公开(公告)号：US06919641B2

公开(公告)日：2005-07-19

申请号：US10462744

申请日：2003-06-17

申请人： Kazutoshi Onozawa ,  Tetsuzo Ueda ,  Daisuke Ueda

发明人： Kazutoshi Onozawa ,  Tetsuzo Ueda ,  Daisuke Ueda

IPC分类号： H01S5/022 ,  H01L25/075 ,  H01S5/02 ,  H01S5/40 ,  H01L23/52

CPC分类号： H01L24/95 ,  H01L25/0753 ,  H01L2224/95085 ,  H01L2224/95146 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/10329 ,  H01L2924/10349 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15165 ,  H01S5/02252 ,  H01S5/4031 ,  H01L2924/15153 ,  H01L2924/00

摘要： A semiconductor device includes: a substrate having in its principal surface first and second recessed portions formed adjacent to each other; and first and second semiconductor laser chips each having a portion that is inserted in one of the recessed portions. The depth of the recessed portions is smaller than the height of the first and second semiconductor laser chips that are disposed in the recessed portions.

摘要翻译： 半导体器件包括：基板，其主表面具有彼此相邻形成的第一和第二凹部; 以及第一和第二半导体激光器芯片，每个半导体激光器芯片具有插入到一个凹部中的一部分。 凹部的深度小于设置在凹部中的第一和第二半导体激光器芯片的高度。

公开(公告)号：US08872227B2

公开(公告)日：2014-10-28

申请号：US13402631

申请日：2012-02-22

申请人： Hidekazu Umeda ,  Yoshiharu Anda ,  Tetsuzo Ueda ,  Tsuyoshi Tanaka ,  Daisuke Ueda

发明人： Hidekazu Umeda ,  Yoshiharu Anda ,  Tetsuzo Ueda ,  Tsuyoshi Tanaka ,  Daisuke Ueda

IPC分类号： H01L29/66 ,  H01L29/778 ,  H01L29/417 ,  H01L29/20

CPC分类号： H01L29/2003 ,  H01L29/1066 ,  H01L29/4175 ,  H01L29/66462 ,  H01L29/7787 ,  H01L29/861

摘要： A nitride semiconductor device includes a semiconductor substrate, and a nitride semiconductor layer formed on the semiconductor substrate. The semiconductor substrate includes a normal region and an interface current block region surrounding the normal region. The nitride semiconductor layer includes an element region and an isolation region surrounding the element region. The element region is formed over the normal region. The interface current block region contains impurities, and forms a potential barrier against carriers generated at an interface between the nitride semiconductor layer and the semiconductor substrate.

摘要翻译： 氮化物半导体器件包括半导体衬底和形成在半导体衬底上的氮化物半导体层。 半导体衬底包括正常区域和围绕法线区域的界面电流阻挡区域。 氮化物半导体层包括元件区域和围绕元件区域的隔离区域。 元件区域形成在正常区域上。 界面电流阻挡区域含有杂质，并且在氮化物半导体层和半导体衬底之间的界面处产生的载流子形成势垒。

公开(公告)号：US08742467B2

公开(公告)日：2014-06-03

申请号：US13613724

申请日：2012-09-13

申请人： Tatsuo Morita ,  Daisuke Ueda ,  Yasuhiro Uemoto ,  Tetsuzo Ueda

发明人： Tatsuo Morita ,  Daisuke Ueda ,  Yasuhiro Uemoto ,  Tetsuzo Ueda

IPC分类号： H01L29/772 ,  H01L29/778

CPC分类号： H01L29/7787 ,  H01L27/0605 ,  H01L29/1066 ,  H01L29/2003

摘要： A bidirectional switching device includes a semiconductor multilayer structure made of a nitride semiconductor, a first ohmic electrode and a second ohmic electrode which are formed on the semiconductor multilayer structure, and a first gate electrode and a second gate electrode. The first gate electrode is covered with a first shield electrode having a potential substantially equal to that of the first ohmic electrode. The second gate electrode is covered with the second shield electrode having a potential substantially equal to that of the second ohmic electrode. An end of the first shield electrode is positioned between the first gate electrode and the second gate electrode, and an end of the second shield electrode is positioned between the second gate electrode and the first gate electrode.

摘要翻译： 双向开关器件包括由半导体多层结构上形成的由氮化物半导体，第一欧姆电极和第二欧姆电极构成的半导体多层结构以及第一栅电极和第二栅电极。 第一栅电极被第一屏蔽电极覆盖，该第一屏蔽电极的电位基本上等于第一欧姆电极的电位。 第二栅电极被第二屏蔽电极覆盖，其电位基本上等于第二欧姆电极的电位。 第一屏蔽电极的端部位于第一栅极电极和第二栅极电极之间，第二屏蔽电极的端部位于第二栅极电极和第一栅极电极之间。

公开(公告)号：US08344423B2

公开(公告)日：2013-01-01

申请号：US13360275

申请日：2012-01-27

申请人： Yasuhiro Uemoto ,  Masahiro Hikita ,  Tetsuzo Ueda ,  Tsuyoshi Tanaka ,  Daisuke Ueda

发明人： Yasuhiro Uemoto ,  Masahiro Hikita ,  Tetsuzo Ueda ,  Tsuyoshi Tanaka ,  Daisuke Ueda

IPC分类号： H01L29/66

CPC分类号： H01L29/7786 ,  H01L29/1066 ,  H01L29/2003 ,  H01L29/4175 ,  H01L29/7783

摘要： A nitride semiconductor device includes: a first nitride semiconductor layer; a second nitride semiconductor layer formed on the first nitride semiconductor layer and having a wider band gap than the first nitride semiconductor layer; and a third nitride semiconductor layer formed on the second nitride semiconductor layer. A region of the third nitride semiconductor layer located below the gate electrode is formed with a control region having a p-type conductivity, and a region of the third nitride semiconductor layer located between the gate electrode and each of the source electrode and the drain electrode is formed with a high resistive region having a higher resistance than the that of the control region.

摘要翻译： 氮化物半导体器件包括：第一氮化物半导体层; 形成在所述第一氮化物半导体层上并且具有比所述第一氮化物半导体层更宽的带隙的第二氮化物半导体层; 以及形成在所述第二氮化物半导体层上的第三氮化物半导体层。 位于栅电极下方的第三氮化物半导体层的区域形成有具有p型导电性的控制区域，以及位于栅电极与源电极和漏极之间的第三氮化物半导体层的区域 形成有具有比控制区域更高的电阻的高电阻区域。

公开(公告)号：US07873090B2

公开(公告)日：2011-01-18

申请号：US11519973

申请日：2006-09-13

申请人： Toshikazu Onishi ,  Tetsuzo Ueda ,  Daisuke Ueda

发明人： Toshikazu Onishi ,  Tetsuzo Ueda ,  Daisuke Ueda

IPC分类号： H01S5/068 ,  H01S5/183 ,  H01S5/02 ,  H01S5/42

CPC分类号： H01S5/18355 ,  B82Y20/00 ,  H01L31/035281 ,  H01L31/105 ,  H01S5/02284 ,  H01S5/0425 ,  H01S5/18311 ,  H01S5/18319 ,  H01S5/18344 ,  H01S5/18358 ,  H01S5/18386 ,  H01S5/3432 ,  H01S5/423 ,  Y02E10/50

摘要： A surface emitting laser includes a plurality of light-emitting portions for emitting laser light beams in different linearly polarized light directions. The light-emitting portions are formed on the substrate and located close to each other. The light-emitting portions include metal opening arrays through which light beams in different linearly polarized light directions respectively pass.

摘要翻译： 表面发射激光器包括用于在不同的线偏振光方向上发射激光束的多个发光部分。 发光部分形成在基板上并且彼此靠近。 发光部分包括分别通过不同线偏振光方向的光束的金属开口阵列。

公开(公告)号：US07656010B2

公开(公告)日：2010-02-02

申请号：US11898958

申请日：2007-09-18

申请人： Tomohiro Murata ,  Hiroaki Ueno ,  Hidetoshi Ishida ,  Tetsuzo Ueda ,  Yasuhiro Uemoto ,  Tsuyoshi Tanaka ,  Daisuke Ueda

发明人： Tomohiro Murata ,  Hiroaki Ueno ,  Hidetoshi Ishida ,  Tetsuzo Ueda ,  Yasuhiro Uemoto ,  Tsuyoshi Tanaka ,  Daisuke Ueda

IPC分类号： H01L23/58

CPC分类号： H01L29/7787 ,  H01L23/367 ,  H01L23/3677 ,  H01L29/2003 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device includes: a semiconductor layer; at least one electrode formed on a semiconductor layer to be in contact with the semiconductor layer; and a passivation film covering the semiconductor layer and at least part of the top surface of the electrode to protect the semiconductor layer and formed of a plurality of sub-films. The passivation film includes a first sub-film made of aluminum nitride.

摘要翻译： 半导体器件包括：半导体层; 形成在与半导体层接触的半导体层上的至少一个电极; 以及覆盖半导体层和电极的顶表面的至少一部分的钝化膜，以保护半导体层并由多个子膜形成。 钝化膜包括由氮化铝制成的第一子膜。

公开(公告)号：US20070170463A1

公开(公告)日：2007-07-26

申请号：US11647218

申请日：2006-12-29

申请人： Hiroaki Ueno ,  Manabu Yanagihara ,  Tetsuzo Ueda ,  Yasuhiro Uemoto ,  Tsuyoshi Tanaka ,  Daisuke Ueda

发明人： Hiroaki Ueno ,  Manabu Yanagihara ,  Tetsuzo Ueda ,  Yasuhiro Uemoto ,  Tsuyoshi Tanaka ,  Daisuke Ueda

IPC分类号： H01L31/00

CPC分类号： H01L29/7783 ,  H01L21/02381 ,  H01L21/0242 ,  H01L21/02458 ,  H01L21/02502 ,  H01L21/0254 ,  H01L29/1066 ,  H01L29/2003 ,  H01L29/4175 ,  H01L29/432 ,  H01L29/452 ,  H01L29/7787

摘要： A nitride semiconductor device includes: a first semiconductor layer made of first nitride semiconductor; a second semiconductor layer formed on a principal surface of the first semiconductor layer and made of second nitride semiconductor having a bandgap wider than that of the first nitride semiconductor; a control layer selectively formed on, or above, an upper portion of the second semiconductor layer and made of third nitride semiconductor having a p-type conductivity; source and drain electrodes formed on the second semiconductor layer at respective sides of the control layer; a gate electrode formed on the control layer; and a fourth semiconductor layer formed on a surface of the first semiconductor layer opposite to the principal surface, having a potential barrier in a valence band with respect to the first nitride semiconductor and made of fourth nitride semiconductor containing aluminum.

摘要翻译： 氮化物半导体器件包括：由第一氮化物半导体制成的第一半导体层; 第二半导体层，其形成在第一半导体层的主表面上并且由具有比第一氮化物半导体的带隙宽的第二氮化物半导体构成; 选择性地形成在所述第二半导体层的上部并且由上述第二半导体层的上部制成的具有p型导电性的第三氮化物半导体的控制层; 源极和漏极，形成在控制层的相应侧上的第二半导体层上; 形成在所述控制层上的栅电极; 以及形成在与所述主表面相对的所述第一半导体层的表面上的第四半导体层，所述第四半导体层相对于所述第一氮化物半导体具有价带中的势垒，并且由包含铝的第四氮化物半导体制成。

公开(公告)号：US07133431B2

公开(公告)日：2006-11-07

申请号：US10629670

申请日：2003-07-30

申请人： Kazutoshi Onozawa ,  Tetsuzo Ueda ,  Daisuke Ueda

发明人： Kazutoshi Onozawa ,  Tetsuzo Ueda ,  Daisuke Ueda

IPC分类号： H01S5/00

CPC分类号： H01S5/02252 ,  G11B7/1275 ,  G11B7/22 ,  G11B2007/0006 ,  H01L24/95 ,  H01L2224/95085 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/10329 ,  H01L2924/10349 ,  H01L2924/12042 ,  H01L2924/14 ,  H01S5/02236 ,  H01S5/4031 ,  H01L2924/00

摘要： A semiconductor laser device includes a substrate which is made of, e.g., silicon and which has in its principal surface first and second recessed portions formed at a distance from each other. Disposed in the first recessed portion is a first semiconductor laser chip in the form of a function block, which emits an infrared laser beam. Disposed in the second recessed portion is a second semiconductor laser chip in the form of a function block, which emits a red laser beam.

摘要翻译： 半导体激光器件包括由例如硅制成并且在其主表面中形成有彼此间隔一定距离的第一和第二凹部的衬底。 设置在第一凹部中的是发射红外激光束的功能块形式的第一半导体激光器芯片。 设置在第二凹部中的是发射红色激光束的功能块形式的第二半导体激光器芯片。

公开(公告)号：US20050272224A1

公开(公告)日：2005-12-08

申请号：US11146020

申请日：2005-06-07

申请人： Tetsuzo Ueda ,  Daisuke Ueda

发明人： Tetsuzo Ueda ,  Daisuke Ueda

IPC分类号： H01L21/301 ,  H01L21/304 ,  H01L21/78 ,  H01L33/00 ,  H01S5/02 ,  H01S5/343

CPC分类号： H01L21/3043 ,  B82Y20/00 ,  H01L21/78 ,  H01L33/0095 ,  H01S5/0201 ,  H01S5/0213 ,  H01S5/34333

摘要： The present invention aims at providing a method for dividing a substrate that is capable of dividing each substrate into chips in the same square-like form without causing chip breaking and capable of forming all cleaved facets flat. In the method for dividing a substrate of the present invention, an electron beam 1 with the intensity that causes a dislocation inside the substrate is irradiated to a substrate surface 2 to generate a crack starting from such dislocation, and a cleaved facet 5 is formed to divide the substrate.

摘要翻译： 本发明的目的在于提供一种分割基板的方法，该方法能够将每个基板分成相同方形的芯片，而不会造成断屑并且能够形成所有的切割面平面。 在本发明的基板分割方法中，将具有导致基板内的位错的强度的电子束1照射到基板表面2，以从该位错开始产生裂纹，并且形成切割面5 划分基板。

公开(公告)号：US20050269577A1

公开(公告)日：2005-12-08

申请号：US11146036

申请日：2005-06-07

申请人： Tetsuzo Ueda ,  Daisuke Ueda

发明人： Tetsuzo Ueda ,  Daisuke Ueda

IPC分类号： C25F3/02 ,  C25F3/12 ,  H01L21/306 ,  H01L21/3063 ,  H01L27/15 ,  H01L33/00 ,  H01S5/02 ,  H01S5/042 ,  H01S5/183 ,  H01S5/323

CPC分类号： C25F3/02 ,  C25F3/12 ,  H01L21/30625 ,  H01L21/30635 ,  H01L33/0095 ,  H01S5/0213 ,  H01S5/0217 ,  H01S5/0425 ,  H01S5/18369 ,  H01S5/32341

摘要： The present invention is conceived in order to accomplish an object of providing a surface treatment method and a surface treatment device that can planarize, at high speed, the surface of a nitride semiconductor with an excellent evenness. The surface treatment device includes an electrolyte supply port 15 for supplying a KOH electrolyte 14 containing fine metal particles and an abrasive, a storage container 40 having an opening on the top surface and is for storing the KOH electrolyte 14 supplied from the electrolyte supply port 15, a wafer holder 12 for fixing the GaN substrate 11 and bringing the surface of the GaN substrate 11 into contact with the KOH electrolyte 14 by impregnating the surface of the substrate into the KOH electrolyte 14 in the storage container 40 from above, a load 13 placed on the wafer holder 12, a device housing 16, a polishing pad 17 for polishing the surface of the GaN substrate 11 and an ultraviolet light source 42.

摘要翻译： 为了实现提供表面处理方法和表面处理装置的目的，本发明的目的是提供一种能够以高的平均化均匀化的氮化物半导体的表面。 表面处理装置包括用于供给包含金属微粒和研磨剂的KOH电解质14的电解质供给口15，在顶面具有开口的储存容器40，用于储存从电解质供给口15供给的KOH电解质14 ，用于固定GaN衬底11并使GaN衬底11的表面与KOH电解质14接触的晶片保持器12，通过将衬底的表面从上方浸渍到存储容器40中的KOH电解质14中，负载13 放置在晶片保持器12上，器件壳体16，用于抛光GaN衬底11的表面的抛光垫17和紫外光源42。