Abstract:
A double-sided tape device comprises a shell, a first substrate located in the shell, a super-aligned carbon nanotube array located in the shell and on the first substrate, and at least two drawing elements located on the first substrate and spaced from the super-aligned carbon nanotube array. The super-aligned carbon nanotube array is configured for drawing a double-sided tape therefrom. The at least two drawing elements is configured for fixing the tape and drawing out the double-sided tape from the shell.
Abstract:
The present disclosure provides a stretch releasing adhesive assembly, a housing assembly, and a mobile terminal. The stretch releasing adhesive assembly includes: a stretch releasing adhesive layer, having a pull portion at an end of the stretch releasing adhesive layer; and a first pull layer, the first pull layer and the pull portion being superposed and connected, the first pull layer being provided with at least one tear line in a position corresponding to the pull portion.
Abstract:
The present invention relates to a non-oriented electrical steel sheet adhesive coating composition including the constituent elements below, a non-oriented electrical steel sheet product, and a manufacturing method thereof. The non-oriented electrical steel sheet adhesive coating composition includes: a first component including an organic/inorganic composite; and a second component including a composite metal phosphate, wherein the organic/inorganic composite is formed by having inorganic nanoparticles chemically substituted with some functional groups in an organic resin, the organic resin is one, or two or more, selected from an epoxy-based resin, an ester-based resin, an acrylic resin, a styrene-based resin, a urethane-based resin, and an ethylene-based resin, and the inorganic nanoparticles are one, or two or more, selected from SiO2, Al2O3, TiO2, MgO, ZnO, and ZrO2.
Abstract:
Provided is a solder transfer sheet which is capable of increasing the amount of solder to be transferred without the occurrence of bridging. A solder transfer sheet 1A includes a base material 5, an adhesive layer 4 formed on the surface of the base material 5, a solder powder-containing adhesive layer 3 formed on the surface of the adhesive layer 4, and a solder powder layer 2 formed on the surface of the solder powder-containing adhesive layer 3. In the solder powder layer 2, particles of solder powder 20 are arranged in a one-layer sheet form. In the solder powder-containing adhesive layer 3, solder powder 30 and an adhesive component 31 are mixed so as to have such a thickness that two or more layers of the solder powder 30 are stacked.
Abstract:
A string of coiled tubing for an electrical submersible well pump has insulated power conductors encased in an elastomeric jacket within the coiled tubing. A textured interface between the jacket and the inner side wall of the coiled tubing enhances frictional engagement between the jacket and the coiled tubing. The textured interface may be formed on the inner side wall of the coiled tubing and consist of a roughened or knurled surface. A tape may be wrapped helically around the jacket, the tape having an outer side with a textured surface in contact with the inner side wall of the coiled tubing. The textured interface may extend continuously for the length of the coiled tubing.
Abstract:
A curable composition for use in wound care comprising, apportioned between at least one Part A and at least one Part B: one or more alkenyl-group containing polymers (i) having at least one alkenyl group or moiety per molecule, one or more SiH-containing polymers (ii) having at least one Si—H unit per molecule; and a catalyst (iii) for curing by addition of alkenyl-containing polymer (i) to SiH-containing polymer (ii), Part A and Part B independently having viscosity at 23° C. in the range 5-300 Pa·s, preferably 10-100 Pa s, at a shearing rate of 10 s−1, and when combined in one Part having cure time at 23° C. in the range from 0.5 min to 25 min, wherein when dispensed into a location about a wound dressing, said wound dressing overlying a wound site and skin thereabout, said dispensing being so as to intimately contact and overlie an edge of said dressing and skin about said edge, the composition cures in contact with said edge and skin at 32° C. to an elastomer exhibiting zero or low tack at a time in the range from 0.5 to less than 30 minutes, apparatus for use with said composition comprising dispensing apparatus or wound dressing, a kit comprising the same, and methods of dispensing and curing the same and of using the same in sealing a wound dressing and in treating a wound site of a human in need thereof.
Abstract:
A quick curing resin composition, which can be used in conventionally used ovens, and a semiconductor device, which is excellent in reliability such as solder crack resistance or the like when the resin composition, is used as a die attach material for semiconductor. The resin composition has a sufficient low stress property, good adhesion and excellent bleeding property. The resin composition includes a filler (A), compound (B) having the structure represented by the formula (1) and a functional group represented by the formula (2) and a thermal radical initiator (C), and substantially not containing a photo polymerization initiator.
Abstract:
This invention is a film adhesive prepared from an adhesive composition comprising a polymer system, a film forming rubber compound, and curing agents for the polymeric system. The polymer system comprises a base polymer and electron donor and electron acceptor functionality.
Abstract:
A bioadhesive composition formed by polymerizing a homogeneous aqueous reaction mixture comprising from about 5% to about 50%, by weight of the reaction mixture, of at least one ionic water soluble monomer, from about 10% to about 50%, by weight of the reaction mixture, of at least one plasticizer (other than water), up to about 50%, by weight of the reaction mixture, of at least one non ionic water soluble monomer, up to about 40%, by weight of the reaction mixture, of water, optionally as well as up to about 10%, by weight of the reaction mixture, of at least one surfactant and from about 1% to about 30%, by weight of the reaction mixture, of at least one hydrophobic monomer and/or polymer. An electrolyte may be present, to enhance electrical conductivity, e.g. for use in biomedical electrodes.
Abstract:
Methods of bonding substrates, forming foams, and forming elastomers are provided, using compositions cured by the Michael addition reaction.