, the circuit board has a plurality of contacts. The electronic element is disposed on the circuit board with a gap therebetween. The electronic element has a plurality of terminals that electrically connect to the contacts of the circuit board correspondingly. Otherwise, the gap is filled with glue.

Abstract translation: 提供一种电子元件模块和使用其的电子装置。 电子元件模块包括电路板和多个电子元件。 在一个实施例中，电路板具有多个腿孔。 每个电子元件包括主体和连接到主体的多个腿。 其中，电子元件的主体彼此粘合，并且电子元件的腿部分地插入到腿孔中。 在另一个实施例中，电路板具有多个触点。 电子元件设置在电路板上，其间具有间隙。 电子元件具有多个端子，其相应地电连接到电路板的触头。 否则，缝隙填充胶水。