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公开(公告)号：US07545032B2
公开(公告)日：2009-06-09
申请号：US11456544
申请日：2006-07-10
IPC分类号： H01L23/48
CPC分类号： H01L21/565 , H01L23/16 , H01L23/3107 , H01L23/4334 , H01L23/49548 , H01L23/552 , H01L24/48 , H01L24/49 , H01L2224/32245 , H01L2224/45014 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided including forming a mounting structure having an external interconnect, a paddle, and a tie bar; mounting an integrated circuit die on the paddle; soldering a stiffener structure; having an opening; on the mounting structure; connecting the stiffener structure to a ground; and molding the integrated circuit die and partially the stiffener structure through the opening.
摘要翻译： 提供了一种集成电路封装系统，包括形成具有外部互连件，桨形件和连接杆的安装结构; 在桨上安装集成电路管芯; 焊接加强筋结构; 有开口 在安装结构上; 将加强筋结构连接到地面上; 并且通过开口模制集成电路模具并且部分地加强加强件结构。
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公开(公告)号：US20080142934A1
公开(公告)日：2008-06-19
申请号：US11610304
申请日：2006-12-13
IPC分类号： H01L23/495
CPC分类号： H01L23/49565 , H01L23/49541 , H01L24/48 , H01L24/97 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system includes an elevated edge leadframe array, isolating leadframes of the elevated edge leadframe array, validating integrated circuit die attached to the leadframes, and forming integrated circuit packages including the integrated circuit die.
摘要翻译： 集成电路封装系统包括升高的边缘引线框架阵列，隔离升高的边缘引线框阵列的引线框架，验证附接到引线框架的集成电路管芯，以及形成包括集成电路管芯的集成电路封装。
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公开(公告)号：US20110101524A1
公开(公告)日：2011-05-05
申请号：US12985559
申请日：2011-01-06
IPC分类号： H01L23/48
CPC分类号： H01L23/5389 , H01L21/565 , H01L21/6835 , H01L23/3128 , H01L23/49827 , H01L24/19 , H01L24/24 , H01L25/105 , H01L25/50 , H01L2224/24226 , H01L2224/73267 , H01L2224/82005 , H01L2224/82031 , H01L2224/82039 , H01L2224/92244 , H01L2224/96 , H01L2225/1035 , H01L2225/1058 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12041 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/00
摘要： A semiconductor device includes a semiconductor die having contact pads disposed over a surface of the semiconductor die, a die attach adhesive layer disposed under the semiconductor die, and an encapsulant material disposed around and over the semiconductor die. The semiconductor device further includes bumps disposed in the encapsulant material around a perimeter of the semiconductor die. The bumps are partially enclosed by the encapsulant material. The semiconductor device further comprises first vias disposed in the encapsulant. The first vias expose surfaces of the contact pads. The semiconductor device further includes a first redistribution layer (RDL) disposed over the encapsulant and in the first vias, and a second RDL disposed under the encapsulant material and the die attach adhesive layer. The first RDL electrically connects each contact pad of the semiconductor die to one of the bumps, and the second RDL is electrically connected to one of the bumps.
摘要翻译： 半导体器件包括具有设置在半导体管芯的表面上的接触焊盘的半导体管芯，设置在半导体管芯下方的管芯附着粘合剂层，以及设置在半导体管芯周围和上方的密封材料。 半导体器件还包括围绕半导体管芯的周边设置在密封剂材料中的凸块。 凸起部分被密封剂材料封闭。 半导体器件还包括设置在密封剂中的第一通孔。 第一个通孔暴露接触垫的表面。 半导体器件还包括设置在密封剂和第一通孔中的第一再分配层（RDL），以及设置在密封剂材料下方的第二RDL和管芯附着粘合剂层。 第一RDL将半导体管芯的每个接触焊盘电连接到凸块中的一个，并且第二RDL电连接到凸块之一。
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24.发明授权Method of forming a wafer level package with RDL interconnection over encapsulant between bump and semiconductor die 有权在凸块和半导体管芯之间的密封剂上形成具有RDL互连的晶片级封装的方法公开(公告)号：US07888181B2
公开(公告)日：2011-02-15
申请号：US12235000
申请日：2008-09-22
CPC分类号： H01L23/5389 , H01L21/565 , H01L21/6835 , H01L23/3128 , H01L23/49827 , H01L24/19 , H01L24/24 , H01L25/105 , H01L25/50 , H01L2224/24226 , H01L2224/73267 , H01L2224/82005 , H01L2224/82031 , H01L2224/82039 , H01L2224/92244 , H01L2224/96 , H01L2225/1035 , H01L2225/1058 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12041 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/00
摘要： A semiconductor device is made by providing a metal substrate for supporting the semiconductor device. Solder bumps are connected to the substrate. In one embodiment, a conductive material is deposited over the substrate and is reflowed to form the solder bumps. A semiconductor die is mounted to the substrate using a die attach adhesive. The semiconductor die has a plurality of contact pads formed over a surface of the semiconductor die. An encapsulant material is deposited over the solder bumps and the semiconductor die. The encapsulant is etched to expose the contact pads of the semiconductor die. A first redistribution layer (RDL) is formed over the encapsulant to connect each contact pad of the semiconductor die to one of the solder bumps. The substrate is removed to expose the die attach adhesive and a bottom surface of the solder bumps.
摘要翻译： 通过设置用于支撑半导体器件的金属基板来制造半导体器件。 焊接凸块连接到基板。 在一个实施例中，导电材料沉积在衬底上并被回流以形成焊料凸块。 使用芯片附着粘合剂将半导体管芯安装到基板上。 半导体管芯具有形成在半导体管芯的表面上的多个接触焊盘。 在焊料凸块和半导体管芯上沉积密封材料。 蚀刻密封剂以暴露半导体管芯的接触焊盘。 第一再分配层（RDL）形成在密封剂上方以将半导体管芯的每个接触焊盘连接到焊料凸块之一。 去除衬底以暴露芯片附着粘合剂和焊料凸块的底表面。
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公开(公告)号：US20070170559A1
公开(公告)日：2007-07-26
申请号：US11307128
申请日：2006-01-24
IPC分类号： H01L23/495
CPC分类号： H01L23/4951 , H01L23/49548 , H01L24/81 , H01L2224/16 , H01L2224/16237 , H01L2224/16245 , H01L2224/81136 , H01L2224/8114 , H01L2224/81385 , H01L2224/81801 , H01L2924/0105 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： An integrated circuit package system is provided forming a lead finger from a padless lead frame, forming a lead tip hole in the lead finger, mounting an integrated circuit die having a solder bump on the lead finger, and reflowing the solder bump on the lead tip hole of the lead finger.
摘要翻译： 提供一种集成电路封装系统，从无铅引线框架形成引线指，在引线指中形成引线尖端孔，将具有焊料凸点的集成电路芯片安装在引线指状物上，并将引线尖端上的焊料凸点回流 导针的孔。
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公开(公告)号：US08633578B2
公开(公告)日：2014-01-21
申请号：US13196279
申请日：2011-08-02
IPC分类号： H01L23/02
CPC分类号： H01L23/3128 , H01L22/32 , H01L23/3135 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/03 , H01L2224/05553 , H01L2224/05554 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48225 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2225/06565 , H01L2924/00014 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/32145 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system with laminate base includes: a base package including: a laminate substrate strip, an integrated circuit on the laminate substrate strip, a molded cover over the integrated circuit and the laminate substrate strip, and a strip test of the base package; a bare die on the base package; the bare die electrically connected to the laminate substrate strip; and the bare die and the base package encapsulated.
摘要翻译： 一种具有层压基座的集成电路封装系统，包括：基座封装，包括：叠层基板条，叠层基板条上的集成电路，集成电路上的模制盖和叠层基板条，以及基板封装 ; 在基础包上裸露的裸片; 所述裸模与所述层叠基板条电连接; 并封装了裸芯片和基底封装。
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公开(公告)号：US20080017960A1
公开(公告)日：2008-01-24
申请号：US11459325
申请日：2006-07-21
IPC分类号： H01L23/02
CPC分类号： H01L23/3128 , H01L22/32 , H01L23/3135 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/03 , H01L2224/05553 , H01L2224/05554 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48225 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2225/06565 , H01L2924/00014 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/32145 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system with laminate base is provided including forming a base package including, forming a laminate substrate strip, mounting an integrated circuit on the laminate substrate strip, forming a molded cover over the integrated circuit and the laminate substrate strip, and performing a strip test of the base package; attaching a bare die to the base package; connecting electrically the bare die to the laminate substrate strip; and encapsulating the bare die and the base package.
摘要翻译： 提供了一种具有层叠基底的集成电路封装系统，包括形成基底封装，包括形成层压衬底条，将集成电路安装在层叠衬底条上，在集成电路和叠层衬底条上形成模制盖， 基础包装的剥离试验; 将裸模附接到基底包装; 将裸模电连接到层压基板条上; 并封装裸芯片和基底封装。
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公开(公告)号：US09129971B2
公开(公告)日：2015-09-08
申请号：US12985559
申请日：2011-01-06
IPC分类号： H01L23/31 , H01L23/48 , H01L23/538 , H01L21/683 , H01L23/498 , H01L23/00 , H01L25/10 , H01L25/00 , H01L21/56
CPC分类号： H01L23/5389 , H01L21/565 , H01L21/6835 , H01L23/3128 , H01L23/49827 , H01L24/19 , H01L24/24 , H01L25/105 , H01L25/50 , H01L2224/24226 , H01L2224/73267 , H01L2224/82005 , H01L2224/82031 , H01L2224/82039 , H01L2224/92244 , H01L2224/96 , H01L2225/1035 , H01L2225/1058 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12041 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/00
摘要： A semiconductor device includes a semiconductor die having contact pads disposed over a surface of the semiconductor die, a die attach adhesive layer disposed under the semiconductor die, and an encapsulant material disposed around and over the semiconductor die. The semiconductor device further includes bumps disposed in the encapsulant material around a perimeter of the semiconductor die. The bumps are partially enclosed by the encapsulant material. The semiconductor device further comprises first vias disposed in the encapsulant. The first vias expose surfaces of the contact pads. The semiconductor device further includes a first redistribution layer (RDL) disposed over the encapsulant and in the first vias, and a second RDL disposed under the encapsulant material and the die attach adhesive layer. The first RDL electrically connects each contact pad of the semiconductor die to one of the bumps, and the second RDL is electrically connected to one of the bumps.
摘要翻译： 半导体器件包括具有设置在半导体管芯的表面上的接触焊盘的半导体管芯，设置在半导体管芯下方的管芯附着粘合剂层，以及设置在半导体管芯周围和上方的密封材料。 半导体器件还包括围绕半导体管芯的周边设置在密封剂材料中的凸块。 凸起部分被密封剂材料封闭。 半导体器件还包括设置在密封剂中的第一通孔。 第一个通孔暴露接触垫的表面。 半导体器件还包括设置在密封剂和第一通孔中的第一再分配层（RDL），以及设置在密封剂材料下方的第二RDL和管芯附着粘合剂层。 第一RDL将半导体管芯的每个接触焊盘电连接到凸块中的一个，并且第二RDL电连接到凸块之一。
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公开(公告)号：US07977579B2
公开(公告)日：2011-07-12
申请号：US11278070
申请日：2006-03-30
IPC分类号： H05K1/16
CPC分类号： H05K1/183 , H01L23/13 , H01L23/3128 , H01L23/36 , H01L23/4334 , H01L23/49822 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/16 , H01L2224/16225 , H01L2224/97 , H01L2225/06517 , H01L2225/06589 , H01L2924/01033 , H01L2924/01082 , H01L2924/07802 , H01L2924/14 , H01L2924/15153 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H05K1/141 , H05K3/3436 , H05K2201/09845 , H05K2201/10515 , H05K2201/10674 , H05K2201/10689 , Y10T29/4913 , H01L2224/81 , H01L2224/83 , H01L2924/00
摘要： An integrated circuit package system includes forming a multi-tier substrate, and attaching a plurality of integrated circuits on the multi-tier substrate.
摘要翻译： 一种集成电路封装系统，包括形成多层衬底，以及在多层衬底上附着多个集成电路。
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30.发明申请Semiconductor Device and Method of Forming a Wafer Level Package with Bump Interconnection 有权半导体器件和形成具有凹凸互连的晶片级封装的方法公开(公告)号：US20100072618A1
公开(公告)日：2010-03-25
申请号：US12235000
申请日：2008-09-22
CPC分类号： H01L23/5389 , H01L21/565 , H01L21/6835 , H01L23/3128 , H01L23/49827 , H01L24/19 , H01L24/24 , H01L25/105 , H01L25/50 , H01L2224/24226 , H01L2224/73267 , H01L2224/82005 , H01L2224/82031 , H01L2224/82039 , H01L2224/92244 , H01L2224/96 , H01L2225/1035 , H01L2225/1058 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12041 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/00
摘要： A semiconductor device is made by providing a metal substrate for supporting the semiconductor device. Solder bumps are connected to the substrate. In one embodiment, a conductive material is deposited over the substrate and is reflowed to form the solder bumps. A semiconductor die is mounted to the substrate using a die attach adhesive. The semiconductor die has a plurality of contact pads formed over a surface of the semiconductor die. An encapsulant material is deposited over the solder bumps and the semiconductor die. The encapsulant is etched to expose the contact pads of the semiconductor die. A first redistribution layer (RDL) is formed over the encapsulant to connect each contact pad of the semiconductor die to one of the solder bumps. The substrate is removed to expose the die attach adhesive and a bottom surface of the solder bumps.
摘要翻译： 通过设置用于支撑半导体器件的金属基板来制造半导体器件。 焊接凸块连接到基板。 在一个实施例中，导电材料沉积在衬底上并被回流以形成焊料凸块。 使用芯片附着粘合剂将半导体管芯安装到基板上。 半导体管芯具有形成在半导体管芯的表面上的多个接触焊盘。 在焊料凸块和半导体管芯上沉积密封材料。 蚀刻密封剂以暴露半导体管芯的接触焊盘。 第一再分配层（RDL）形成在密封剂上方以将半导体管芯的每个接触焊盘连接到焊料凸块之一。 去除衬底以暴露芯片附着粘合剂和焊料凸块的底表面。
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