公开(公告)号：US20110101532A1

公开(公告)日：2011-05-05

申请号：US12611609

申请日：2009-11-03

申请人： Jens Pohl ,  Hans-Joachim Barth ,  Gottfried Beer ,  Rainer Steiner ,  Werner Robl ,  Mathias Vaupel

发明人： Jens Pohl ,  Hans-Joachim Barth ,  Gottfried Beer ,  Rainer Steiner ,  Werner Robl ,  Mathias Vaupel

IPC分类号： H01L23/48 ,  H05K1/00 ,  C25D5/00 ,  C25D5/34

CPC分类号： H01L23/5389 ,  H01L21/486 ,  H01L21/76873 ,  H01L21/76879 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/82 ,  H01L24/97 ,  H01L2221/1089 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2224/82 ,  H01L2924/00

摘要： A method for fabricating a device includes providing a substrate including at least one contact and applying a dielectric layer over the substrate. The method includes applying a first seed layer over the dielectric layer, applying an inert layer over the seed layer, and structuring the inert layer, the first seed layer, and the dielectric layer to expose at least a portion of the contact. The method includes applying a second seed layer over exposed portions of the structured dielectric layer and the contact such that the second seed layer makes electrical contact with the structured first seed layer. The method includes electroplating a metal on the second seed layer.

摘要翻译： 一种用于制造器件的方法包括提供包括至少一个接触的衬底并在衬底上施加电介质层。 该方法包括在电介质层上施加第一种子层，在种子层上施加惰性层，以及构造惰性层，第一籽晶层和电介质层以暴露至少一部分接触。 该方法包括在结构化介电层和触点的暴露部分上施加第二种子层，使得第二籽晶层与结构化的第一籽晶层电接触。 该方法包括在第二种子层上电镀金属。

公开(公告)号：US20110057304A1

公开(公告)日：2011-03-10

申请号：US12947031

申请日：2010-11-16

申请人： Gottfried Beer ,  Irmgard Escher-Poeppel

发明人： Gottfried Beer ,  Irmgard Escher-Poeppel

IPC分类号： H01L23/498 ,  H01L21/60

CPC分类号： H01L24/96 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/76879 ,  H01L23/3128 ,  H01L24/18 ,  H01L24/19 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/18 ,  H01L2224/2919 ,  H01L2224/83856 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2224/82 ,  H01L2924/0665 ,  H01L2924/00

摘要： A method for fabricating a semiconductor chip module and a semiconductor chip package is disclosed. One embodiment provides a first layer, a second layer, and a base layer. The first layer is disposed on the base layer, and the second layer is disposed on the first layer. A plurality of semiconductor chips is applied above the second layer, and the second layer with the applied semiconductor chips is separated from the first layer.

摘要翻译： 公开了一种制造半导体芯片模块和半导体芯片封装的方法。 一个实施例提供第一层，第二层和基层。 第一层设置在基层上，第二层设置在第一层上。 多个半导体芯片被施加在第二层上方，并且具有施加的半导体芯片的第二层与第一层分离。

公开(公告)号：US20110012214A1

公开(公告)日：2011-01-20

申请号：US12891288

申请日：2010-09-27

申请人： Gottfried Beer ,  Horst Theuss

发明人： Gottfried Beer ,  Horst Theuss

IPC分类号： H01L29/84

CPC分类号： B81C1/00333 ,  H01L23/293 ,  H01L23/3171 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/32225 ,  H01L2224/32265 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2924/01014 ,  H01L2224/83 ,  H01L2224/03 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/11

摘要： One aspect of the invention relates to a semiconductor component with cavity structure and a method for producing the same. The semiconductor component has an active semiconductor chip with the microelectromechanical structure and a wiring structure on its top side. The microelectromechanical structure is surrounded by walls of at least one cavity. A covering, which covers the cavity, is arranged on the walls. The walls have a photolithographically patterned polymer. The covering has a layer with a polymer of identical type. In one case, the molecular chains of the polymer of the walls are crosslinked with the molecular chains of the polymer layer of the covering layer to form a dimensionally stable cavity housing.

摘要翻译： 本发明的一个方面涉及具有腔结构的半导体部件及其制造方法。 半导体部件具有微机电结构的有源半导体芯片及其顶侧的布线结构。 微机电结构由至少一个空腔的壁包围。 覆盖空腔的覆盖物布置在墙壁上。 墙壁具有光刻图案的聚合物。 覆盖物具有具有相同类型的聚合物的层。 在一种情况下，壁的聚合物的分子链与覆盖层的聚合物层的分子链交联以形成尺寸稳定的腔体。

公开(公告)号：US07863728B2

公开(公告)日：2011-01-04

申请号：US11869354

申请日：2007-10-09

申请人： Gottfried Beer ,  Christoph Kienmayer ,  Klaus Pressel ,  Werner Simbuerger

发明人： Gottfried Beer ,  Christoph Kienmayer ,  Klaus Pressel ,  Werner Simbuerger

IPC分类号： H01L23/31 ,  H01L23/498 ,  H01L23/34

CPC分类号： H01L23/66 ,  G01S7/032 ,  G01S19/36 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/552 ,  H01L24/19 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L24/96 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/24226 ,  H01L2224/48091 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/1903 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01Q1/44 ,  H01Q9/0407 ,  H01Q9/0457 ,  H01Q19/00 ,  H01Q21/0087 ,  H01Q23/00 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor module includes components in a plastic casing. The semiconductor module includes a plastic package molding compound and a semiconductor chip. Also provided in the module are a first principal surface including an upper side of the plastic package molding compound and at least one active upper side of the semiconductor chip, a second principal surface including a back side of the plastic package molding compound, and a multilayered conductor track structure disposed on the first principal surface and a second metal layer disposed on the second principal surface.

摘要翻译： 半导体模块包括塑料外壳中的部件。 半导体模块包括塑料封装模塑料和半导体芯片。 还设置在模块中的是包括塑料封装模塑料的上侧和半导体芯片的至少一个活性上侧的第一主表面，包括塑料封装模塑料的背面的第二主表面和多层 导体轨道结构设置在第一主表面上，第二金属层设置在第二主表面上。

公开(公告)号：US07830026B2

公开(公告)日：2010-11-09

申请号：US11526102

申请日：2006-09-25

申请人： Gottfried Beer ,  Edward Fuergut

发明人： Gottfried Beer ,  Edward Fuergut

IPC分类号： H01L23/29 ,  H01L21/00

CPC分类号： H01L23/552 ,  H01L23/29 ,  H01L23/295 ,  H01L23/3128 ,  H01L2224/04105 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor device with plastic housing composition includes an internal wiring that is electrically insulated from the plastic housing composition by an insulation layer. The plastic housing composition has a high thermal conductivity and a low coefficient of expansion, the coefficient of expansion being adapted to the semiconductor chip of the semiconductor device. This is achieved by forming the plastic housing composition with electrically semiconducting and/or electrically conducting filler particles. In particular, this plastic housing composition is advantageously used for semiconductor devices with flip-chip contacts and/or for semiconductor devices which are constructed according to the “universal packaging concept”.

摘要翻译： 具有塑料外壳组合物的半导体器件包括通过绝缘层与塑料外壳组合物电绝缘的内部布线。 塑料外壳组合物具有高导热性和低膨胀系数，膨胀系数适用于半导体器件的半导体芯片。 这通过用电半导体和/或导电填料颗粒形成塑料外壳组合物来实现。 特别地，该塑料外壳组合物有利地用于具有倒装芯片触点和/或根据“通用封装概念”构造的半导体器件的半导体器件。

公开(公告)号：US20100178736A1

公开(公告)日：2010-07-15

申请号：US12353432

申请日：2009-01-14

申请人： Gottfried Beer ,  Irmgard Escher-Poeppel

发明人： Gottfried Beer ,  Irmgard Escher-Poeppel

IPC分类号： H01L21/56

CPC分类号： H01L21/56 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/97 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00

摘要： One method includes fabricating a semiconductor device including providing a dielectric layer. At least one semiconductor chip is provided defining a first surface including contact elements and a second surface opposite to the first surface. The semiconductor chip is placed onto the dielectric layer with the first surface facing the dielectric layer. An encapsulant material is applied over the second surface of the semiconductor chip in a reel-to-reel process.

摘要翻译： 一种方法包括制造包括提供介电层的半导体器件。 提供至少一个半导体芯片，其限定包括接触元件的第一表面和与第一表面相对的第二表面。 半导体芯片被放置在电介质层上，第一表面面向电介质层。 密封剂材料以卷到盘的方式施加在半导体芯片的第二表面上。

公开(公告)号：US20100078776A1

公开(公告)日：2010-04-01

申请号：US12242487

申请日：2008-09-30

申请人： Hans-Joachim Barth ,  Jens Pohl ,  Gottfried Beer ,  Heinrich Koerner

发明人： Hans-Joachim Barth ,  Jens Pohl ,  Gottfried Beer ,  Heinrich Koerner

IPC分类号： H01L23/552 ,  H01L21/44

CPC分类号： H01L21/76898 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/552 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05 ,  H01L2224/05569 ,  H01L2924/0002 ,  H01L2224/05552

摘要： Structures of a system on chip and methods of forming a system on chip are disclosed. In one embodiment, a method of fabricating the system on chip includes forming a through substrate opening from a back surface of a substrate, the through substrate opening disposed between a first and a second region, the first region comprising devices for RF circuitry and the second region comprising devices for other circuitry. The method further includes forming patterns for redistribution lines on a photo resist layer, the photo resist layer disposed under the back surface, and filling the through substrate opening and the patterns for redistribution lines with a conductive material.

摘要翻译： 公开了一种片上系统的结构以及片上系统的形成方法。 在一个实施例中，一种制造片上系统的方法包括从衬底的背面形成穿透衬底开口，穿过衬底开口设置在第一和第二区域之间，第一区域包括用于RF电路的装置，第二区域包括第二 区域包括用于其他电路的装置。 该方法还包括在光致抗蚀剂层上形成用于再分配线的图案，设置在背面下方的光致抗蚀剂层，以及用导电材料填充贯通基板开口和再分配线图案。

公开(公告)号：US20080142932A1

公开(公告)日：2008-06-19

申请号：US11834402

申请日：2007-08-06

申请人： Gottfried Beer ,  Edward Fuergut

发明人： Gottfried Beer ,  Edward Fuergut

IPC分类号： H01L23/552 ,  H01L21/56

CPC分类号： H01L23/552 ,  H01L23/29 ,  H01L23/295 ,  H01L23/3128 ,  H01L2224/04105 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor device with a plastic housing composition includes a semiconductor chip and an internal wiring. The plastic housing composition is electrically conductive and electrically connected to a first contact pad of the internal wiring. A first side of the semiconductor chip is electrically insulated from the plastic housing composition by an insulation layer.

摘要翻译： 具有塑料外壳组合物的半导体器件包括半导体芯片和内部布线。 塑料外壳组合物是导电的并且电连接到内部布线的第一接触焊盘。 半导体芯片的第一面通过绝缘层与塑料外壳组合物电绝缘。

公开(公告)号：US20080105966A1

公开(公告)日：2008-05-08

申请号：US11869354

申请日：2007-10-09

申请人： Gottfried Beer ,  Christoph Kienmayer ,  Klaus Pressel ,  Werner Simbuerger

发明人： Gottfried Beer ,  Christoph Kienmayer ,  Klaus Pressel ,  Werner Simbuerger

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L23/66 ,  G01S7/032 ,  G01S19/36 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/552 ,  H01L24/19 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L24/96 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/24226 ,  H01L2224/48091 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/1903 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01Q1/44 ,  H01Q9/0407 ,  H01Q9/0457 ,  H01Q19/00 ,  H01Q21/0087 ,  H01Q23/00 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor module includes components in a plastic casing. The semiconductor module includes a plastic package molding compound and a semiconductor chip. Also provided in the module are a first principal surface including an upper side of the plastic package molding compound and at least one active upper side of the semiconductor chip, a second principle surface including a back side of the plastic package molding compound, and a multilayered conductor track structure disposed on the first principal surface and a second metal layer disposed on the second principle surface.

摘要翻译： 半导体模块包括塑料外壳中的部件。 半导体模块包括塑料封装模塑料和半导体芯片。 模块中还设置有包括塑料封装模塑料的上侧和半导体芯片的至少一个活性上侧的第一主表面，包括塑料封装模塑料的背面的第二主表面和多层 导体轨道结构设置在第一主表面上，第二金属层设置在第二主表面上。

公开(公告)号：US20070230876A1

公开(公告)日：2007-10-04

申请号：US11693446

申请日：2007-03-29

申请人： Gottfried Beer ,  Jochen Dangelmaier ,  Cyrus Ghahremani ,  Jean Schmitt

发明人： Gottfried Beer ,  Jochen Dangelmaier ,  Cyrus Ghahremani ,  Jean Schmitt

IPC分类号： G02B6/36

CPC分类号： G02B6/4202 ,  G02B6/4232

摘要： A device for transmitting data between two structural units connected to one another by an articulated joint has a long service life which permits a high transmission rate in conjunction with particularly small dimensions. The first structural unit includes a first optoelectronic component and the second structural unit includes a second optoelectronic component, the first optoelectronic component being connected to the second optoelectronic component via at least one optical fiber. One end of the optical fiber is brought into contact with the first optoelectronic component via a molded interconnect device (MID) plug connection and the other end is brought into contact with the second optoelectronic component via another MID plug connection.

摘要翻译： 用于通过铰接接头彼此连接的两个结构单元之间传输数据的设备具有较长的使用寿命，其允许高传输速率与特别小的尺寸相结合。 第一结构单元包括第一光电子部件，第二结构单元包括第二光电子部件，第一光电子部件经由至少一根光纤连接到第二光电部件。 通过模制的互连装置（MID）插头连接使光纤的一端与第一光电子部件接触，另一端通过另一个MID插头连接与第二光电子部件接触。