Abstract:
Provided is a synchronous dynamic random access memory (DRAM) semiconductor device including multiple output buffers, a strobe control unit and multiple strobe buffers. Each of the output buffers is configured to output one bit of data. The strobe control unit is configured to output multiple strobe control signals in response to an externally input signal. The strobe buffers are connected to the output buffers and the strobe control unit, and each of the strobe buffers is configured to output at least one strobe signal. At least some of the strobe buffers are activated in response to the strobe control signals, and the output buffers are activated in response to the strobe signals output by the activated strobe buffers.
Abstract:
A method of outputting temperature data in a semiconductor device and a temperature data output circuit are provided. A pulse signal is generated in response to a booting enable signal activated in response to a power-up signal and the generation is inactivated in response to a mode setting signal during a power-up operation. A comparison signal is generated in response to the pulse signal by comparing a reference voltage independent of temperature with a sense voltage that varies with temperature change. The temperature data is changed in response to the comparison signal. Thus, the temperature data output circuit can rapidly output the exact temperature of the semiconductor device measured during the power-up operation.
Abstract:
A semiconductor memory device is disclosed. The semiconductor device includes a memory cell array, a clock signal generator configured to receive an external clock signal from the outside of the memory device and output an internal clock signal, and a data output unit configured to receive an internal data signal from the memory cell array and output a read data signal in response to the internal clock signal. The semiconductor memory device also includes a read data strobe unit configured to output a read data strobe signal having a cycle time of n times (n is an integer equal to or more than 2) a cycle time of the internal clock signal, based on the internal clock signal.
Abstract:
A multi-port semiconductor memory device having variable access paths and a method therefor are provided. The semiconductor memory device includes a plurality of input/output ports; a memory array divided into a plurality of memory areas; and a select control unit to variably control access paths between the memory areas and the input/output ports so that each memory area is accessed through at least one of the input/output ports.
Abstract:
Provided are a semiconductor chip including a TSV passing through a transistor, and a stack module and a memory card using such a semiconductor chip. The semiconductor chip may include a semiconductor layer that has a first surface and a second surface opposite to each other. A conductive layer may be disposed on the first surface of the semiconductor layer. A TSV may pass through the semiconductor layer and the conductive layer. A side wall insulating layer may surround a side wall of the TSV in order to electrically insulate the semiconductor layer and the conductive layer from the TSV.
Abstract:
A stacked layer type semiconductor device includes N memories each including at least one main via and (N−1) sub vias, the N memories being sequentially stacked on one-another so that central axes of the N memories face each other crosswise, and a plurality of connection units electrically connecting the N memories. Here, N is a natural number greater than 1.
Abstract:
A refresh control circuit in a semiconductor memory device includes a refresh controller, a voltage generator and a word line enable circuit. The refresh period controller generates a control signal in response to a self-refresh signal, the control signal indicating a nominal initiation of a refresh period. The voltage generator generates an output voltage in response to the control signal. The output voltage is boosted from a low voltage to a high voltage during the refresh period. The word line enable circuit generates a word line enable signal in response to the control signal, wherein the word line enable signal is activated following a delay after the nominal initiation of the refresh period, and the delay allows the voltage generator to fully boost the output voltage.
Abstract:
A multi-port semiconductor memory device having variable access paths and a method therefor are provided. The semiconductor memory device includes a plurality of input/output ports; a memory array divided into a plurality of memory areas; and a select control unit to variably control access paths between the memory areas and the input/output ports so that each memory area is accessed through at least one of the input/output ports.
Abstract:
A refresh control circuit in a semiconductor memory device includes a refresh controller, a voltage generator and a word line enable circuit. The refresh period controller generates a control signal in response to a self-refresh signal, the control signal indicating a nominal initiation of a refresh period. The voltage generator generates an output voltage in response to the control signal. The output voltage is boosted from a low voltage to a high voltage during the refresh period. The word line enable circuit generates a word line enable signal in response to the control signal, wherein the word line enable signal is activated following a delay after the nominal initiation of the refresh period, and the delay allows the voltage generator to fully boost the output voltage.
Abstract:
A multiprocessor system and method thereof are provided. The example multiprocessor system may include first and second processors, a dynamic random access memory having a memory cell array, the memory cell array including a first memory bank coupled to the first processor through a first port, second and fourth memory banks coupled to the second processor through a second port, and a third memory bank shared and connected with the first and second processors through the first and second ports, and a bank address assigning unit for assigning bank addresses to select individually the first and second memory banks, as the same bank address through the first and second ports, so that starting addresses for the first and second memory banks become equal in booting, and assigning bank addresses to select the third memory bank, as different bank addresses through the first and second ports, and assigning, through the second port, bank addresses to select the fourth memory bank, as the same bank address as a bank address to select the third memory bank through the first port.