公开(公告)号：US09937124B2

公开(公告)日：2018-04-10

申请号：US14483278

申请日：2014-09-11

Applicant: International Business Machines Corporation

Inventor： S. Jay Chey ,  Bing Dang ,  John U. Knickerbocker ,  Kenneth F. Latzko ,  Joana Sofia Branquinho Teresa Maria ,  Lavanya Turlapati ,  Bucknell C. Webb ,  Steven L. Wright

IPC: A61K9/00 ,  A61M31/00 ,  A61M5/142 ,  A61M5/44 ,  A61N1/04

CPC classification number: A61K9/0097 ,  A61M31/002 ,  A61M2205/0244 ,  A61N1/0428 ,  A61N1/0444 ,  A61N1/0448

Abstract: Electromechanical substance delivery devices are provided which implement low-power electromechanical release mechanisms for controlled delivery of substances such as drugs and medication. For example, an electromechanical device includes a substrate having a cavity formed in a surface of the substrate, a membrane disposed on the surface of the substrate covering an opening of the cavity, and a seal disposed between the membrane and the surface of the substrate. The seal surrounds the opening of the cavity, and the seal and membrane are configured to enclose the cavity and retain a substance within the cavity. An electrode structure is configured to locally heat a portion of the membrane in response to a control voltage applied to the electrode structure, and create a stress that causes a rupture in the locally heated portion of the membrane to release the substance from within the cavity.

公开(公告)号：US09897627B2

公开(公告)日：2018-02-20

申请号：US15469501

申请日：2017-03-25

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Jae-Woong Nah ,  Robert E. Trzcinski ,  Cornelia Kang-I Tsang

IPC: G01R1/067 ,  G01R31/00 ,  G01R1/04 ,  H01L21/66 ,  H01L23/498

CPC classification number: G01R1/0408 ,  G01R1/06761 ,  G01R3/00 ,  H01L22/30 ,  H01L22/34 ,  H01L23/49838 ,  H01L2224/0401 ,  H01L2224/32145 ,  H01L2224/73265 ,  H01L2924/014

Abstract: A test probe structure having a planar surface and contact locations matched to test hardware is provided. The fabrication of the test probe structure addresses problems related to the possible deformation of base substrates during manufacture. Positional accuracy of contact locations and planarity of base substrates is achieved using dielectric layers, laser ablation, injection molded solder or redistribution layer wiring, and planarization techniques.

公开(公告)号：US09773751B1

公开(公告)日：2017-09-26

申请号：US15214935

申请日：2016-07-20

Applicant: International Business Machines Corporation

Inventor： John U. Knickerbocker ,  Shriya Kumar ,  Jae-Woong Nah

IPC: H01L23/00 ,  H01L23/498

CPC classification number: A61B5/68 ,  A61B2562/12 ,  A61M5/00 ,  A61M2207/00 ,  B23K3/0638 ,  B23K2101/36 ,  H01L21/486 ,  H01L21/76816 ,  H01L21/76852 ,  H01L21/76883 ,  H01L21/76898 ,  H01L23/15 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/53228 ,  H01L23/53238 ,  H01L23/53242 ,  H01L23/53252 ,  H01L23/53266 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/19 ,  H01L24/20 ,  H01L24/27 ,  H01L24/32 ,  H01L24/64 ,  H01L24/69 ,  H01L24/83 ,  H01L24/89 ,  H01L2223/6677 ,  H01L2224/27312 ,  H01L2224/32111 ,  H01L2224/32235 ,  H01L2224/325 ,  H01L2224/64 ,  H01L2224/69 ,  H01L2224/83801 ,  H01L2224/89 ,  H01L2224/96 ,  H01L2924/014 ,  H01L2924/1434 ,  H01L2924/15332 ,  H05K1/0306 ,  H05K3/4038 ,  H05K2201/0305

Abstract: A method includes forming one or more vias in a first layer, forming one or more vias in at least a second layer different than the first layer, aligning at least a first via in the first layer with at least a second via in the second layer, and bonding the first layer to the second layer by filling the first via and the second via with solder material using injection molded soldering.

公开(公告)号：US20170194225A1

公开(公告)日：2017-07-06

申请号：US14984227

申请日：2015-12-30

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Minhua Lu ,  Jae-Woong Nah ,  Robert John Polastre

IPC: H01L23/31 ,  H01L21/786 ,  H01L23/15

CPC classification number: H05K5/0095 ,  H01L21/486 ,  H01L23/15 ,  H01L23/3121 ,  H05K5/0247 ,  H05K5/04

Abstract: A hermetically sealed electronic device and method of fabrication are provided. A base layer of a wafer is created using a substrate formed from ultra-thin glass or ceramic using panel or roll to roll processing. One or more layers are bonded to the base layer. The wafer is singulated into a plurality of electronic devices having a top surface and a plurality of sides. A hermetic sealant is applied to each electronic device to completely encase the top surface and the sides while bonding to the base layer. At least one of the layers is a metallization layer formed by metal deposition. Full metallization may be applied over the entire wafer and a pattern subsequently transferred to the full metallization by one of laser and chemical etching. The electronic device may further include at least one electronic component attached to one of the layers and encased by the hermetic sealant.

公开(公告)号：US20170193775A1

公开(公告)日：2017-07-06

申请号：US15466122

申请日：2017-03-22

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Monty Montague Denneau ,  John U. Knickerbocker ,  Robert L. Wisnieff

IPC: G08B13/24 ,  H01L21/78 ,  H01L23/66 ,  H01L31/054 ,  H01L23/544

CPC classification number: G08B13/244 ,  G06K19/0704 ,  G06K19/0707 ,  G06K19/0716 ,  G06K19/0717 ,  G06K19/0723 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07775 ,  H01L21/78 ,  H01L23/544 ,  H01L23/66 ,  H01L31/0547 ,  H01L2223/54426 ,  H01L2223/6677

Abstract: A smart tag comprises a processor, a non-volatile memory, at least one of an internal power source and an external power source, and a transceiver configured for two-way communication with a reader external to the smart tag. The smart tag is formed as an integrated circuit chip less than 10 cubic millimeters in size to less than 0.000125 cubic millimeters in size. An apparatus comprising the smart tag may further include an antenna connect to the smart tag.

公开(公告)号：US20170172537A1

公开(公告)日：2017-06-22

申请号：US14977855

申请日：2015-12-22

Applicant: International Business Machines Corporation

Inventor： Kang-Wook Lee ,  John U. Knickerbocker

IPC: A61B7/04 ,  A61B7/00

CPC classification number: A61B7/04 ,  A61B7/003 ,  G06F19/00

Abstract: In accordance with the example embodiments of the invention there is at least a method and apparatus to perform receiving, with at least one diaphragm of a device placed on a skin of a living body of a human being or animal, acoustic data of the living body; determining digitized data from the acoustic data of the living body; and sending the digitized data towards an analytics system for a medical diagnosis associated with the living body; determining a relationship between the digitized data and health conditions of the human being or animal; and applying the relationship to a diagnosis of the health conditions of the human being or animal.

公开(公告)号：US09684862B2

公开(公告)日：2017-06-20

申请号：US14927013

申请日：2015-10-29

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Monty Montague Denneau ,  John U. Knickerbocker ,  Robert L. Wisnieff

IPC: G06K19/077

CPC classification number: G08B13/244 ,  G06K19/0704 ,  G06K19/0707 ,  G06K19/0716 ,  G06K19/0717 ,  G06K19/0723 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07775 ,  H01L21/78 ,  H01L23/544 ,  H01L23/66 ,  H01L31/0547 ,  H01L2223/54426 ,  H01L2223/6677

Abstract: A smart tag comprises a processor, a non-volatile memory, at least one of an internal power source and an external power source, and a transceiver configured for two-way communication with a reader external to the smart tag. The smart tag is formed as an integrated circuit chip less than 10 cubic millimeters in size to less than 0.000125 cubic millimeters in size. An apparatus comprising the smart tag may further include an antenna connect to the smart tag.

公开(公告)号：US20170125388A1

公开(公告)日：2017-05-04

申请号：US15403430

申请日：2017-01-11

Applicant: International Business Machines Corporation

Inventor： Thomas J. Brunschwiler ,  Evan G. Colgan ,  John U. Knickerbocker ,  Bruno Michael ,  Chin Lee Ong ,  Cornelia K. Tsang

IPC: H01L25/065 ,  H01L23/427 ,  H01L25/00

CPC classification number: H05K7/20381 ,  H01L23/367 ,  H01L23/427 ,  H01L23/49816 ,  H01L25/0657 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/81141 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2225/06593 ,  H05K7/20309 ,  H05K7/20327

Abstract: A package structure to implement two-phase cooling includes a chip stack disposed on a substrate, and a package lid that encloses the chip stack. The chip stack includes a plurality of conjoined chips, a central inlet manifold formed through a central region of the chip stack, and a peripheral outlet manifold. The central input manifold includes inlet nozzles to feed liquid coolant into flow cavities formed between adjacent conjoined chips. The peripheral outlet manifold outputs heated liquid and vapor from the flow cavities. The package lid includes a central coolant supply inlet aligned to the central inlet manifold, and a peripheral liquid-vapor outlet to output heated liquid and vapor that exits from the peripheral outlet manifold. Guiding walls may be included in the flow cavities to guide a flow of liquid and vapor, and the guiding walls can be arranged to form radial flow channels that are feed by different inlet nozzles of the central inlet manifold.

公开(公告)号：US20160284582A1

公开(公告)日：2016-09-29

申请号：US14668534

申请日：2015-03-25

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Bing Dang ,  Jeffrey D. Gelorme ,  John U. Knickerbocker

IPC: H01L21/683 ,  C09J171/12 ,  C08K3/04 ,  H01L21/02 ,  C09J9/00

CPC classification number: H01L21/6835 ,  C08G59/063 ,  C08G2650/56 ,  C08K3/04 ,  C08L63/00 ,  C08L71/00 ,  C09J9/00 ,  C09J163/00 ,  C09J171/00 ,  H01L21/02057 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.

公开(公告)号：US20160133498A1

公开(公告)日：2016-05-12

申请号：US14536175

申请日：2014-11-07

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Robert D. Allen ,  Paul S. Andry ,  Jeffrey D. Gelorme ,  Li-wen Hung ,  John U. Knickerbocker ,  Cornelia K. Tsang

IPC: H01L21/683 ,  H01L21/304 ,  H01L21/306

CPC classification number: H01L21/6836 ,  H01L21/304 ,  H01L21/30604 ,  H01L21/463 ,  H01L21/6835 ,  H01L21/76256 ,  H01L21/76898 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L25/03 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68381

Abstract: A method for adhesive bonding in microelectronic device processing is provided that includes bonding a handling wafer to a front side of a device wafer with an adhesive comprising phenoxy resin; and thinning the device wafer from the backside of the device wafer while the device wafer is adhesively engaged to the handling wafer. After the device wafer has been thinned, the adhesive comprising phenoxy resin may be removed by laser debonding, wherein the device wafer is separated from the handling wafer.

Abstract translation: 提供了一种微电子器件处理中的粘合方法，其包括用包含苯氧基树脂的粘合剂将处理晶片粘合到器件晶片的前侧; 以及当器件晶片与处理晶片粘合地接合时，从器件晶片的背面使器件晶片变薄。 在器件晶片减薄之后，可以通过激光剥离除去包含苯氧基树脂的粘合剂，其中将器件晶片与处理晶片分离。