-
21.发明授权公开(公告)号：US07589403B2
公开(公告)日：2009-09-15
申请号：US11927239
申请日：2007-10-29
IPC分类号： H01L23/495
CPC分类号： H01L23/49513 , H01L23/3107 , H01L23/3142 , H01L23/49586 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/2929 , H01L2224/29393 , H01L2224/29499 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2224/73265 , H01L2224/83136 , H01L2224/83192 , H01L2224/838 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01056 , H01L2924/01078 , H01L2924/01082 , H01L2924/078 , H01L2924/14 , H01L2924/181 , H01L2924/18301 , Y10S977/938 , H01L2924/00012 , H01L2224/48227 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A lead structure for a semiconductor component includes: external leads for external connections outside a plastic housing composition, internal leads for electrical connections within the plastic housing composition, and a chip mounting island composed of the lead material. While leaving free contact pads of the internal leads, the top sides of the chip mounting island and the internal leads are equipped with nanotubes as an anchoring layer. The plastic housing composition is arranged in the interspaces between the nanotubes arranged on the internal leads, while an adhesive composition for the semiconductor chip is arranged in the interspaces between the nanotubes arranged on the chip mounting island. The adhesive composition and the plastic housing composition fill the interspaces in a manner free of voids.
摘要翻译： 用于半导体部件的引线结构包括：用于在塑料外壳组合物外部的外部连接的外部引线，用于塑料外壳组合物内的电连接的内部引线以及由引线材料构成的芯片安装岛。 在离开内部引线的自由接触垫的同时，芯片安装岛的顶侧和内部引线配备有作为锚定层的纳米管。 塑料外壳组合物布置在布置在内部引线上的纳米管之间的间隙中，而用于半导体芯片的粘合剂组合物布置在布置在芯片安装岛上的纳米管之间的间隙中。 粘合剂组合物和塑料外壳组合物以无空隙的方式填充空隙。
-
22.发明申请Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same 有权具有半导体芯片和电路载体之间的导体轨迹的半导体器件及其制造方法公开(公告)号：US20070034997A1
公开(公告)日：2007-02-15
申请号：US11498253
申请日：2006-08-03
IPC分类号： H01L23/495 , H01L21/00
CPC分类号： H01L24/83 , H01L23/49524 , H01L23/49816 , H01L24/24 , H01L24/25 , H01L24/32 , H01L24/82 , H01L2224/24051 , H01L2224/24225 , H01L2224/24226 , H01L2224/24245 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/82039 , H01L2224/82103 , H01L2224/838 , H01L2224/92 , H01L2224/92244 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0781 , H01L2924/12044 , H01L2924/15311 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2224/83 , H01L2224/82 , H01L2924/3512 , H01L2924/00 , H01L2924/00012
摘要： The invention relates to a semiconductor device with conductor tracks between a semiconductor chip and a circuit carrier, and to a method for producing the same. The conductor tracks extend from contact areas on the top side of the semiconductor chip to contact pads on the circuit carrier. The conductor tracks include an electrically conductive polymer in the semiconductor device.
摘要翻译： 本发明涉及一种在半导体芯片和电路载体之间具有导体轨迹的半导体器件及其制造方法。 导体轨道从半导体芯片的顶侧的接触区域延伸到电路载体上的接触焊盘。 导体轨迹包括半导体器件中的导电聚合物。
-
公开(公告)号：US08440733B2
公开(公告)日：2013-05-14
申请号：US13461202
申请日：2012-05-01
IPC分类号： C08J9/00
CPC分类号： H01L23/49894 , H01L21/56 , H01L23/293 , H01L23/3142 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/00014 , H01L2924/01019 , H01L2924/01068 , H01L2924/01078 , H01L2924/12044 , H01L2924/181 , H01L2924/19041 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Semiconductor component and method for production of a semiconductor component. The invention relates to a semiconductor component having a semiconductor chip, which is arranged on a substrate, in one embodiment on a chip carrier, and an encapsulation material, which at least partially surrounds the semiconductor chip. The chip carrier is at least partly provided with a layer of polymer foam.
摘要翻译： 半导体元件的制造方法及半导体元件的制造方法。 本发明涉及一种具有半导体芯片的半导体元件，该半导体元件布置在基板上，在一个实施例中在芯片载体上，以及至少部分地围绕半导体芯片的封装材料。 芯片载体至少部分地设置有聚合物泡沫层。
-
24.发明授权Method of joining a thermoplastic material to a thermoset material, and thermoplastic-thermoset composite 有权将热塑性材料接合到热固性材料和热塑性热固性复合材料的方法公开(公告)号：US07645642B2
公开(公告)日：2010-01-12
申请号：US11348542
申请日：2006-02-07
IPC分类号： H01L21/00 , H01B1/24 , H01B1/06 , C08F290/14
CPC分类号： C08J5/121 , B29C65/3412 , B29C65/3484 , B29C66/54 , B29C66/71 , B29C66/731 , B29C66/73113 , B29C66/7315 , B29C66/7392 , B29C66/7394 , B29C66/91411 , B29C66/919 , B29K2063/00 , B29K2067/00 , B29K2071/00 , B29K2081/06 , B29K2083/00 , B29K2101/10 , B29K2101/12 , B29K2105/0079 , B29K2105/16 , B29K2309/08 , B29L2031/3061 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2924/00014 , H01L2924/00 , B29K2067/003 , B29K2081/04
摘要： A method of joining a thermoplastic material to a thermoset material, and a resultant thermoplastic-thermoset composite formed from such method are provided. At least one of the thermoplastic material and the thermoset material includes particles that melt when the thermoplastic material and the thermoset material are heated during the joining operation. The particles further produce a solid bond between the materials after the particles have solidified in the course of cooling after the joining operation.
摘要翻译： 提供了一种将热塑性材料接合到热固性材料的方法，以及由这种方法形成的所得的热塑性热固性复合材料。 热塑性材料和热固性材料中的至少一种包括当在接合操作期间热塑性材料和热固性材料被加热时熔化的颗粒。 颗粒在接合操作后的冷却过程中固化后，颗粒进一步在材料之间产生固态结合。
-
25.发明授权Sensor component with a cavity housing and a sensor chip and method for producing the same 有权具有腔体的传感器部件和传感器芯片及其制造方法公开(公告)号：US07464603B2
公开(公告)日：2008-12-16
申请号：US11867117
申请日：2007-10-04
IPC分类号： H01L23/02
CPC分类号： G01L19/0069 , G01L19/146 , G01L19/147 , H01L23/49877 , H01L23/5389 , H01L31/0203 , H01L2224/16245 , H01L2924/01012 , H01L2924/01077 , H01L2924/01078 , H05K1/0373 , H05K1/185 , H05K3/105 , H05K3/185 , H05K2201/0133 , H05K2201/0236 , H05K2203/107
摘要： A semiconductor sensor component including a housing with a cavity and a sensor chip and a method for producing the same are described herein. The housing includes an opening to the surroundings of the housing and the sensor chip includes a sensor region which faces the opening. The sensor chip is embedded in the cavity of the housing into a rubber-elastic layer with its rear side and its edge sides, where the rubber-elastic layer includes cleavable included organometallic or inorganic metallic complexes. The metals of the complexes lie in a freely accessible manner on the top side of the rubber-elastic layer and form metallic nuclei for wiring lines which electrically connect the sensor region of the sensor chip to contact pads in the cavity of the cavity housing.
摘要翻译： 这里描述了包括具有空腔的壳体和传感器芯片的半导体传感器部件及其制造方法。 壳体包括到壳体的周围的开口，并且传感器芯片包括面向开口的传感器区域。 传感器芯片嵌入壳体的空腔中，其背面和边缘侧面为橡胶弹性层，其中橡胶弹性层包括可切割的有机金属或无机金属络合物。 复合物的金属在橡胶弹性层的顶侧可自由接近的方式形成金属核，用于将传感器芯片的传感器区域与腔室的空腔中的接触垫电连接的布线。
-
26.发明授权Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same 有权具有半导体芯片和电路载体之间的导体轨迹的半导体器件及其制造方法公开(公告)号：US07443019B2
公开(公告)日：2008-10-28
申请号：US11498253
申请日：2006-08-03
CPC分类号： H01L24/83 , H01L23/49524 , H01L23/49816 , H01L24/24 , H01L24/25 , H01L24/32 , H01L24/82 , H01L2224/24051 , H01L2224/24225 , H01L2224/24226 , H01L2224/24245 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/82039 , H01L2224/82103 , H01L2224/838 , H01L2224/92 , H01L2224/92244 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0781 , H01L2924/12044 , H01L2924/15311 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2224/83 , H01L2224/82 , H01L2924/3512 , H01L2924/00 , H01L2924/00012
摘要： The invention relates to a semiconductor device with conductor tracks between a semiconductor chip and a circuit carrier, and to a method for producing the same. The conductor tracks extend from contact areas on the top side of the semiconductor chip to contact pads on the circuit carrier. The conductor tracks include an electrically conductive polymer in the semiconductor device.
摘要翻译： 本发明涉及一种在半导体芯片和电路载体之间具有导体轨迹的半导体器件及其制造方法。 导体轨道从半导体芯片的顶侧的接触区域延伸到电路载体上的接触焊盘。 导体轨迹包括半导体器件中的导电聚合物。
-
27.发明申请Semiconductor Chip Comprising A Metal Coating Structure And Associated Production Method 有权包括金属涂层结构和相关生产方法的半导体芯片公开(公告)号：US20070228567A1
公开(公告)日：2007-10-04
申请号：US11692530
申请日：2007-03-28
IPC分类号： H01L23/48
CPC分类号： H01L24/12 , H01L23/3142 , H01L23/53238 , H01L24/05 , H01L24/11 , H01L2224/0401 , H01L2224/05017 , H01L2224/05557 , H01L2224/05562 , H01L2224/05664 , H01L2224/1147 , H01L2224/13099 , H01L2224/45124 , H01L2224/48764 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01068 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/05042 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/48 , H01L2224/05552
摘要： A semiconductor chip (1) has a metal coating structure (2) which has on an active upper side (3) of the semiconductor chip (1) at least one lower metal layer (8) with copper or copper alloy, on which a central metal layer (9) with nickel is arranged. The metal coating structure (2) is terminated by an upper metal layer (10) of palladium and/or a precious metal. The central metal layer (9) with nickel and/or nickel phosphide has a rough interface (11) with respect to the plastic package molding compound surrounding the metal coating structure (2).
摘要翻译： 半导体芯片（1）具有在半导体芯片（1）的有源上侧（3）上具有至少一个具有铜或铜合金的下金属层（8）的金属涂层结构（2），在其上具有中心 配置有镍的金属层（9）。 金属涂层结构（2）由钯和/或贵金属的上金属层（10）封端。 具有镍和/或镍磷化物的中心金属层（9）相对于围绕金属涂层结构（2）的塑料封装模塑料具有粗糙界面（11）。
-
28.发明申请Semiconductor component including semiconductor chip and method for producing the same 有权包括半导体芯片的半导体元件及其制造方法公开(公告)号：US20070145552A1
公开(公告)日：2007-06-28
申请号：US11598203
申请日：2006-11-13
IPC分类号： H01L23/02
CPC分类号： H01L23/4334 , H01L23/42 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01046 , H01L2924/01068 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor component includes at least one semiconductor chip arranged on a mounting substrate and connected thereto via bonding wires. For effective dissipation of heat, a solderable interlayer is arranged on the active upper side of the semiconductor chip and a heat sink is soldered onto the solderable interlayer. A method is also described for producing a semiconductor component with a solderable interlayer disposed on an active upper side of a semiconductor chip and with a heat sink soldered to the solderable interlayer.
摘要翻译： 半导体部件包括布置在安装基板上并通过接合线与其连接的至少一个半导体芯片。 为了有效散热，在半导体芯片的有源上侧设置可焊接中间层，将散热器焊接到可焊接中间层上。 还描述了一种用于制造具有可焊接中间层的半导体部件的方法，其设置在半导体芯片的有源上侧上并且将散热器焊接到可焊接中间层。
-
29.发明授权Semiconductor component having a stack of semiconductor chips and method for producing the same 有权具有半导体芯片堆叠的半导体元件及其制造方法公开(公告)号：US08354299B2
公开(公告)日：2013-01-15
申请号：US10598143
申请日：2005-02-09
申请人： Michael Bauer , Thomas Engling , Alfred Haimerl , Angela Kessler , Joachim Mahler , Wolfgang Schober
发明人： Michael Bauer , Thomas Engling , Alfred Haimerl , Angela Kessler , Joachim Mahler , Wolfgang Schober
IPC分类号： H01L21/44
CPC分类号： H01L23/538 , H01L24/24 , H01L24/25 , H01L24/82 , H01L25/0657 , H01L2224/24051 , H01L2224/24145 , H01L2224/24146 , H01L2225/06524 , H01L2225/06527 , H01L2225/06551 , H01L2225/06555 , H01L2924/01032 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A semiconductor component including a stack of semiconductor chips, the semiconductor chips being fixed cohesively one on top of another, is disclosed. The contact areas of the semiconductor chips are led as far as the edges of the semiconductor chips and conductor portions extend at least from an upper edge to a lower edge of the edge sides of the semiconductor chips in order to electrically connect the contact area of the stacked semiconductor chips to one another.
摘要翻译： 公开了一种包括半导体芯片的堆叠的半导体部件，半导体芯片一体地固定在另一个之上。 半导体芯片的接触区域被引导直到半导体芯片和导体部分的边缘至少从半导体芯片的边缘侧的上边缘延伸到下边缘，以便电连接半导体芯片的接触区域 堆叠的半导体芯片彼此。
-
公开(公告)号：US08178390B2
公开(公告)日：2012-05-15
申请号：US11817520
申请日：2006-02-20
IPC分类号： H01L21/00
CPC分类号： H01L23/49894 , H01L21/56 , H01L23/293 , H01L23/3142 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/00014 , H01L2924/01019 , H01L2924/01068 , H01L2924/01078 , H01L2924/12044 , H01L2924/181 , H01L2924/19041 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor component is disclosed. In one embodiment, the semiconductor component includes a semiconductor chip, which is arranged on a substrate, and a housing, which at least partially surrounds the semiconductor chip. The substrate is at least partly provided with a layer of polymer foam.
摘要翻译： 公开了半导体部件。 在一个实施例中，半导体部件包括布置在基板上的半导体芯片和至少部分地围绕半导体芯片的壳体。 衬底至少部分地设置有聚合物泡沫层。
-
-
-
-
-
-
-
-
-
搜索结果
50 条记录 (耗时 0.025 秒)
