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公开(公告)号:US09869456B2
公开(公告)日:2018-01-16
申请号:US14075081
申请日:2013-11-08
Applicant: Richard Speer , David Hamby , Ken Grossman
Inventor: Richard Speer , David Hamby , Ken Grossman
IPC: F21S4/00 , F21V15/01 , H05K1/18 , F21K9/90 , F21Y101/00 , F21Y115/10 , F21Y107/50
CPC classification number: F21V15/012 , F21K9/90 , F21Y2101/00 , F21Y2107/50 , F21Y2115/10 , H05K1/189 , H05K2201/056 , H05K2201/10106 , Y10T29/49124
Abstract: Techniques are disclosed for designing light fixtures for flexible LED circuit boards. The flexible LED circuit boards include an array of LED packages and the surface of the flexible circuit boards is highly reflective. A flexible LED circuit board may be shaped to conform to a rigid preform and the preform may be concave, convex, corrugated, or have any other custom shape. The shape of the preform, as well as the location of the LEDs within the flexible LED circuit may determine the light distribution of the light fixture. Alternatively, the lighting fixture may have multiple rods held in place with side plates and a flexible LED circuit board may be woven between the rods. A set of hole patterns in the side plates determine the location of the rods and the rods will determine the shape of the flexible LED circuit.
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公开(公告)号:US20180014417A1
公开(公告)日:2018-01-11
申请号:US15642803
申请日:2017-07-06
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor: Tae An SEO , Min-Sung KIM , Jung Hun LEE , Jin Hwan CHOI
CPC classification number: H05K5/0017 , G02F1/13 , G09F9/301 , H05K1/0203 , H05K1/0209 , H05K1/0281 , H05K1/144 , H05K1/147 , H05K1/181 , H05K1/189 , H05K5/0217 , H05K7/20954 , H05K2201/041 , H05K2201/056 , H05K2201/10128
Abstract: A rollable display device includes: a rollable display including a first end and a second end spaced apart from the first end; a first slider including a roller that supports the first end of the rollable display, the first slider being configured to roll the rollable display about the roller; and a second slider including a support that supports the second end of the rollable display while bending the second end of the rollable display, the second slider being slideable relative to the first slider.
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283.
公开(公告)号:US20180007798A1
公开(公告)日:2018-01-04
申请号:US15542999
申请日:2016-01-07
Applicant: Sharp Kabushiki Kaisha
Inventor: KATSUHIRO YAMAGUCHI , NOBUHIRO NAKATA , YUKINORI MASUDA , TOMOKI TAKAHARA
IPC: H05K3/36 , H05K1/14 , G02F1/1345
CPC classification number: H05K3/361 , G02F1/1303 , G02F1/13452 , H01L2224/73204 , H05K1/144 , H05K3/323 , H05K2201/041 , H05K2201/056 , H05K2201/10136
Abstract: A mounting substrate manufacturing apparatus includes a first FPC-side pressing member 51 configured to press and heat a first mounting component group 31 including one edge side mounting component that is a flexible printed circuit board 13 arranged on one edge in an arrangement direction in which flexible printed circuit boards 13 arranged on an array substrate 11B and thermally press and bond the first mounting component group 31 on the array substrate 11B, and a second FPC-side pressing member 52 arranged next to the first FPC-side pressing member 51 in the arrangement direction and configured to press and heat a second mounting component group 32 including all the flexible printed circuit boards 13 except for the first mounting component group 31 and thermally press and bond the second mounting component group 32 on the array substrate 11B.
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公开(公告)号:US20170271614A1
公开(公告)日:2017-09-21
申请号:US15612345
申请日:2017-06-02
Applicant: LG ELECTRONICS INC.
Inventor: Moungyoub LEE , Sangdon PARK , Choongsuk PARK , lnkeun RYU , Hyukjin NAM , Seunghyun YUN , Jaehyun SUNG , Jaegi LEE
IPC: H01L51/52 , G02F1/133 , G02F1/1335 , G06F1/16 , G06F1/20 , G09F13/04 , G09F9/30 , G09F9/33 , G09F9/35 , H04N5/64 , H05K1/02 , H05K5/00 , H05K5/02 , H05K5/03 , G02F1/1333
CPC classification number: H01L51/5237 , G02F1/133 , G02F1/133308 , G02F1/133608 , G02F2001/133314 , G02F2001/133317 , G06F1/1601 , G06F1/20 , G06F2200/1612 , G09F9/301 , G09F9/33 , G09F9/35 , G09F13/04 , H04N5/64 , H05K1/0281 , H05K5/0017 , H05K5/0217 , H05K5/03 , H05K2201/056 , H05K2201/10128
Abstract: Provided is a display apparatus. The display apparatus includes a display panel, a back cover disposed on a rear side of the display panel, the back cover having a curved shape of which both ends protrude forward, and a fixing part fixing the back cover to maintain the curved shape of the back cover. The display panel is curved in a shape corresponding to that of the back cover.
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公开(公告)号:US20170257938A1
公开(公告)日:2017-09-07
申请号:US15446727
申请日:2017-03-01
Applicant: LENOVO (SINGAPORE) PTE. LTD.
Inventor: HIROHIDE KOMIYAMA , HIDESHI TSUKAMOTO , YASUSHI YOSHIKAWA , MITSURU OGAWA
IPC: H05K1/02
CPC classification number: H05K1/028 , H05K1/0277 , H05K1/0281 , H05K1/0283 , H05K1/117 , H05K1/118 , H05K1/147 , H05K2201/052 , H05K2201/053 , H05K2201/055 , H05K2201/056 , H05K2201/09081 , H05K2201/09245 , H05K2201/09254 , H05K2201/09418
Abstract: A flexible printed circuit board (FPCB) is disclosed. The FPCB can be employed to connect an interface card having connectors with a two-stage configuration to a connection destination of a portable information equipment. The FPCB includes a bend line located between an upper-stage terminal group and a lower-stage terminal group. The FPCB can be bent along the bend line to allow the upper-stage terminal group and the lower-stage terminal group to be mutually superimposed over each other. In addition, the upper-stage terminal group of the FPCB is connected to the upper-stage-side connector terminal group of the interface card, and the lower-stage terminal group of the FPCB is connected to the lower-stage-side connector terminal group of the interface card.
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公开(公告)号:US20170238414A1
公开(公告)日:2017-08-17
申请号:US15433933
申请日:2017-02-15
Inventor: Hideki Ogawa , Sasaki Kazuyoshi
CPC classification number: H05K1/0281 , G06F1/1658 , H05K1/0215 , H05K1/189 , H05K2201/05 , H05K2201/056
Abstract: According to one embodiment, FPC has a flexible board body, a reinforcing plate, an opening portion, and a bent structure. The opening portion is formed to penetrate through the board body. The bent structure is bent to pass through the inside of the opening portion.
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公开(公告)号:US09717141B1
公开(公告)日:2017-07-25
申请号:US14108724
申请日:2013-12-17
Inventor: Troy T. Tegg
CPC classification number: H05K1/0268 , A61B8/12 , A61B8/445 , H05K1/118 , H05K2201/056 , H05K2201/09272 , H05K2201/09709 , H05K2201/10189
Abstract: A flexible printed circuit which includes a flexible substrate, a plurality of conductive pads, and a plurality of conductive traces that conductively connect to at least two conductive pads. The plurality of conductive pads and traces are defined on the flexible substrate. The flexible substrate has a first portion and a second portion. The first portion has at least two sets of conductive pads. The second portion has at least one set of conductive pads and is configured to conductively connect to a testing device. After the flexible printed circuit is tested, the second portion of the flexible substrate is detached from the first portion of the flexible substrate.
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公开(公告)号:US09709259B2
公开(公告)日:2017-07-18
申请号:US14646534
申请日:2013-09-18
Applicant: PHILIPS LIGHTING HOLDING B.V.
Inventor: Reinier Imre Anton Den Boer , Peter Johannes Martinus Bukkems , Johannes Petrus Maria Ansems
IPC: F21V29/00 , F21V29/70 , F21K9/90 , F21V29/507 , F21V29/503 , F21K9/23 , F21V14/02 , F21V19/00 , F21V23/00 , F21V29/506 , F21V3/02 , H05K1/18 , F21Y101/00 , F21Y115/10 , F21Y107/40
CPC classification number: F21V29/70 , F21K9/23 , F21K9/238 , F21K9/90 , F21V3/02 , F21V14/02 , F21V19/004 , F21V23/005 , F21V29/004 , F21V29/20 , F21V29/503 , F21V29/506 , F21V29/507 , F21Y2101/00 , F21Y2107/40 , F21Y2115/10 , H05K1/189 , H05K2201/056 , H05K2201/10106
Abstract: The present invention relates to a lighting device (100) (100), comprising at least one light emitting element (102) configured to emit light, a housing (300) having an elongated hollow base portion (302) and a light exit portion (304), wherein the elongated hollow base portion (302) has a polygonal cross section, and a heat transferring arrangement (200) formed from a folded sheet of a thermo conducting material inserted into and fixed inside of the housing (300), the heat transferring arrangement (200) comprising a first section (202) onto which the light emitting element (102) is arranged and adapted to receive heat generated from the at least one light emitting element (102) when emitting light, and a second section (204) having an outer surface which once fixed inside of the housing (300) is formed to be in abutment with an inner surface of the elongated hollow base portion (302) of the housing (300), so that the generated heat is thermally transferred to the housing (300). The present invention also relates to a corresponding method for forming a lighting device (100).
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公开(公告)号:US20170201660A1
公开(公告)日:2017-07-13
申请号:US15077829
申请日:2016-03-22
Applicant: Primax Electronics Ltd.
Inventor: CHIN-DING LAI , TA-SHENG YU , HAN-KAI WANG
CPC classification number: H04N5/2257 , H04N5/2252 , H04N5/2253 , H04N5/2254 , H04N5/23241 , H05K1/117 , H05K1/141 , H05K1/144 , H05K3/363 , H05K3/368 , H05K2201/041 , H05K2201/049 , H05K2201/056 , H05K2201/10121
Abstract: A camera module includes a lens assembly, a power device with a first circuit board, a second circuit board and a welding element. The first circuit board is partially bent, and thus an electrical contact of the first circuit board is exposed to a lateral side of the power device. The second circuit board includes a conductive hole corresponding to the electrical contact. The conductive hole is exposed to a lateral side of the second circuit board. The welding element is installed on the lateral side of the power device and the lateral side of the second circuit board. The welding element is contacted with the electrical contact and the conductive hole, so that the first circuit board and the second circuit board are electrically connected with each other.
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公开(公告)号:US09704644B2
公开(公告)日:2017-07-11
申请号:US14531079
申请日:2014-11-03
Applicant: James Jen-Ho Wang
Inventor: James Jen-Ho Wang
IPC: H05B37/00 , H05B39/00 , H05B41/00 , H01F41/02 , H05B33/08 , H05K1/16 , H05K3/46 , H05K1/02 , H05K1/18 , H05K3/00 , H05K3/28 , H05K3/42
CPC classification number: H01F41/0206 , H01F17/0013 , H01F41/046 , H01F2017/006 , H01F2017/0066 , H05B33/0803 , H05B33/0821 , H05B33/0845 , H05K1/0209 , H05K1/021 , H05K1/0271 , H05K1/028 , H05K1/0283 , H05K1/165 , H05K1/183 , H05K1/189 , H05K3/0005 , H05K3/0035 , H05K3/0061 , H05K3/0097 , H05K3/281 , H05K3/427 , H05K3/4697 , H05K2201/056 , H05K2201/086 , H05K2201/0919 , H05K2201/09672 , H05K2201/09709 , H05K2201/09845 , H05K2203/0126 , H05K2203/0384 , H05K2203/0571 , H05K2203/063 , H05K2203/1545
Abstract: An embedded device 105 is assembled within a flexible circuit assembly 30 with the embedded device mid-plane intentionally located in proximity to the flexible circuit assembly central plane 115 to minimize stress effects on the embedded device. The opening 18, for the embedded device, is enlarged in an intermediate layer 10 to enhance flexibility of the flexible circuit assembly.
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