公开(公告)号：US20130271240A1

公开(公告)日：2013-10-17

申请号：US13570267

申请日：2012-08-09

Applicant: Chen-Chung Liu ,  Ian-Chun Cheng

Inventor： Chen-Chung Liu ,  Ian-Chun Cheng

IPC: H03H7/01 ,  H05K13/00 ,  H05K1/16

CPC classification number: H01F17/0013 ,  H01F19/04 ,  H01F2017/002 ,  Y10T29/49117

Abstract: The invention discloses a high-frequency device having a through-hole via inductor in a substrate. The through-hole via inductor has an integral body. The inductance of the through-hole via inductor is greater than that of the horizontal inductor. The through-hole via inductor comprises at least two materials, wherein one of said at least two materials is a conductive material. The present invention also discloses a method for manufacturing the structure of the high-frequency device, wherein the method mainly includes via-drilling and via-filling in the substrate, and lithography process on the substrate.

Abstract translation: 本发明公开了一种在衬底中具有通孔通孔电感器的高频器件。 通孔通孔电感器具有整体。 通孔电感的电感大于水平电感的电感。 所述通孔通孔电感器包括至少两种材料，其中所述至少两种材料之一是导电材料。 本发明还公开了一种用于制造高频器件结构的方法，其中该方法主要包括衬底中的通孔钻孔和通孔填充以及衬底上的光刻工艺。

公开(公告)号：US20130250470A1

公开(公告)日：2013-09-26

申请号：US13894160

申请日：2013-05-14

Applicant: CYNTEC CO., LTD.

Inventor： Chung-Hsiung WANG ,  Hung-Ming LIN ,  Lang-Yi CHIANG ,  Wen-Shiang LUO ,  Kuo-Shu CHEN

IPC: H02H5/00

CPC classification number: H02H5/00 ,  H01H69/022 ,  H01H85/0047 ,  H01H85/0065 ,  H01H85/0411 ,  H01H85/046 ,  H01H85/048 ,  H01H85/11 ,  H01H2085/466

Abstract: A protective device including a substrate, a conductive section and a first auxiliary medium is provided. The conductive section is supported by the substrate, wherein the conductive section comprises a metal element electrically connected between first and second electrodes. The metal element serves as a sacrificial structure having a melting point lower than that of the first and second electrodes. The first auxiliary medium is disposed between the metal element and the substrate, wherein the first auxiliary medium has a melting point lower than that of the metal element. The first auxiliary medium facilitates breaking of the metal element upon melting.

Abstract translation: 提供了包括基板，导电部分和第一辅助介质的保护装置。 导电部分由衬底支撑，其中导电部分包括电连接在第一和第二电极之间的金属元件。 金属元件用作熔点低于第一和第二电极的熔点的牺牲结构。 第一辅助介质设置在金属元件和基板之间，其中第一辅助介质的熔点低于金属元件的熔点。 第一辅助介质有助于熔化时金属元件的断裂。

公开(公告)号：US20130093069A1

公开(公告)日：2013-04-18

申请号：US13273247

申请日：2011-10-14

Applicant: BAU-RU LU ,  JENG-JEN LI ,  CHIANG KAIPENG

Inventor： BAU-RU LU ,  JENG-JEN LI ,  CHIANG KAIPENG

IPC: H01L23/495 ,  H01L21/768

CPC classification number: H01L23/49861 ,  H01L23/13 ,  H01L23/49524 ,  H01L23/49833 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L25/16 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/83192 ,  H01L2224/83411 ,  H01L2224/83439 ,  H01L2224/83447 ,  H01L2224/83851 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention discloses a package structure made of the combination of a metallic substrate and a lead frame. In one embodiment, a recess is formed in the metallic substrate and a first conductive element having at least one first I/O terminal is bonded in the recess. A lead frame is formed on the metallic substrate and comprises a plurality of electrical connections to connect with said at least one first I/O terminal of the first conductive element. In another embodiment, another conductive element is disposed in the vacancy of the lead frame. The invention also discloses a method for manufacturing a package structure made of the combination of a metallic substrate and a lead frame.

Abstract translation: 本发明公开了一种由金属基底和引线框组合而成的封装结构。 在一个实施例中，在金属基板中形成凹部，并且具有至少一个第一I / O端子的第一导电元件接合在凹部中。 引线框架形成在金属基板上并且包括多个电连接以与第一导电元件的所述至少一个第一I / O端子连接。 在另一个实施例中，另一导电元件设置在引线框架的空位中。 本发明还公开了一种用于制造由金属基底和引线框的组合制成的封装结构的方法。

公开(公告)号：US20130001756A1

公开(公告)日：2013-01-03

申请号：US13612852

申请日：2012-09-13

Applicant: Da-Jung Chen ,  Chun-Tiao Liu ,  Chau-Chun Wen

Inventor： Da-Jung Chen ,  Chun-Tiao Liu ,  Chau-Chun Wen

IPC: H01L23/495

CPC classification number: H01L25/162 ,  H01L23/04 ,  H01L23/495 ,  H01L23/49517 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49811 ,  H01L23/49861 ,  H01L23/552 ,  H01L23/645 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present invention discloses a three-dimensional package structure. The first conductive element comprises a top surface, a bottom surface and a lateral surface. The conductive pattern disposed on the top surface of the first conductive element. A second conductive element is disposed on the conductive pattern. The first conductive element is electrically connected to the conductive pattern, and the second conductive element is electrically connected to the conductive pattern. In one embodiment, the shielding layer is a portion of the patterned conductive layer.

Abstract translation: 本发明公开了一种三维封装结构。 第一导电元件包括​​顶表面，底表面和侧表面。 布置在第一导电元件的顶表面上的导电图案。 第二导电元件设置在导电图案上。 第一导电元件电连接到导电图案，并且第二导电元件电连接到导电图案。 在一个实施例中，屏蔽层是图案化导电层的一部分。

公开(公告)号：US08338933B2

公开(公告)日：2012-12-25

申请号：US13188774

申请日：2011-07-22

Applicant: Da-Jung Chen ,  Chun-Tiao Liu ,  Chau-Chun Wen

Inventor： Da-Jung Chen ,  Chun-Tiao Liu ,  Chau-Chun Wen

IPC: H01L23/02

CPC classification number: H01L23/495 ,  H01L23/49555 ,  H01L23/49575 ,  H01L23/552 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A three-dimensional package structure includes an energy storage element, a semiconductor package body and a shielding layer. The semiconductor package body has a plurality of second conductive elements and at least one control device inside. The energy storage element is disposed on the semiconductor package body. The energy storage element including a magnetic body is electrically connected to the second conductive elements. The semiconductor package body or the energy storage element has a plurality of first conductive elements to be electrically connected to an outside device. The shielding layer is disposed between the control component and at least part of the magnetic body to inhibit or reduce EMI (Electro-Magnetic Interference) from the energy storage element and to get a tiny package structure. The three-dimensional package structure is applicable to a POL (Point of Load) converter.

Abstract translation: 三维封装结构包括能量存储元件，半导体封装体和屏蔽层。 半导体封装主体具有多个第二导电元件和至少一个控制装置。 储能元件设置在半导体封装主体上。 包括磁性体的能量存储元件电连接到第二导电元件。 半导体封装体或能量存储元件具有多个第一导电元件以与外部器件电连接。 屏蔽层设置在控制部件和磁体的至少一部分之间以抑制或减少来自能量存储元件的EMI（电磁干扰）并获得微小的封装结构。 三维封装结构适用于POL（负载点）转换器。

公开(公告)号：US08310334B2

公开(公告)日：2012-11-13

申请号：US12773152

申请日：2010-05-04

Applicant: Ching-Feng Chen ,  Kun-Hong Shih ,  Yen-Ting Lin ,  Yin-Tien Yeh

Inventor： Ching-Feng Chen ,  Kun-Hong Shih ,  Yen-Ting Lin ,  Yin-Tien Yeh

IPC: H01C1/034

CPC classification number: H01C17/006 ,  H01C7/003 ,  H01C7/13 ,  H01C17/02 ,  H01C17/065

Abstract: A surface mount resistor includes a resistance body, a first protective layer, a heat-transfer layer, a second protective layer and two electrode layers. The resistance body has a first end portion, a second end portion and a central portion between the first end portion and the second end portion. The first protective layer is disposed on the central portion of the resistance body, and the first end portion and the second end portion are exposed. The heat-transfer layer is plated on at least part of the resistance body. The second protective layer is disposed on at least part of the heat-transfer layer. The electrode layers are respectively arranged on the first end portion and the second end portion, and electrically connected with the heat-transfer layer.

Abstract translation: 表面贴装电阻器包括电阻体，第一保护层，传热层，第二保护层和两个电极层。 电阻体具有在第一端部和第二端部之间的第一端部，第二端部和中心部。 第一保护层设置在电阻体的中心部分，第一端部和第二端部露出。 传热层被电镀在电阻体的至少一部分上。 第二保护层设置在传热层的至少一部分上。 电极层分别设置在第一端部和第二端部上，与传热层电连接。

公开(公告)号：US20120262145A1

公开(公告)日：2012-10-18

申请号：US13481887

申请日：2012-05-28

Applicant: Da-Jung Chen ,  Chun-Tiao Liu

Inventor： Da-Jung Chen ,  Chun-Tiao Liu

IPC: G05F3/02 ,  H01F41/00

CPC classification number: H05K1/181 ,  H01F27/027 ,  H01L23/645 ,  H01L25/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K3/3421 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10924 ,  Y02P70/611 ,  Y10T29/4902 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A power-supply module includes at least one power-supply component, an inductor and a package. The inductor is disposed over the at least one power-supply components, and the at least a power-supply component and the inductor are disposed within the package. Besides, the power-supply module further comprises a printed circuit board, and the at least one power-supply component and the inductor are mounted to the printed circuit board. Moreover, the inductor comprises a plurality of leads that support the inductor over the at least one power-supply component.

Abstract translation: 电源模块包括至少一个电源组件，电感器和封装。 电感器设置在至少一个电源部件上，并且至少一个电源部件和电感器设置在封装内。 此外，电源模块还包括印刷电路板，并且至少一个电源部件和电感器安装到印刷电路板。 此外，电感器包括多个引线，其在至少一个电源部件上支撑电感器。

公开(公告)号：US20120098620A1

公开(公告)日：2012-04-26

申请号：US13251283

申请日：2011-10-02

Applicant: Shih-Hsien Tseng

Inventor： Shih-Hsien Tseng

IPC: H03H7/01

CPC classification number: H03H7/0115 ,  H03H7/09 ,  H03H7/1708 ,  H03H7/1725 ,  H03H7/1758 ,  H03H7/1775 ,  H03H7/38 ,  H03H7/463 ,  H03H2001/0085

Abstract: A filter and a layout structure of the filter are provided. The filter includes a substrate, three capacitors, and three inductors. The three capacitors and the first and second inductors are disposed on a top surface of the substrate. The third inductor is disposed on a lateral surface of the substrate. First electrodes of the first and third capacitors and a first terminal of the first inductor are connected to a first I/O terminal of the filter. A first electrode of the second capacitor, a second electrode of the third capacitor and a first terminal of the second inductor are connected to a second I/O terminal of the filter. A first terminal of the third inductor is connected to second electrodes of the first and second capacitors.

Abstract translation: 提供过滤器和过滤器的布局结构。 滤波器包括衬底，三个电容器和三个电感器。 三个电容器和第一和第二电感器设置在基板的顶表面上。 第三电感器设置在基板的侧表面上。 第一和第三电容器的第一电极和第一电感器的第一端子连接到滤波器的第一I / O端子。 第二电容器的第一电极，第三电容器的第二电极和第二电感器的第一端子连接到滤波器的第二I / O端子。 第三电感器的第一端子连接到第一和第二电容器的第二电极。

公开(公告)号：US20110199746A1

公开(公告)日：2011-08-18

申请号：US12705389

申请日：2010-02-12

Applicant: Han-Hsiang LEE ,  Kun-Hong SHIH ,  Jeng-Jen LI

Inventor： Han-Hsiang LEE ,  Kun-Hong SHIH ,  Jeng-Jen LI

IPC: H05K7/00

CPC classification number: H05K7/1432 ,  H01L23/13 ,  H01L23/49531 ,  H01L23/49541 ,  H01L2224/49175 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H02M3/00 ,  H05K1/021 ,  H05K3/0061 ,  H05K2201/10924 ,  H05K2203/1327 ,  H01L2924/00

Abstract: A composite substrate made of a circuit board mounted on a lead frame is used for an electronic system package. High heat generated electronic components are adapted to mount on the lead frame and relatively low heat generated electronic components are adapted to mount on the circuit board. Metal lines are used for electrical coupling between the circuitry of the IC chip and the circuit board. An electronic system with the composite substrate gains both advantages—good circuitry arrangement capability from the circuit board and good heat distribution from the lead frame.

Abstract translation: 将由安装在引线框架上的电路板制成的复合基板用于电子系统封装。 高热产生的电子部件适于安装在引线框架上，相对低的发热电子部件适于安装在电路板上。 金属线用于IC芯片的电路和电路板之间的电耦合。 具有复合基板的电子系统具有两个优点 - 电路板具有良好的电路布置能力和来自引线框架的良好热分布。

公开(公告)号：US07915993B2

公开(公告)日：2011-03-29

申请号：US12683448

申请日：2010-01-07

Applicant: Chun-Tiao Liu ,  Gwo-Tswin Wu ,  Roger Hsieh ,  Wen-Hsiung Liao

Inventor： Chun-Tiao Liu ,  Gwo-Tswin Wu ,  Roger Hsieh ,  Wen-Hsiung Liao

IPC: H01F5/00

CPC classification number: H01F17/04 ,  H01F27/027 ,  H01F27/255 ,  H01F27/2828 ,  H01F27/292 ,  H01F2017/046 ,  H01F2017/048

Abstract: An inductor includes a first core, a second core, a protruding structure, at least two gaps and a conducting wire. The first core has a protruding portion. The second core is disposed opposite to the first core. The protruding structure protrudes from the protruding portion of the first core and toward the second core. The at least two gaps are between the protruding portion of the first core and the second core. The conducting wire winds around at least one of the first and second cores. The conducting wire has a specific resistance value of 1.42 μΩm or lower.

Abstract translation: 电感器包括第一芯，第二芯，突出结构，至少两个间隙和导线。 第一芯具有突出部分。 第二芯与第一芯相对设置。 突出结构从第一芯的突出部分朝向第二芯突出。 所述至少两个间隙位于所述第一芯和所述第二芯的突出部分之间。 导线缠绕在第一和第二芯中的至少一个上。 导线的电阻值为1.42μ＆OHgr，m以下。