摘要:
Provided are a kit and a laminate which are capable of suppressing residues derived from a temporary adhesive in manufacture of a semiconductor. The kit for manufacturing a semiconductor device includes a composition which contains a solvent A; a composition which contains a solvent B; and a composition which contains a solvent C, in which the kit is used when a temporary adhesive layer is formed on a first substrate using a temporary adhesive composition containing a temporary adhesive and the solvent A, at least some of an excessive amount of the temporary adhesive on the first substrate is washed using the composition containing the solvent B, a laminate is manufactured by bonding the first substrate and a second substrate through the temporary adhesive layer, one of the first substrate and the second substrate is peeled off from the laminate at a temperature of lower than 40° C., and then the temporary adhesive remaining on at least one of the first substrate or the second substrate is washed using the composition containing the solvent C, and the solvent A, the solvent B, and the solvent C respectively satisfy a predetermined vapor pressure and a predetermined saturated solubility.
摘要:
A colored adhesive tape (1), in particular a yellow, orange-colored, or black adhesive tape (1), preferably a cable wrapping tape, with a temperature class of at least T3 (LV 312), including a textile substrate with a polymer plastic substrate (4, 4a, 4b), on which an adhesive material (5, 5a, 5b) is applied. In order to improve the temperature stability of the tape, while maintaining advantageous properties, the color of at least a part of the substrate (4, 4a, 4b) is formed by the inherent color of the polymer plastic material. The tape is preferably substrate formed of a polymer plastic materials which are aromatic, nitrogen-containing polymers from the group of polyoxadiazoles (POD), polybenzobisoxazoles (PBO) or polybenzimidazoles (PBI) (4, 4a, 4b). The adhesive tape (1) may be used as a cable harness (3).
摘要:
An adhesive used in underground applications where vegetation is present wherein the adhesive has been doped with a material or materials that deter the growth properties of adjacent vegetation. The materials can include Zinc, Copper Sulfate, Copper Oxide, as well as sulfates of Zinc, Manganese, and Nickel, in quantities that will repel or deter the advancement of roots and invasive vegetation into fittings and joints in an underground system. The adhesive is used to bond a conduit and a fitting in an air-tight and water tight seal, and the inclusion of the root deterrent material resists invasion of nearby roots into the piping. The root deterring supplements to the adhesive to not degrade the performance of the adhesive and actually repel roots in the vicinity of the materials.
摘要:
Disclosed is an impact resistant adhesive composition including silica and core-shell polymer particles. The impact resistant adhesive composition includes: (a) a first component including an epoxy resin and a polymeric dispersant, or an epoxy resin-polymeric dispersant prepolymer; (b) a second component including silica and core-shell polymer particles having a particle diameter of 20 to 250 nm; and (c) a third component including a curing agent and an additive mixture. The polymeric dispersant is a flexible polyether monoamine or polyether diamine which includes a mixed form of a lipophilic alkyl oxide chain and a hydrophilic ethylene oxide chain in the main chain, and has a weight average molecular weight of 500 to 4,000.
摘要:
An adhesive composition, a process of manufacture and a method of filling a surface having voids with a void filler are disclosed herein. Upon insertion between opposing surfaces or around an exposed surface, the void filler expands into and around the voids, filling surfaces having voids and covering irregularities of concrete structures.
摘要:
The present invention discloses an anisotropic conductive adhesive comprising an insulating adhesive component and a number of conductive particles dispersed in the insulating adhesive component, wherein the insulating adhesive component contains a crosslinked rubber resin. The anisotropic conductive adhesive of the present invention prevents exfoliation of an adhesive or reduction in adhesive strength of circuit by minimizing its the heat-contraction occurring in the process of a polymerization or a hardening reaction when connecting micro-circuits, whereby a short circuit between adjacent electrodes can be prevented when connecting the circuits, and excellent connection reliability according to a long-term use is achieved.
摘要:
An injection pressure waveform for use as a target value for injection pressure feedback control is set based on the actual injection pressure waveform detected when a conforming molded article is obtained. Alternatively, the target injection pressure waveform may be set by modifying a previously retained injection pressure waveform or an actual injection pressure waveform. The previously retained injection pressure waveform or actual injection pressure waveform is displayed on a screen of a display device (T1). Two points on the displayed injection pressure waveform are assigned, and the pressure waveform is modified into a line connecting these two points (T3, T6, T8). Further, two points on the injection pressure waveform and one point between these two points are assigned, and the pressure waveform is modified into a circular arc connecting these three points (T4, T7, T8). The injection pressure waveform modified in this manner is set as the target value for the injection pressure feedback control (T8, T9).
摘要:
An adhesive construction, characterized by excellent converting and adhesive performance, comprises a facestock, a face-side adhesive (FSA) in contact with a first surface of the facestock, and a liner-side adhesive (LSA) in contact with the FSA. The FSA is compounded with an organopolysiloxane or modified organopolysiloxane. Single layer constructions, and multilayer constructions comprising more than two adhesive layers, and unique adhesive compositions, are also provided. The constructions can be run in high-speed converting presses and adhere well to a variety of substrates.
摘要:
An elastomeric-based hot melt adhesive composition having a variety of end uses, particularly in construction and elastic attachment applications on nonwoven disposable articles. The composition includes an elastomeric rubber polymer or a mixture of elastomeric rubber polymers together with a semicrystalline olefinic polymer or a mixture of semicrystalline olefinic polymers, a tackifier resin, a plasticizer, a wax and a stabilizer. The preferred elastomeric rubber polymer is an ethylene-propylene rubber copolymer (EPR) and/or an ethylene-propylene diene monomer rubber terpolymer (EPDM). The hot melt adhesive composition can be applied using common application techniques such as extruding or spraying.
摘要:
A novel element is added to a bowling game by incorporating an intraviolet light sensitive dye or pigment in a bowling surface (24), a gutter (25), a bowling ball (26), and/or a bowling pin (28). A bowling establishment (10) is provided with an ultraviolet light source (50), (52), which, when conventional lighting, (42), (44), (46) is dimmed and/or turned off, will cause the ultraviolet light sensitive dye or pigment to fluoresce such that the components (24), (26), (30) fluoresce and glow to provide a pleasing effect attractive to bowlers.