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Patent Agency Ranking
公开(公告)号：US20160260695A1
公开(公告)日：2016-09-08
申请号：US14637109
申请日：2015-03-03
Applicant: Apple Inc.
Inventor： Chih-Ming Chung , Jun Zhai , Yizhang Yang
IPC: H01L25/18 , H01L25/00 , H01L23/48 , H01L21/768 , H01L23/538 , H01L23/00 , H01L23/367 , H01L21/56 , H01L25/065 , H01L23/31
CPC classification number: H01L25/18 , H01L21/565 , H01L21/568 , H01L21/768 , H01L23/3107 , H01L23/34 , H01L23/36 , H01L23/3675 , H01L23/481 , H01L23/49816 , H01L23/5383 , H01L23/5384 , H01L23/5386 , H01L23/5389 , H01L23/552 , H01L24/14 , H01L24/19 , H01L24/32 , H01L24/97 , H01L25/0652 , H01L25/105 , H01L25/16 , H01L25/50 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/13024 , H01L2224/131 , H01L2224/13144 , H01L2224/16227 , H01L2224/27318 , H01L2224/2732 , H01L2224/27436 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/73267 , H01L2224/81005 , H01L2224/81203 , H01L2224/81815 , H01L2224/82031 , H01L2224/82039 , H01L2224/83005 , H01L2224/83191 , H01L2224/83855 , H01L2224/83862 , H01L2224/83874 , H01L2224/92225 , H01L2224/92244 , H01L2224/94 , H01L2224/97 , H01L2225/06548 , H01L2225/06555 , H01L2225/06589 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/12 , H01L2924/14 , H01L2924/1431 , H01L2924/1433 , H01L2924/1434 , H01L2924/1436 , H01L2924/15311 , H01L2924/19011 , H01L2924/19041 , H01L2924/19042 , H01L2924/19103 , H01L2924/19104 , H01L2924/19105 , H01L2924/3025 , H01L2924/3511 , H01L2924/014 , H01L2224/27 , H01L2224/83 , H01L2224/82 , H01L2224/81
Abstract: Packages and methods of formation are described. In an embodiment, a system in package (SiP) includes first and second redistribution layers (RDLs), stacked die between the first and second RDLs, and conductive pillars extending between the RDLs. A molding compound may encapsulate the stacked die and conductive pillars between the first and second RDLs.
Abstract translation: 描述了包装和形成方法。 在一个实施例中，封装系统（SiP）包括第一和第二再分配层（RDL），第一和第二RDL之间的堆叠管芯，以及在RDL之间延伸的导电柱。 模塑料可以将堆叠的管芯和导电柱塞在第一和第二RDL之间。
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公开(公告)号：US09318474B2
公开(公告)日：2016-04-19
申请号：US14192145
申请日：2014-02-27
Applicant: Apple Inc.
Inventor： Jun Zhai , Yizhang Yang , Mengzhi Pang
IPC: H01L23/34 , H01L25/16 , H01L25/00 , H01L23/00 , H01L23/36 , H01L23/498 , H01L23/538 , H01L25/10 , H01L25/065
CPC classification number: H01L25/165 , H01L23/36 , H01L23/49816 , H01L23/5384 , H01L23/5389 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/08225 , H01L2224/16145 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2224/73257 , H01L2224/81894 , H01L2224/83894 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06537 , H01L2225/06589 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2225/1094 , H01L2924/1434 , H01L2924/15311 , H01L2924/15331 , H01L2924/18161 , H01L2924/2064 , H01L2924/20641 , H01L2924/20642 , H01L2924/20643 , H01L2924/20644 , H01L2924/20645 , H01L2924/20646 , H01L2924/20647 , H01L2924/20648 , H01L2924/20649
Abstract: In some embodiments, a semiconductor device package assembly may include a first substrate. The semiconductor device package assembly may include a first die electrically connected to the first substrate such that the first die is directly bonded to the first substrate. The semiconductor device package assembly may include a second substrate directly bonded to a surface of the first die. The semiconductor device package assembly may include an electronic memory module. The electronic memory module may be directly bonded to the second substrate. The semiconductor device package assembly may include a thermally conductive material directly applied to the electronic memory module. The semiconductor device package assembly may include a heat spreader directly bonded to the thermally conductive material. The heat spreader may function to transfer heat from the first die and the electronic memory module through the heat spreader from the first side to the second side.
Abstract translation: 在一些实施例中，半导体器件封装组件可以包括第一衬底。 半导体器件封装组件可以包括电连接到第一衬底的第一裸片，使得第一裸片直接结合到第一衬底。 半导体器件封装组件可以包括直接接合到第一管芯的表面的第二衬底。 半导体器件封装组件可以包括电子存储器模块。 电子存储器模块可以直接结合到第二衬底。 半导体器件封装组件可以包括直接施加到电子存储器模块的导热材料。 半导体器件封装组件可以包括直接结合到导热材料的散热器。 散热器可以起到将热量从第一模具和电子存储器模块通过散热器从第一侧传递到第二侧的功能。
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23.发明申请公开(公告)号：US20150118795A1
公开(公告)日：2015-04-30
申请号：US14593317
申请日：2015-01-09
Applicant: APPLE INC.
Inventor： Jie-Hua Zhao , Yizhang Yang , Jun Zhai , Chih-Ming Chung
CPC classification number: H01L25/50 , H01L23/3128 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06562 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/3511 , H01L2924/37001 , Y02P80/30 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A PoP (package-on-package) package includes a bottom package coupled to a top package. Terminals on the top of the bottom package are coupled to terminals on the bottom of the top package with an electrically insulating material located between the upper surface of the bottom package and the lower surface of the top package. The bottom package and the top package are coupled during a process that applies force to bring the packages together while heating the packages.
Abstract translation: PoP（封装封装）封装包括一个耦合到顶部封装的底部封装。 底部封装顶部的端子通过位于底部封装的上表面和顶部封装的下表面之间的电绝缘材料耦合到顶部封装的底部上的端子。 底部包装和顶部包装在加工包装的过程中被联接，该过程中施加力以使包装在一起。
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公开(公告)号：US08963311B2
公开(公告)日：2015-02-24
申请号：US13627905
申请日：2012-09-26
Applicant: Apple Inc.
Inventor： Jie-Hua Zhao , Yizhang Yang , Jun Zhai , Chih-Ming Chung
CPC classification number: H01L25/50 , H01L23/3128 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06562 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/3511 , H01L2924/37001 , Y02P80/30 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A PoP (package-on-package) package includes a bottom package coupled to a top package. Terminals on the top of the bottom package are coupled to terminals on the bottom of the top package with an electrically insulating material located between the upper surface of the bottom package and the lower surface of the top package. The bottom package and the top package are coupled during a process that applies force to bring the packages together while heating the packages.
Abstract translation: PoP（封装封装）封装包括一个耦合到顶部封装的底部封装。 底部封装顶部的端子通过位于底部封装的上表面和顶部封装的下表面之间的电绝缘材料耦合到顶部封装的底部上的端子。 底部包装和顶部包装在加工包装的过程中被联接，该过程中施加力以使包装在一起。
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公开(公告)号：US20140084487A1
公开(公告)日：2014-03-27
申请号：US13627905
申请日：2012-09-26
Applicant: APPLE INC.
Inventor： Jie-Hua Zhao , Yizhang Yang , Jun Zhai , Chih-Ming Chung
CPC classification number: H01L25/50 , H01L23/3128 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06562 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/3511 , H01L2924/37001 , Y02P80/30 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A PoP (package-on-package) package includes a bottom package coupled to a top package. Terminals on the top of the bottom package are coupled to terminals on the bottom of the top package with an electrically insulating material located between the upper surface of the bottom package and the lower surface of the top package. The bottom package and the top package are coupled during a process that applies force to bring the packages together while heating the packages.
Abstract translation: PoP（封装封装）封装包括一个耦合到顶部封装的底部封装。 底部封装顶部的端子通过位于底部封装的上表面和顶部封装的下表面之间的电绝缘材料耦合到顶部封装的底部上的端子。 底部包装和顶部包装在加工包装的过程中被联接，该过程中施加力以使包装在一起。
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