-
公开(公告)号：US5920462A
公开(公告)日：1999-07-06
申请号：US58128
申请日：1998-04-10
CPC分类号： H05K7/20509 , H05K1/0206 , H05K1/0212 , H05K1/111 , H05K3/341 , H05K2201/09381 , H05K2201/09663 , H05K2201/09781 , H05K2201/10166 , H05K2201/10969 , H05K2203/107 , H05K2203/1178 , H05K3/3494 , H05K3/42 , Y02P70/611 , Y02P70/613
摘要： There is disclosed herein a printed circuit board onto which an electronic component heat spreader may be soldered by laser soldering, one embodiment of which comprises: a dielectric substrate 10 having a top surface 11 on which a footprint perimeter P of the component heat spreader is defined, and two or more heat spreader mounting pads 20 arranged on the substrate top surface 12. Each mounting pad 20 comprises a first portion 21 arranged on the substrate surface 12 outside of the footprint perimeter P, and a second portion 22 arranged on the substrate surface 12 inside of the footprint perimeter P contiguous with the first portion 21.
摘要翻译： 这里公开了一种印刷电路板，其上可以通过激光焊接将电子部件散热器焊接在该印刷电路板上，其一个实施例包括：具有顶表面11的电介质基板10，在该顶表面上限定了部件散热器的覆盖区周边P 以及布置在基板顶表面12上的两个或更多个散热器安装焊盘20.每个安装垫20包括布置在基板表面12上的第一部分21，其位于覆盖区周边P的外部，第二部分22布置在基板表面上 12在与第一部分21相邻的足迹周边P内。
-
公开(公告)号：US5901908A
公开(公告)日：1999-05-11
申请号：US757360
申请日：1996-11-27
CPC分类号： B05B7/0884 , B05B7/0483
摘要： A fluid spray nozzle that mixes a pressurized gaseous propellant and paint composition prior to being applied to a workpiece. The nozzle includes an upstream section for receiving the pressurized gaseous propellant. The nozzle directs the gaseous propellant and the fluid composition into a recirculation cavity. The gaseous propellant and fluid composition are received in a downstream section after mixing in the recirculation cavity. The recirculation cavity has lobes on opposite sides of a flow path defined in a region in the recirculation cavity between an inlet opening and the recirculation cavity. The recirculation cavity is formed by silicon micromachining the upstream section, fluid injection section, recirculation cavity and downstream section. The gaseous propellant may be accelerated to supersonic speeds prior to entering the recirculation cavity. The gaseous propellant and fluid composition are decelerated to subsonic speeds prior to exiting the downstream section, thereby resulting in the formation of a shock wave at the transition from supersonic to subsonic speeds which causes further atomization of the fluid composition.
摘要翻译： 流体喷嘴，其在施加到工件之前将加压的气体推进剂和涂料组合物混合。 喷嘴包括用于接收加压气体推进剂的上游部分。 喷嘴将气体推进剂和流体组合物引导到再循环腔中。 气体推进剂和流体组合物在再循环空腔中混合后被接收在下游部分中。 再循环腔在限定在再循环空腔中的入口开口和再循环腔之间的区域中的流路的相对侧上具有凸角。 再循环腔通过硅微加工上游部分，流体注入部分，再循环腔和下游部分形成。 在进入再循环空腔之前，气体推进剂可以被加速到超音速。 气体推进剂和流体组合物在离开下游段之前减速至亚音速，从而导致在从超音速到亚音速转变的过程中形成冲击波，这导致流体组合物的进一步雾化。
-
公开(公告)号：US07000969B2
公开(公告)日：2006-02-21
申请号：US10232761
申请日：2002-08-30
申请人： Jay DeAvis Baker , Myron Lemecha , Jin Zhou , Andrew Zachary Glovatsky , Richard Keith McMillan , Daniel Roger Vander Sluis
发明人： Jay DeAvis Baker , Myron Lemecha , Jin Zhou , Andrew Zachary Glovatsky , Richard Keith McMillan , Daniel Roger Vander Sluis
IPC分类号： B62D25/14
CPC分类号： B60K37/00 , B60H1/0055 , B60K2350/305 , B60K2350/401 , B62D25/142
摘要： An automobile instrument panel assembly may be used in the cockpit of an automobile. The assembly includes a cross-car structure having a plurality of recesses and protrusions along the length of the structure and a plurality of generally planar surfaces. A plurality of HVAC components are adapted to closely fit within one or more of the plurality of recesses within the structure, and at least one flatwire bus is affixed to the generally planar surfaces of the structure.
摘要翻译： 汽车仪表板组件可用于汽车驾驶舱。 组件包括具有沿着结构的长度的多个凹部和突起以及多个大致平坦的表面的十字交叉结构。 多个HVAC部件适于紧密地配合在结构内的多个凹槽中的一个或多个凹槽内，并且至少一个扁平线总线固定到该结构的大致平面的表面上。
-
公开(公告)号：US06601292B2
公开(公告)日：2003-08-05
申请号：US09891697
申请日：2001-06-26
IPC分类号： H05K300
CPC分类号： H05K3/361 , H05K1/0293 , H05K1/117 , H05K1/118 , H05K3/0052 , H05K3/225 , H05K2201/053 , H05K2201/09127 , H05K2201/09409 , H05K2201/09709 , H05K2201/0979 , H05K2203/0228 , H05K2203/175 , Y10T29/49124 , Y10T29/49169 , Y10T29/4973 , Y10T29/49732
摘要： A method for making and repairing connections between first and second circuits, such as flex circuits. An article 10 includes: a flexible dielectric substrate 12 having first and second edges 14/16, and a plurality of conductive circuit traces 18 arranged on or within the substrate, wherein each of the traces extends from proximate the first edge 14 to proximate the second edge 16. Each of the circuit traces 18 includes: a first connection feature 20 disposed proximate the first edge 14; a second connection feature 22 disposed proximate the second edge 16; and at least one third connection feature 24 disposed between the first and second edges 14/16. Each of the first, second, and third connection features 20/22/24 is a plated through hole, a plated blind via, or a mounting pad. This article 10 may be used to connect together the first and second circuits 50/60 using the first and second connection features 20/22, such as by soldering. If either of the two circuits needs to be subsequently detached (e.g., because of a component failure), the article 10 may be cut so as to present a set of third connection features 24 to which a new replacement circuit may be connected.
摘要翻译： 用于制造和修复第一和第二电路之间的连接的方法，例如柔性电路。 物品10包括：具有第一和第二边缘14/16的柔性电介质基底12和布置在基底上或内部的多个导电电路迹线18，其中每个迹线从靠近第一边缘14延伸到接近第二边缘14 每个电路迹线18包括：靠近第一边缘14设置的第一连接特征20; 设置在第二边缘16附近的第二连接特征22; 以及设置在第一和第二边缘14/16之间的至少一个第三连接特征24。 第一，第二和第三连接特征20/22/24中的每一个是电镀通孔，电镀盲孔或安装垫。 本文10可以用于使用第一和第二连接特征20/22（例如通过焊接）将第一和第二电路50/60连接在一起。 如果两个电路中的任一个需要随后分离（例如，由于部件故障），则可以切割物品10以便呈现一组第三连接特征24，新的替换电路可以连接到该组。
-
25.发明授权公开(公告)号：US06408811B1
公开(公告)日：2002-06-25
申请号：US09551371
申请日：2000-04-18
IPC分类号： F02P2300
CPC分类号： F02M35/10144 , F02D9/02 , F02D41/187 , F02D41/3005 , F02D2200/0404 , F02D2400/18 , F02D2400/21 , F02M35/10019 , F02M35/10026 , F02M35/10111 , F02M35/10249 , F02M35/10321 , F02M35/116 , F02M51/005 , F02M2200/24 , F02P3/02 , F05C2225/08 , G01F1/684 , H01R12/613 , H01R13/26 , H05K1/189
摘要： Conductors supported integrally with engine structure such as air intake manifolds and the like provide interconnection between engine components without the need for separate conventional wiring harnesses. The conductors take their mechanical strength from the underlying physical object and thus can be lighter than a freestanding harness. Connectors allow traces to continue across points of mechanical interface between structural components and allow wiring of engine components to be accomplished in the same operation as their physical assembly.
摘要翻译： 与诸如进气歧管等的发动机结构一体支撑的导体提供发动机部件之间的互连，而不需要单独的常规线束。 导体从底层的物体上获取机械强度，因此可以比独立的线束轻。 连接器允许迹线在结构部件之间的机械接口的点上继续，并允许发动机部件的接线在与其物理组件相同的操作中完成。
-
公开(公告)号：US06303992B1
公开(公告)日：2001-10-16
申请号：US09347542
申请日：1999-07-06
申请人： Cuong Van Pham , Frank Burke DiPiazza , Jay DeAvis Baker , Marc Alan Straub , Vivek Amir Jairazbhoy
发明人： Cuong Van Pham , Frank Burke DiPiazza , Jay DeAvis Baker , Marc Alan Straub , Vivek Amir Jairazbhoy
IPC分类号： H01L2348
CPC分类号： H01L23/473 , H01L2224/16225
摘要： An interposer 10 for electrically coupling a semiconductor die 50 to a substrate 70, comprising: an interposer body 12 made of a dielectric material and having a contact surface 14 and an opposed bonding surface 16; a plurality of contact pads 18 arranged about the periphery of the contact surface 14; a plurality of bonding pads 20 arranged across generally the entire area of the bonding surface 16; and a plurality of electrically conductive conduits 22 disposed generally within the interposer body, such that each conduit 22 connects a respective one of the contact pads 18 with a respective one of the bonding pads 20. The interposer 10 may also include: a sealed cooling channel 28 defined within the interposer body 12; a fluid medium 30 generally filling the cooling channel 28; and a piezoelectric element 26 attached to the interposer body such that the piezoelectric element communicates with the cooling channel 28 and the fluid medium 30, the piezoelectric element being operatively coupled to at least two of the electrically conductive conduits 22.
摘要翻译： 一种用于将半导体管芯50电耦合到衬底70的插入器10，包括：由介电材料制成并具有接触表面14和相对的接合表面16的插入体本体12; 布置在接触表面14周围的多个接触垫18; 布置在接合表面16的整个区域的多个接合焊盘20; 以及大体上设置在插入体内部的多个导电管道22，使得每个导管22将相应的一个接触焊盘18与相应的一个接合焊盘20连接。插入器10还可以包括：密封的冷却通道 28; 通常填充冷却通道28的流体介质30; 以及压电元件26，其连接到中介体，使得压电元件与冷却通道28和流体介质30连通，压电元件可操作地耦合到至少两个导电导管22。
-
27.发明授权Apparatus for storing and cooling electronic devices and/or modules in a vehicle 失效用于在车辆中存储和冷却电子设备和/或模块的装置
公开(公告)号：US5669813A
公开(公告)日：1997-09-23
申请号：US642725
申请日：1996-05-03
申请人： Vivek Amir Jairazbhoy , Prathap Amerwai Reddy , John Trublowski , Jay DeAvis Baker , Lawrence Leroy Kneisel
发明人： Vivek Amir Jairazbhoy , Prathap Amerwai Reddy , John Trublowski , Jay DeAvis Baker , Lawrence Leroy Kneisel
CPC分类号： B60H1/00271 , B60H2001/003 , B60H2001/00614
摘要： An apparatus for cooling electronic devices/modules in a vehicle comprises a main ventilation duct mounted in the vehicle, and includes a blower for forcing air through the main duct. A bypass duct is provided in selective fluid communication with the main ventilation duct, and is adapted to carry electronic devices/modules to be cooled by air forced through the bypass duct. Inlet and outlet valves are provided for selectively varying the amount of air which passes through the bypass duct. The electronic devices may be positioned outside of the bypass duct, or inside the bypass duct if sealed.
摘要翻译： 一种用于冷却车辆中的电子设备/模块的装置，包括安装在车辆中的主通风管道，并且包括用于迫使空气通过主管道的鼓风机。 提供与主通风管道选择性流体连通的旁通管道，并且适于携带被强制通过旁通管道的空气冷却的电子设备/模块。 提供入口和出口阀，用于选择性地改变通过旁路管道的空气量。 如果密封，电子设备可以位于旁路管道的外部，或旁路管道内部。
-
公开(公告)号：US06826829B2
公开(公告)日：2004-12-07
申请号：US10093153
申请日：2002-03-07
申请人： Cuong Van Pham , Jay DeAvis Baker , Mohan R. Paruchuri , Prathap Amervai Reddy , Vivek Amir Jairazbhoy
发明人： Cuong Van Pham , Jay DeAvis Baker , Mohan R. Paruchuri , Prathap Amervai Reddy , Vivek Amir Jairazbhoy
IPC分类号： H05K334
CPC分类号： H01L23/42 , H01L21/54 , H01L24/48 , H01L24/49 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/85399 , H01L2224/8592 , H01L2224/92247 , H01L2924/00014 , H01L2924/01057 , H01L2924/01068 , H01L2924/10253 , H01L2924/14 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49155 , Y10T29/49171 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A method for attaching an electronic die to a substrate is disclosed. Preferably, the method includes fixing the die to the substrate, interconnecting the electronic die to an at least one bonding pad on the substrate to form an electrical connection, coating the interconnects and the electronic die with an electrically insulating coating, and covering the electronic die with a low temperature melting metal. Thus, the method of the present invention improves the reliability of the electronic die.
摘要翻译： 公开了一种将电子管芯附接到基板的方法。 优选地，该方法包括将管芯固定到衬底上，将电子管芯与衬底上的至少一个焊盘相互连接以形成电连接，用电绝缘涂层涂覆互连件和电子管芯，并覆盖电子管芯 具有低温熔融金属。 因此，本发明的方法提高了电子管芯的可靠性。
-
29.发明授权公开(公告)号：US06271481B1
公开(公告)日：2001-08-07
申请号：US09146514
申请日：1998-09-03
IPC分类号： H01R909
CPC分类号： H05K1/111 , H05K3/062 , H05K3/205 , H05K3/4685 , H05K2201/0361 , H05K2201/0394 , H05K2201/09381 , H05K2203/0376 , Y02P70/611
摘要： There is disclosed herein a tri-metal-layer precircuit 50 which may be selectively etched to provide a multilayer electronic circuit 60 having air bridge crossovers 49. The enlarged ends 44 of the upper air bridge elements 42, and/or the top pads 41 of the tower elements 43, are specially designed such that undercutting of the ends 44 and/or top pads 41 is minimized, thereby minimizing the risk of air bridge/top pad delamination.
摘要翻译： 这里公开了三金属层预热电路50，其可以被选择性地蚀刻以提供具有空气桥接器49的多层电子电路60.上部空气桥接元件42的扩大端部44和/或上部空气桥接元件42的顶部焊盘41 塔元件43被特别设计成使端部44和/或顶部焊盘41的底切最小化，从而最小化空气桥/顶垫分层的风险。
-
公开(公告)号：US6152281A
公开(公告)日：2000-11-28
申请号：US149071
申请日：1998-09-04
CPC分类号： H05K13/028
摘要： There is disclosed herein an apparatus for bulk-feeding electronic components which utilizes magnetic force and a rotating feeder tube to properly orient the components for presentment to an automated pick-and-place machine. The apparatus comprises: (1) a generally straight tube 10 having a raised end 12, a lowered end 14, a longitudinal axis L--L, and a generally cylindrical interior passage 16 therethrough; (2) a generally straight bar magnet 20 arranged beneath and proximate the tube 10, wherein the bar magnet has a North pole-South pole axis N-S oriented generally parallel with the tube longitudinal axis L--L; (3) a receptacle 30 having first and second ends 32/34 and a tapered throat 36 running therethrough, wherein the throat extends from an enlarged inlet 38 defined in the first end to a constricted outlet 39 defined in the second end, the receptacle being disposed such that the inlet is elevated above the outlet, the second end 34 of the receptacle being disposed in rotatably slidable contact with the raised end 12 of the tube such that the constricted outlet 39 is placed in communication with the tube interior passage 16 thereat; and (4) a mechanism 40 for rotating the tube 10 about its longitudinal axis L--L.
摘要翻译： 这里公开了一种用于散装电子元件的装置，其利用磁力和旋转馈送管来将用于呈现的组件适当地定向到自动拾取和放置机器。 该装置包括：（1）具有升高端12，下降端14，纵向轴线L-L和通过其的大致圆柱形的内部通道16的大致直的管子10。 （2）布置在管10下方并靠近管10的大致直的棒状磁体20，其中，所述棒状磁体具有大致平行于管纵向轴线L-L的北极 - 南极轴线N-S; （3）具有第一和第二端部32/34以及从中穿过的锥形喉管36的容器30，其中喉部从限定在第一端的扩大的入口38延伸到限定在第二端的收缩出口39， 被设置为使得入口在出口上方升高，容器的第二端34设置成与管的升高端部12可旋转地滑动接触，使得收缩出口39与管内部通道16连通; 和（4）用于使管10围绕其纵向轴线L-L旋转的机构40。
-
-
-
-
-
-
-
-
-
搜索结果
33 条记录 (耗时 0.037 秒)