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21.发明授权公开(公告)号：US10366818B2
公开(公告)日：2019-07-30
申请号：US15669988
申请日：2017-08-07
Applicant: CYNTEC CO., LTD.
Inventor： Tsung-Chan Wu , Roger Hsieh , Yi-Min Huang , Lan-Chin Hsieh , Yu-Ching Kuo
Abstract: A choke includes a single-piece core entirely made of a same material, the single-piece core having two boards and a pillar located between the two boards, a winding space being located among the two boards and the pillar, wherein the pillar has a non-circular and non-rectangular cross section along a direction substantially perpendicular to an axial direction of the pillar, the cross section of the pillar has a first axis and a second axis intersecting with each other at a center of the cross section of the pillar and are substantially perpendicular with each other, the first axis is longer than the second axis, and the cross section of the pillar is substantially symmetrical to both of the first axis and the second axis.
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公开(公告)号：US20190131038A1
公开(公告)日：2019-05-02
申请号：US16022708
申请日：2018-06-29
Applicant: CYNTEC CO., LTD.
Inventor： Kuo-Tung Kao , Yang-Sheng Chou , Chieh-Yuan Feng
Abstract: A current sensing resistor includes a conductive body comprising a resistor portion and a pair of electrode portions connecting to two ends of the resistor portion, a receiving blind hole disposed on a top surface of each of the pair of electrode portions, and a detection terminal disposed on the receiving blind hole. The detection terminal includes a base fixed in the receiving blind hole and a terminal pin protruding from the top surface.
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公开(公告)号：US20190051453A1
公开(公告)日：2019-02-14
申请号：US16153811
申请日：2018-10-07
Applicant: CYNTEC CO., LTD.
Inventor： Hsieh-Shen Hsieh , Shih-Feng Chien , Yu-Lun Chang , Chih-Hung Wei
IPC: H01F41/02
Abstract: A method of manufacturing magnetic core elements includes preparing a plurality of magnetic green sheets and a plurality of non-magnetic green sheets; along a laminating direction, alternately laminating the plurality of magnetic green sheets and non-magnetic green sheets, thereby forming a green sheet laminate; along the laminating direction, cutting the green sheet laminate into a plurality of bodies with desired dimension; and sintering each of the bodies, thereby forming a plurality of magnetic core elements respectively having a plurality of discretely distributed gaps formed by the non-magnetic green sheets.
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公开(公告)号：US10199361B2
公开(公告)日：2019-02-05
申请号：US16021026
申请日：2018-06-28
Applicant: CYNTEC CO., LTD.
Inventor： Chi-Feng Huang , Bau-Ru Lu , Da-Jung Chen
Abstract: A stacked electronic structure comprises: a substrate and a magnetic device, wherein a plurality of electronic devices and a plurality of conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the plurality of electronic devices, wherein the magnetic device is disposed over the top surface of the molding body and the plurality of conductive pillars, wherein a first terminal of the magnetic device is disposed over and electrically connected to a first conductive pillar and a second terminal of the magnetic device is disposed over and electrically connected to a second conductive pillar, without using any substrate.
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公开(公告)号：US20180308829A1
公开(公告)日：2018-10-25
申请号：US16021026
申请日：2018-06-28
Applicant: CYNTEC CO., LTD.
Inventor： Chi-Feng Huang , Bau-Ru Lu , Da-Jung Chen
CPC classification number: H01L25/16 , H05K1/181 , H05K1/188 , H05K3/284 , H05K3/3405 , H05K3/3421 , H05K2201/086 , H05K2201/1003 , H05K2201/10166 , H05K2201/10515 , H05K2203/0415
Abstract: A stacked electronic structure comprises: a substrate and a magnetic device, wherein a plurality of electronic devices and a plurality of conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the plurality of electronic devices, wherein the magnetic device is disposed over the top surface of the molding body and the plurality of conductive pillars, wherein a first terminal of the magnetic device is disposed over and electrically connected to a first conductive pillar and a second terminal of the magnetic device is disposed over and electrically connected to a second conductive pillar, without using any substrate.
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Patent Agency Ranking
公开(公告)号：US10063098B2
公开(公告)日：2018-08-28
申请号：US15399742
申请日：2017-01-06
Applicant: CYNTEC CO., LTD.
Inventor： Huei-Ren You , Bau-Ru Lu , Kaipeng Chiang
IPC: H05K1/18 , H02J50/10 , H01F27/24 , H01F27/29 , H05K1/02 , H05K1/11 , H01F17/04 , H05K3/36 , H05K1/14
CPC classification number: H02J50/10 , H01F17/04 , H01F27/24 , H01F27/29 , H01F27/292 , H01F2017/048 , H05K1/0203 , H05K1/0262 , H05K1/117 , H05K1/141 , H05K1/184 , H05K3/366 , H05K2201/044 , H05K2201/066 , H05K2201/086 , H05K2201/1003 , H05K2201/10545
Abstract: An electronic module is provided. The electronic module comprises an inductor having a magnetic body with a coil encapsulated in the magnetic body and a substrate having electronic devices thereon, wherein a first electrode is disposed on a top surface of the magnetic body and a second electrode is disposed on a lateral surface of the magnetic body, wherein the top surface of the inductor and the bottom surface of the substrate are configured side by side and electrically connected to each other, wherein a plurality of third electrodes are disposed on a lateral surface of the substrate, for electrically connecting the electronic module to an external circuit board.
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公开(公告)号：US10062498B2
公开(公告)日：2018-08-28
申请号：US14840405
申请日：2015-08-31
Applicant: CYNTEC CO., LTD.
Inventor： Chia-Cheng Chuang
CPC classification number: H01F27/2895 , H01F17/062 , H01F19/08 , H01F27/2823 , H01F38/02 , H01F2017/0093
Abstract: A composite magnetic component is provided. The composite magnetic component includes a magnetic flux-guiding unit, a first coil structure and a second coil structure. The first coil structure and the second coil structure are wound around a first winding portion and a second winding portion of the magnetic flux-guiding unit, respectively. A first magnetic flux results from the first coil structure and the magnetic flux-guiding unit. A second magnetic flux results from the second coil structure and the magnetic flux-guiding unit. The first magnetic flux is orthogonal to the second magnetic flux within the magnetic flux-guiding unit.
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公开(公告)号：US20180240781A1
公开(公告)日：2018-08-23
申请号：US15961865
申请日：2018-04-24
Applicant: CYNTEC CO., LTD.
Inventor： BAU-RU LU , MING-CHIA WU , SHAO WEI LU
IPC: H01L25/065 , H05K7/20 , H05K3/42 , H05K1/11 , H05K5/06 , H05K5/02 , H01L23/552 , H01L25/00 , H01L23/13 , H01L23/373 , H01L23/538 , H01L23/31 , H01L23/40 , H01L23/36 , H01L23/498 , H05K7/02
CPC classification number: H01L25/0655 , H01L23/13 , H01L23/3121 , H01L23/36 , H01L23/3735 , H01L23/4006 , H01L23/49811 , H01L23/5389 , H01L23/552 , H01L24/18 , H01L25/072 , H01L25/117 , H01L25/50 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2924/13055 , H01L2924/13091 , H05K1/115 , H05K3/42 , H05K5/0247 , H05K5/065 , H05K7/02 , H05K7/20509 , Y10T29/49117 , Y10T29/49155 , Y10T29/49165 , H01L2924/00014 , H01L2924/00
Abstract: The present invention discloses a three-dimensional package structure which can achieve a relatively high utilization of an internal space thereof, so that a size of electronic package structure can be reduced. The three-dimensional package structure comprises a first electronic component, a plurality of second electronic components and a plurality of conductive patterns. The first electronic component has a top surface and a bottom surface. The plurality of second electronic components are disposed over the top surface of the first electronic component. The plurality of conductive patterns are disposed over the plurality of second electronic components to electrically connect the plurality of second electronic components and the first electronic component.
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公开(公告)号：US20180211759A1
公开(公告)日：2018-07-26
申请号：US15935067
申请日：2018-03-26
Applicant: CYNTEC CO., LTD.
Inventor： Chun-Tiao Liu , Lan-Chin Hsieh , Tsung-Chan Wu , Chi-Hsun Lee , Chih-Siang Chuang
CPC classification number: H01F27/022 , H01F1/14741 , H01F1/14766 , H01F1/14791 , H01F17/045 , H01F27/255 , H01F27/2828 , H01F27/29
Abstract: A magnetic device comprising a T-shaped magnetic core made of a material comprising a soft magnetic metal material and having a base and a pillar integrally formed with the base; a coil wound on the pillar; and a unitary magnetic body encapsulating the pillar, the coil and a portion of the base with a bottom surface of the base being not covered by the unitary magnetic body, wherein a contiguous portion of the unitary magnetic body encapsulates a top surface of the pillar and extends into a gap between a side surface of the pillar and an inner surface of the coil, wherein the core loss PBL (mW/cm3) of the unitary magnetic body satisfies: 2×f1.29×Bm2.2≤PBL≤14.03×f1.29×Bm1.08, where f(kHz) represents a frequency of a magnetic field applied to the T-shaped magnetic core, and Bm (kGauss) represents the operating magnetic flux density of the magnetic field at the frequency.
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公开(公告)号：US20180168045A1
公开(公告)日：2018-06-14
申请号：US15836860
申请日：2017-12-09
Applicant: CYNTEC CO., LTD.
Inventor： BAU-RU LU , CHUN HSIEN LU , DA-JUNG CHEN
CPC classification number: H01F27/022 , H01F17/04 , H01F27/24 , H01F27/28 , H01F27/2823 , H01F27/32 , H01F27/36 , H01F41/00 , H05K1/111 , H05K1/115 , H05K1/144 , H05K1/181 , H05K2201/041 , H05K2201/09063 , H05K2201/10015 , H05K2201/1003 , H05K2201/10522 , H05K2201/10545
Abstract: An electronic module is disclosed, wherein the electronic module comprises: a module board and a connection board, wherein a plurality of first electronic devices are disposed over a top surface of the module board, and a plurality of second electronic devices are disposed on a bottom surface of the module board, wherein a plurality of first contact points are disposed on the bottom surface of the module board and electrically connected to a plurality of second contact points on a top surface of the connection board, wherein a plurality of third contact points are on a bottom surface of the connection board for connecting with an external circuit.
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