公开(公告)号：US20160342244A1

公开(公告)日：2016-11-24

申请号：US15230542

申请日：2016-08-08

Applicant: FUJIFILM Corporation

Inventor： Tadashi KURIKI

IPC: G06F3/044

CPC classification number: G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/0298 ,  H05K2201/09245

Abstract: Disclosed are a conductive sheet, a usage method of the conductive sheet and a capacitive type touch panel. For a first conductive sheet, two or more conductive first large grids are formed atop a first transparent base, wherein each first large grid is constituted by combining two or more small grids, and the shapes of facing sides of each first large grid are formed to alternate. For example, rectangular waveshapes of a first side portion of the first large grid and of a fourth side portion facing the first side portion are made to alternate, and rectangular waveshapes of a second side portion of the first large grid and of a third side portion facing the second side portion are made to alternate.

Abstract translation: 公开了导电片，导电片和电容式触摸面板的使用方法。 对于第一导电片，在第一透明基底顶部形成有两个或多个导电的第一大栅格，其中每个第一大栅格通过组合两个或更多个小栅格构成，并且每个第一大栅格的相对侧的形状形成为 备用。 例如，使第一大格栅的第一侧部分和面向第一侧部分的第四侧部分的矩形波形彼此交替，并且第一大格栅的第二侧部分和第三侧部分的矩形波形 面对第二侧部分是交替的。

公开(公告)号：US20160336700A1

公开(公告)日：2016-11-17

申请号：US15220789

申请日：2016-07-27

Applicant: Panduit Corp.

Inventor： Jack E. Caveney ,  Masud Bolouri-Saransar ,  Scott M. Lesniak

IPC: H01R24/64 ,  H01R12/77 ,  H01R13/6467 ,  H05K1/02 ,  H01R12/59 ,  H01R12/67 ,  H01R13/502 ,  H01R13/6466 ,  H01R4/24

CPC classification number: H01R24/64 ,  H01R4/2429 ,  H01R4/2433 ,  H01R12/592 ,  H01R12/62 ,  H01R12/675 ,  H01R12/775 ,  H01R13/46 ,  H01R13/502 ,  H01R13/6461 ,  H01R13/6466 ,  H01R13/6467 ,  H01R13/6658 ,  H01R13/719 ,  H01R24/62 ,  H01R2107/00 ,  H01R2201/04 ,  H05K1/0228 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/09245 ,  H05K2201/10189 ,  Y10S439/941 ,  Y10T29/49121 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49174 ,  Y10T29/49222

Abstract: An apparatus and method for crosstalk compensation in a jack of a modular communications connector includes a flexible printed circuit board connected to jack contacts and to connections to a network cable. The flexible printed circuit board includes conductive traces arranged as one or more couplings to provide crosstalk compensation.

公开(公告)号：US09454982B2

公开(公告)日：2016-09-27

申请号：US13660477

申请日：2012-10-25

Applicant: NHK SPRING CO., LTD.

Inventor： Hajime Arai

IPC: H05K1/02 ,  H05K1/05 ,  H05K1/18 ,  G11B5/48

CPC classification number: G11B5/4846 ,  G11B5/1272 ,  G11B5/4826 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0245 ,  H05K1/0277 ,  H05K1/0298 ,  H05K1/056 ,  H05K1/18 ,  H05K1/189 ,  H05K3/0011 ,  H05K3/18 ,  H05K2201/05 ,  H05K2201/09245 ,  H05K2201/097 ,  H05K2201/2009 ,  Y10T29/49194

Abstract: A wiring structure of a head suspension including a flexure that supports a head and is attached to a load beam applying load onto the head, comprises write wiring and read wiring formed on the flexure and connected to the head, each having wires of opposite polarities. The wiring structure further comprises a stacked interleaved part includes segments electrically connected to the respective wires of the write wiring, the segments stacked on and facing the wires through an electrical insulating layer so that the facing wire and segment have opposite polarities.

Abstract translation: 包括支撑头部并附接到负载束施加负载到头上的弯曲部的头部悬架的布线结构包括形成在挠曲件上并连接到头部上的写入布线和读取布线，每个布线具有相反极性的导线。 所述布线结构还包括层叠的交错部分，其包括电连接到所述写入布线的相应导线的部分，所述片段通过电绝缘层堆叠在并面对所述线，使得所述相对的线和片段具有相反的极性。

公开(公告)号：US09408305B2

公开(公告)日：2016-08-02

申请号：US14947558

申请日：2015-11-20

Applicant: MC10, Inc.

Inventor： Yung-Yu Hsu

IPC: H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K1/03 ,  H05K1/16 ,  H01R9/00 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/185 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/118 ,  H05K1/147 ,  H05K1/148 ,  H05K1/189 ,  H05K3/4691 ,  H05K3/4694 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/09245 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/2009

Abstract: Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.

公开(公告)号：US20160147336A1

公开(公告)日：2016-05-26

申请号：US14814730

申请日：2015-07-31

Applicant: LG INNOTEK CO., LTD.

Inventor： Jung Hyuck HAN ,  Yu Lim CHOE ,  Chan Kyu KOO ,  Jun Sik SHIN ,  Joon Hyuk YANG ,  Seung Jin LEE ,  Yu Hong JEON

IPC: G06F3/044 ,  H05K3/28 ,  H05K1/02

CPC classification number: G06F3/044 ,  G06F2203/04112 ,  H05K1/0296 ,  H05K3/28 ,  H05K2201/09245 ,  H05K2201/09272

Abstract: A touch window includes a substrate; and an electrode on the substrate, wherein the electrode includes a first mesh line extending in a first direction and having a first width; a second mesh line extending in a direction different from the first direction and having a second width; and an cross area in which the first and second mesh lines cross each other, the cross area having a third width, wherein the third width is larger than the first width, and the third width is equal to or less than 10 times of the first width.

Abstract translation: 触摸窗包括基板; 以及所述基板上的电极，其中所述电极包括沿第一方向延伸并具有第一宽度的第一网眼线; 第二网线，沿与第一方向不同的方向延伸并具有第二宽度; 以及第一和第二网眼线彼此交叉的交叉区域，所述横截面具有第三宽度，其中所述第三宽度大于所述第一宽度，并且所述第三宽度等于或小于所述第一宽度的10倍 宽度。

公开(公告)号：US09253890B2

公开(公告)日：2016-02-02

申请号：US14080810

申请日：2013-11-15

Applicant: Industrial Technology Research Institute

Inventor： Yu-Pei Chang ,  Ming-Huan Yang ,  Chun-Yi Chiu

IPC: B32B3/02 ,  H05K3/02 ,  G06F3/044 ,  H05K3/20 ,  H05K1/09 ,  B82Y40/00 ,  H05K3/46

CPC classification number: H05K3/02 ,  B82Y40/00 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/097 ,  H05K3/20 ,  H05K3/4685 ,  H05K2201/0108 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/09245 ,  H05K2203/1105 ,  H05K2203/1142 ,  Y10S977/932 ,  Y10T428/24802

Abstract: Provided is a patterned conductive film may include a conductive interconnected nano-structure film. The conductive interconnected nano-structure film may include a first region and a second region adjacent to the first region. A conductivity of the first region may be at least 1000 times a conductivity of the second region.

Abstract translation: 提供了图案化的导电膜可以包括导电互连的纳米结构膜。 导电互连的纳米结构膜可以包括与第一区域相邻的第一区域和第二区域。 第一区域的电导率可以是第二区域的电导率的至少1000倍。

公开(公告)号：US20150236393A1

公开(公告)日：2015-08-20

申请号：US14701171

申请日：2015-04-30

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Tetsuo SAJI ,  Hiroshi NAKAMURA

IPC: H01P3/08 ,  H01P3/00

CPC classification number: H01P3/08 ,  H01P3/003 ,  H05K1/025 ,  H05K1/0253 ,  H05K1/0298 ,  H05K2201/09245

Abstract: A multilayer circuit substrate includes: a first signal line and a first ground conductor formed in a first conductive layer; and a second signal line and a second ground conductor formed in a second conductive layer, the second conductive layer facing the first conductive layer across an insulating layer. The first signal line intersects with the second signal line in a plan view of the multilayer circuit substrate, a space between the first ground conductor and first signal line is smaller in an intersection area of the first and second signal lines than a space in a non-intersection area, a space between the second ground conductor and second signal line is smaller in the intersection area than a space in the non-intersection area, and the first signal line is formed at a smaller line width in the intersection area than in the non-intersection area.

Abstract translation: 多层电路基板包括：第一信号线和形成在第一导电层中的第一接地导体; 以及形成在第二导电层中的第二信号线和第二接地导体，所述第二导电层跨过绝缘层面向所述第一导电层。 第一信号线在多层电路基板的俯视图中与第二信号线相交，在第一和第二信号线的交叉区域中，第一接地导体与第一信号线之间的间隔比非非空 在第二接地导体和第二信号线之间的空间在交叉区域中比非交叉区域中的空间小，并且第一信号线形成在交叉区域中比在 非交叉区域。

公开(公告)号：US20150015345A1

公开(公告)日：2015-01-15

申请号：US14503612

申请日：2014-10-01

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Satoshi SASAKI ,  Nobuo IKEMOTO ,  Shigeru TAGO

IPC: H01P3/00

CPC classification number: H01P3/003 ,  H01P3/08 ,  H01P3/085 ,  H05K1/0225 ,  H05K1/0253 ,  H05K1/0284 ,  H05K1/0393 ,  H05K1/147 ,  H05K2201/09245 ,  H05K2201/09281 ,  H05K2201/09727

Abstract: A dielectric element assembly includes a plurality of dielectric layers stacked on each other in a direction of lamination and extends in an x-axis direction. A signal line is provided in the dielectric element assembly and extends in the x-axis direction. A reference ground conductor is provided on a positive side in a z-axis direction relative to the signal line. An auxiliary ground conductor is provided on a negative side in the z-axis direction relative to the signal line. Via-hole conductors connect the reference ground conductor and the auxiliary ground conductor and are provided in the dielectric element assembly on the negative side relative to the center in a y-axis direction. A portion of the signal line in a section which includes the via-hole conductors is positioned on the positive side in the y-axis direction relative to another portion of the signal line in a section which does not include the via-hole conductors.

Abstract translation: 电介质元件组件包括在层叠方向上彼此堆叠并沿x轴方向延伸的多个电介质层。 信号线设置在电介质元件组件中并沿x轴方向延伸。 参考接地导体相对于信号线在z轴方向的正侧设置。 辅助接地导体相对于信号线设置在z轴方向的负侧。 通孔导体连接参考接地导体和辅助接地导体，并且在y轴方向相对于中心的负侧设置介质元件组件。 包括通孔导体的部分中的信号线的一部分在不包括通孔导体的部分中位于相对于信号线的另一部分的y轴方向的正侧。

公开(公告)号：US20150002763A1

公开(公告)日：2015-01-01

申请号：US14486396

申请日：2014-09-15

Applicant: WINTEK CORPORATION

Inventor： MING-KUNG WU ,  KUO-CHANG SU ,  CHIA-CHI CHEN ,  YU-TING LIN

IPC: H03K17/96 ,  G06F1/16 ,  H01H11/00 ,  G06F3/047

CPC classification number: H03K17/9618 ,  G02B1/11 ,  G06F1/1643 ,  G06F1/1692 ,  G06F3/041 ,  G06F3/0412 ,  G06F3/044 ,  G06F3/047 ,  H01H11/00 ,  H03K2017/9602 ,  H05K1/0296 ,  H05K1/0306 ,  H05K2201/0326 ,  H05K2201/09245 ,  H05K2201/10128 ,  H05K2201/10151 ,  Y10T29/49105

Abstract: A touch-sensitive device includes a transparent substrate, a touch-sensing structure, a decorative layer, a trace layer, a passivation layer and a sheltering layer. The touch-sensing structure is disposed on the transparent substrate and located in a touch-sensitive region. The decorative layer is disposed on the transparent substrate and located in a non-touch-sensitive region, and the trace layer is disposed on the decorative layer. The passivation layer is disposed on the transparent substrate and at least covers the touch-sensing structure and the trace layer. The sheltering layer is disposed at least on the passivation layer and located in the non-touch-sensitive region.

Abstract translation: 触敏装置包括透明基板，触摸感测结构，装饰层，迹线层，钝化层和遮蔽层。 触摸感测结构设置在透明基板上并且位于触敏区域中。 装饰层设置在透明基板上并且位于非触敏区域中，并且迹线层设置在装饰层上。 钝化层设置在透明基板上，并且至少覆盖触摸感测结构和迹线层。 防护层至少设置在钝化层上并且位于非接触敏感区域中。

公开(公告)号：US20140332256A1

公开(公告)日：2014-11-13

申请号：US13891434

申请日：2013-05-10

Applicant: RONALD STEVEN COK ,  John Andrew Lebens

Inventor： RONALD STEVEN COK ,  John Andrew Lebens

IPC: H05K1/02

CPC classification number: H05K1/0274 ,  G06F3/044 ,  G06F2203/04112 ,  H05K2201/0302 ,  H05K2201/09245 ,  H05K2201/09681

Abstract: A micro-wire electrode structure having non-linear gaps includes a substrate and a plurality of intersecting micro-wires formed over, on, or in the substrate. The plurality of intersecting micro-wires includes first micro-wires extending in a first direction and second micro-wires extending in a second direction different from the first direction. The second micro-wires intersect the first micro-wires. The plurality of intersecting micro-wires forms an array of electrically isolated electrodes, each electrode including both first and second micro-wires. Each electrode is separated from an adjacent electrode in the array of electrodes by micro-wire gaps in at least some of the micro-wires, the micro-wire gaps located in a non-linear arrangement.

Abstract translation: 具有非线性间隙的微线电极结构包括衬底和在衬底上，上或之上形成的多个相交的微细线。 多个相交的微细线包括沿第一方向延伸的第一微细线和沿与第一方向不同的第二方向延伸的第二微细线。 第二条微细线与第一条微细线相交。 多个相交的微细线形成电隔离电极的阵列，每个电极包括第一和第二微细线。 每个电极通过在至少一些微线中的微线间隙与电极阵列中的相邻电极分开，微线间隙位于非线性排列。