公开(公告)号：US09659946B2

公开(公告)日：2017-05-23

申请号：US15287672

申请日：2016-10-06

Applicant: Silicon Storage Technology, Inc.

Inventor： Chien-Sheng Su ,  Jeng-Wei Yang ,  Yueh-Hsin Chen

IPC: H01L27/11521 ,  H01L29/423 ,  H01L29/66 ,  H01L29/16

CPC classification number: H01L27/11521 ,  H01L21/28273 ,  H01L21/823425 ,  H01L29/1608 ,  H01L29/42328 ,  H01L29/66825

Abstract: A memory device having a pair of conductive floating gates with inner sidewalls facing each other, and disposed over and insulated from a substrate of first conductivity type. A pair of spaced apart conductive control gates each disposed over and insulated from one of the floating gates, and each including inner sidewalls facing each other. A pair of first spacers of insulation material extending along control gate inner sidewalls and over the floating gates. The floating gate inner sidewalls are aligned with side surfaces of the first spacers. A pair of second spacers of insulation material each extend along one of the first spacers and along one of the floating gate inner sidewalls. A trench formed into the substrate having sidewalls aligned with side surfaces of the second spacers. Silicon carbon disposed in the trench. Material implanted into the silicon carbon forming a first region having a second conductivity type.

公开(公告)号：US20170125429A1

公开(公告)日：2017-05-04

申请号：US15295022

申请日：2016-10-17

Applicant: Silicon Storage Technology, Inc.

Inventor： CHIEN-SHENG SU ,  FENG ZHOU ,  JENG-WEI YANG ,  HIEU VAN TRAN ,  NHAN DO

IPC: H01L27/115 ,  H01L29/423 ,  H01L29/66 ,  H01L21/28 ,  H01L29/788

CPC classification number: H01L27/11521 ,  H01L21/28273 ,  H01L27/11524 ,  H01L29/42328 ,  H01L29/66825 ,  H01L29/788 ,  H01L29/7881

Abstract: A memory device including a silicon substrate having a planar upper surface in a memory cell area and an upwardly extending silicon fin in a logic device area. The silicon fin includes side surfaces extending up and terminating at a top surface. The logic device includes spaced apart source and drain regions with a channel region extending there between (along the top surface and the side surfaces), and a conductive logic gate disposed over the top surface and laterally adjacent to the side surfaces. The memory cell includes spaced apart source and drain regions with a second channel region extending there between, a conductive floating gate disposed over one portion of the second channel region, a conductive word line gate disposed over another portion of the second channel region, a conductive control gate disposed over the floating gate, and a conductive erase gate disposed over the source region.

公开(公告)号：US09634020B1

公开(公告)日：2017-04-25

申请号：US15225425

申请日：2016-08-01

Applicant: Silicon Storage Technology, Inc.

Inventor： Chien Sheng Su ,  Mandana Tadayoni ,  Nhan Do

IPC: H01L27/115 ,  H01L21/762 ,  H01L27/11521 ,  H01L21/84 ,  H01L21/02 ,  H01L21/28 ,  H01L29/08 ,  H01L29/423 ,  H01L29/49 ,  H01L29/66 ,  H01L27/11534 ,  H01L27/11531

CPC classification number: H01L27/11521 ,  H01L21/02532 ,  H01L21/02634 ,  H01L21/28035 ,  H01L21/28273 ,  H01L21/76283 ,  H01L21/84 ,  H01L27/11531 ,  H01L27/11534 ,  H01L27/11536 ,  H01L27/1203 ,  H01L29/0847 ,  H01L29/42328 ,  H01L29/4916 ,  H01L29/66825 ,  H01L29/7881

Abstract: A method of forming a semiconductor device with memory cells and logic devices on the same silicon-on-insulator substrate. The method includes providing a substrate that includes silicon, a first insulation layer directly over the silicon, and a silicon layer directly over the first insulation layer. Silicon is epitaxially grown on the silicon layer in a first (memory) area of the substrate and not in a second (logic device) area of the substrate such that the silicon layer is thicker in the first area of the substrate relative to the second area of the substrate. Memory cells are formed in the first area of the substrate, and logic devices are formed in the second area of the substrate.

公开(公告)号：US09634018B2

公开(公告)日：2017-04-25

申请号：US15050309

申请日：2016-02-22

Applicant: Silicon Storage Technology, Inc.

Inventor： Chien-Sheng Su ,  Jeng-Wei Yang ,  Man-Tang Wu ,  Chun-Ming Chen ,  Hieu Van Tran ,  Nhan Do

IPC: H01L29/788 ,  H01L27/11521 ,  H01L21/28 ,  H01L29/423 ,  H01L29/66 ,  H01L29/78 ,  H01L27/105 ,  H01L27/11551

CPC classification number: H01L27/11521 ,  H01L21/28273 ,  H01L27/1052 ,  H01L27/11551 ,  H01L29/0847 ,  H01L29/42328 ,  H01L29/66795 ,  H01L29/66818 ,  H01L29/66825 ,  H01L29/785 ,  H01L29/7856 ,  H01L29/7881

Abstract: A non-volatile memory cell including a semiconductor substrate having a fin shaped upper surface with a top surface and two side surfaces. Source and drain regions are formed in the fin shaped upper surface portion with a channel region there between. A conductive floating gate includes a first portion extending along a first portion of the top surface, and second and third portions extending along first portions of the two side surfaces, respectively. A conductive control gate includes a first portion extending along a second portion of the top surface, second and third portions extending along second portions of the two side surfaces respectively, a fourth portion extending up and over at least some of the floating gate first portion, and fifth and sixth portions extending out and over at least some of the floating gate second and third portions respectively.

公开(公告)号：US09620216B2

公开(公告)日：2017-04-11

申请号：US14624476

申请日：2015-02-17

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Anh Ly ,  Thuan Vu ,  Hung Quoc Nguyen

IPC: G11C16/08 ,  G11C17/08 ,  G11C16/22 ,  G11C16/14 ,  G11C16/26

CPC classification number: G11C16/08 ,  G11C16/14 ,  G11C16/22 ,  G11C16/26 ,  G11C17/08 ,  G11C2216/26

Abstract: The disclosed embodiments comprise a flash memory device that can be configured to operate as a read only memory device. In some embodiments, the flash memory device can be configured into a flash memory portion and a read only memory portion.

公开(公告)号：US20170098474A1

公开(公告)日：2017-04-06

申请号：US14875533

申请日：2015-10-05

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Anh Ly ,  Thuan Vu ,  Hung Quoc Nguyen

IPC: G11C16/14 ,  G11C16/26 ,  G11C16/08

CPC classification number: G11C16/14 ,  G11C7/065 ,  G11C8/08 ,  G11C16/08 ,  G11C16/10 ,  G11C16/26 ,  G11C16/28 ,  G11C2216/04 ,  H01L27/112 ,  H01L27/11582 ,  H01L28/00

Abstract: The present invention relates to a flash memory system wherein one or more circuit blocks utilize fully depleted silicon-on-insulator transistor design to minimize leakage

公开(公告)号：US09601500B2

公开(公告)日：2017-03-21

申请号：US14639063

申请日：2015-03-04

Applicant: Silicon Storage Technology, Inc.

Inventor： Jinho Kim ,  Vipin Tiwari ,  Nhan Do ,  Xian Liu ,  Xiaozhou Qian ,  Ning Bai ,  Kai Man Yue

IPC: H01L27/115 ,  H01L29/423 ,  H01L29/788

CPC classification number: H01L27/11524 ,  H01L23/57 ,  H01L27/11226 ,  H01L27/11233 ,  H01L27/11253 ,  H01L27/11519 ,  H01L29/42328 ,  H01L29/788 ,  H01L29/7881

Abstract: A memory device that includes a plurality of ROM cells each having spaced apart source and drain regions formed in a substrate with a channel region therebetween, a first gate disposed over and insulated from a first portion of the channel region, a second gate disposed over and insulated from a second portion of the channel region, and a conductive line extending over the plurality of ROM cells. The conductive line is electrically coupled to the drain regions of a first subgroup of the ROM cells, and is not electrically coupled to the drain regions of a second subgroup of the ROM cells. Alternately, a first subgroup of the ROM cells each includes a higher voltage threshold implant region in the channel region, whereas a second subgroup of the ROM cells each lack any higher voltage threshold implant region in the channel region.

公开(公告)号：US09548087B2

公开(公告)日：2017-01-17

申请号：US14229763

申请日：2014-03-28

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Samar Saha

IPC: G11C7/06 ,  G11C16/28 ,  H01L21/28 ,  H01L21/8234 ,  H01L21/8238 ,  H01L29/10 ,  H01L29/423 ,  H01L29/66 ,  H01L29/78 ,  H01L29/792

CPC classification number: G11C7/065 ,  G11C7/06 ,  G11C7/062 ,  G11C16/28 ,  H01L21/28282 ,  H01L21/823412 ,  H01L21/823807 ,  H01L29/1083 ,  H01L29/42368 ,  H01L29/4238 ,  H01L29/66833 ,  H01L29/7835 ,  H01L29/792

Abstract: Systems and methods are disclosed for providing selective threshold voltage characteristics via use of MOS transistors having differential threshold voltages. In one exemplary embodiment, there is provided a metal oxide semiconductor device comprising a substrate of semiconductor material having a source region, a drain region and a channel region therebetween, an insulating layer over the channel region, and a gate portion of the insulating layer. Moreover, with regard to the device, the shape of the insulating layer and/or the shape or implantation of a junction region are of varied dimension as between the gate-to-drain and gate-to-source junctions to provide differential threshold voltages between them.

Abstract translation: 公开了用于通过使用具有差分阈值电压的MOS晶体管提供选择性阈值电压特性的系统和方法。 在一个示例性实施例中，提供了一种金属氧化物半导体器件，其包括半导体材料的衬底，其具有源极区，漏极区和它们之间的沟道区，沟道区上方的绝缘层和绝缘层的栅极部。 此外，关于器件，绝缘层的形状和/或接合区域的形状或注入在栅极 - 漏极和栅极 - 源极结之间具有不同的尺寸，以提供不同的阈值电压 他们。

公开(公告)号：US20160379941A1

公开(公告)日：2016-12-29

申请号：US15258069

申请日：2016-09-07

Applicant: Silicon Storage Technology, Inc.

Inventor： Jinho Kim ,  Vipin Tiwari ,  Nhan Do ,  Xian Liu ,  Xiaozhou Qian ,  Ning Bai ,  Kai Man Yue

IPC: H01L23/00 ,  H01L29/423 ,  H01L27/115 ,  H01L29/788

CPC classification number: H01L27/11524 ,  H01L23/57 ,  H01L27/11226 ,  H01L27/11233 ,  H01L27/11253 ,  H01L27/11519 ,  H01L29/42328 ,  H01L29/788 ,  H01L29/7881

Abstract: A memory device that includes a plurality of ROM cells each having spaced apart source and drain regions formed in a substrate with a channel region therebetween, a first gate disposed over and insulated from a first portion of the channel region, a second gate disposed over and insulated from a second portion of the channel region, and a conductive line extending over the plurality of ROM cells. The conductive line is electrically coupled to the drain regions of a first subgroup of the ROM cells, and is not electrically coupled to the drain regions of a second subgroup of the ROM cells. Alternately, a first subgroup of the ROM cells each includes a higher voltage threshold implant region in the channel region, whereas a second subgroup of the ROM cells each lack any higher voltage threshold implant region in the channel region.

公开(公告)号：US20160359024A1

公开(公告)日：2016-12-08

申请号：US15164796

申请日：2016-05-25

Applicant: Silicon Storage Technology, Inc.

Inventor： Nhan Do ,  Vipin Tiwari

IPC: H01L29/66 ,  H01L21/768 ,  H01L21/265 ,  H01L27/115 ,  H01L21/28

CPC classification number: H01L29/66825 ,  H01L21/28273 ,  H01L27/11529 ,  H01L29/66484 ,  H01L29/7885

Abstract: A method of forming a memory device on a semiconductor substrate having a memory region (with floating and control gates), a first logic region (with first logic gates) and a second logic region (with second logic gates). A first implantation forms the source regions adjacent the floating gates in the memory region, and the source and drain regions adjacent the first logic gates in the first logic region. A second implantation forms the source and drain regions adjacent the second logic gates in the second logic region. A third implantation forms the drain regions adjacent the control gates in the memory region, and enhances the source region in the memory region and the source/drain regions in the first logic region. A fourth implantation enhances the source/drain regions in the second logic region.

Abstract translation: 在具有存储区域（具有浮动和控制栅极）的第一逻辑区域（具有第一逻辑门）和第二逻辑区域（具有第二逻辑门）的半导体衬底上形成存储器件的方法。 第一注入形成与存储区域中的浮置栅极相邻的源极区域，以及与第一逻辑区域中的第一逻辑门极相邻的源区域和漏极区域。 第二注入形成与第二逻辑区域中的第二逻辑门相邻的源区和漏区。 第三注入形成与存储器区域中的控制栅极相邻的漏极区域，并且增强第一逻辑区域中的存储区域和源极/漏极区域中的源极区域。 第四次注入增强了第二逻辑区域中的源极/漏极区域。