公开(公告)号：US5380596A

公开(公告)日：1995-01-10

申请号：US212650

申请日：1994-03-14

申请人： Akihiko Yoshida ,  Tomonori Takahashi ,  Makoto Murai

发明人： Akihiko Yoshida ,  Tomonori Takahashi ,  Makoto Murai

IPC分类号： C03C8/24 ,  C04B37/00 ,  H01M2/08 ,  H01M10/39 ,  C03C8/02

CPC分类号： H01M2/08 ,  C03C8/24 ,  C04B37/005 ,  H01M10/3909 ,  C04B2235/6565 ,  C04B2237/10 ,  C04B2237/343 ,  C04B2237/64 ,  C04B2237/704 ,  C04B2237/76 ,  C04B2237/765 ,  C04B2237/80 ,  C04B2237/88

摘要： In order to improve a reliability of a glass joint body, first ceramic member and second ceramic member are connected by using (a) glass consisting of 10.about.65 wt % of SiO.sub.2, 30 wt % or less of Na.sub.20, and the balance of B.sub.2 O.sub.3 and Al.sub.2 O.sub.3, (b) glass including less than 10 wt % of SiO.sub.2, and 30.about.80 wt % of B.sub.2 O.sub.3, (c) glass including substantially none of SiO.sub.2, and 30.about.80 wt % of B.sub.2 O.sub.3, or (d) glass consisting of 10.about.65 wt % of SiO.sub.2, 20 wt % or less of Na.sub.2 O, 30 wt % or less of Al.sub.2 O.sub.3, 20 wt % or less of MgO, and the balance of B.sub.2 O.sub.3.

摘要翻译： 为了提高玻璃接合体的可靠性，第一陶瓷部件和第二陶瓷部件通过使用（a）由10重量％的SiO 2，30重量％以下的Na 2 O，和余量的B 2 O 3组成的玻璃连接 和（b）包含小于10重量％的SiO 2和30重量％的B 2 O 3的玻璃，（c）基本上不含SiO 2和30重量％的B 2 O 3的玻璃，或（d）玻璃组成的玻璃 的10重量％的SiO 2，20重量％以下的Na 2 O，30重量％以下的Al 2 O 3，20重量％以下的MgO，余量的B 2 O 3。

公开(公告)号：US20110288118A1

公开(公告)日：2011-11-24

申请号：US13110295

申请日：2011-05-18

申请人： Tatsunobu YOSHIOKA ,  Makoto Murai ,  Hiroaki Tasaki

发明人： Tatsunobu YOSHIOKA ,  Makoto Murai ,  Hiroaki Tasaki

IPC分类号： A61K31/439 ,  A61P11/00 ,  A61P11/08 ,  A61P13/10 ,  A61P1/00 ,  A61P1/06 ,  A61P13/06 ,  A61P13/00 ,  A61P11/06

CPC分类号： A61K31/439 ,  A61K47/32 ,  A61K47/58 ,  A61K47/585

摘要： Disclosed is a pharmaceutical composition comprising a complex between solifenacin or a pharmaceutically acceptable salt thereof and an ion exchange resin, and an acrylic based polymer.

摘要翻译： 公开了一种药物组合物，其包含索非立新或其药学上可接受的盐与离子交换树脂和丙烯酸类聚合物之间的络合物。

公开(公告)号：US20100249413A1

公开(公告)日：2010-09-30

申请号：US12377461

申请日：2007-08-24

申请人： Makoto Murai ,  Yuichi Yonemochi ,  Kohsuke Shakushiro ,  Akihiro Kasai

发明人： Makoto Murai ,  Yuichi Yonemochi ,  Kohsuke Shakushiro ,  Akihiro Kasai

IPC分类号： C07D403/06

CPC分类号： A61K9/19 ,  A61K9/0019 ,  A61K31/497 ,  A61K47/12 ,  A61K47/20 ,  A61K47/22

摘要： [Problem] A stable liquid-form pharmaceutical composition wherein the decomposition with time is prevented and a stabilization method thereof is provided, for providing a liquid-form pharmaceutical composition of 1-(2-methoxyethyl)-2-methyl-4,9-dioxo-3-(pyrazin-2-ylmethyl)-4,9-dihydro-1H-naphtho[2,3-d]imidazol-3-ium or a pharmaceutically acceptable salt thereof to a clinical field.[Means for Solution] Related are a stable pharmaceutical composition of 1-(2-methoxyethyl)-2-methyl-4,9-dioxo-3-(pyrazin-2-ylmethyl)-4,9-dihydro-1H-naphtho[2,3-d]imidazol-3-ium or a pharmaceutically acceptable salt thereof, containing one kind or two or more kinds selected from the group consisting of carbazochrome sodium sulfonate and derivatives thereof, vitamin C's, butylhydroxylanisol, vitamin E's, Vitamin P's, gallic acid, propyl gallate, alpha-thioglycerine and cysteine hydrochloride, as well as a lyophilized product thereof and a stabilizing method thereof.

摘要翻译： [问题]为了提供1-（2-甲氧基乙基）-2-甲基-4,9-二甲酸的液体形式的药物组合物，其中防止了随时间的分解及其稳定方法的稳定的液体形式的药物组合物， 二氧代-3-（吡嗪-2-基甲基）-4,9-二氢-1H-萘并[2,3-d]咪唑-3-鎓或其药学上可接受的盐。 [解决方案]相关的是1-（2-甲氧基乙基）-2-甲基-4,9-二氧代-3-（吡嗪-2-基甲基）-4,9-二氢-1H-萘并[ 2,3-d]咪唑-3-鎓或其药学上可接受的盐，其包含选自咔唑类磺酸钠及其衍生物，维生素C，丁基羟基苯甲醚，维生素E，维生素P的一种或两种以上， 没食子酸，没食子酸丙酯，α-硫代甘油和半胱氨酸盐酸盐，以及其冻干产物及其稳定方法。

公开(公告)号：US07759583B2

公开(公告)日：2010-07-20

申请号：US11528683

申请日：2006-09-28

申请人： Makoto Murai ,  Ryosuke Usui

发明人： Makoto Murai ,  Ryosuke Usui

IPC分类号： H05K1/11

CPC分类号： H05K3/421 ,  H05K1/0373 ,  H05K3/0055 ,  H05K3/4626 ,  H05K2201/0209 ,  H05K2201/09509 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A circuit board, having improved adhesion between its via conductor and insulating layer, is provided. The circuit board includes a first wiring layer, a second wiring layer, the insulating layer, a filler, and the via conductor. The first wiring layer and the second wiring layer are electrically insulated from each other by the insulating layer. The filler which has a favorable thermal conductivity is added into the insulating layer. The via conductor establishing electrical connection between the first wiring layer and the second wiring layer is formed in a predetermined position of the insulating layer. The via conductor is in direct contact with part of the filler added into the insulating layer.

摘要翻译： 提供了一种电路板，其通孔导体和绝缘层之间具有改善的粘合性。 电路板包括第一布线层，第二布线层，绝缘层，填料和通孔导体。 第一布线层和第二布线层通过绝缘层彼此电绝缘。 将具有良好导热性的填料加入到绝缘层中。 在第一布线层和第二布线层之间建立电连接的通孔导体形成在绝缘层的预定位置。 通孔导体与添加到绝缘层中的填料的一部分直接接触。

公开(公告)号：US20070252249A1

公开(公告)日：2007-11-01

申请号：US11740669

申请日：2007-04-26

申请人： Makoto Murai ,  Yasuhiro Kohara ,  Ryosuke Usui

发明人： Makoto Murai ,  Yasuhiro Kohara ,  Ryosuke Usui

IPC分类号： H01L23/495

CPC分类号： H05K3/243 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/50 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/85 ,  H01L2224/05553 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/49171 ,  H01L2224/81801 ,  H01L2224/85444 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K3/284 ,  H05K3/3452 ,  H05K3/382 ,  H05K2201/0989 ,  H05K2203/049 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49222 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The likelihood of exfoliation of a sealing resin layer at a pad electrode part is reduced so that the reliability of a circuit apparatus is improved. A circuit apparatus includes a wiring layer, a gold plating layer, an insulating resin layer, a circuit element, a conductive member and sealing resin layer. The gold plating layer is formed in an wiring layer area for the pad electrode. The surface outside the area is roughened. The insulating resin layer is formed so as to cover the wiring layer and to have an opening in an area in which the pad electrode is formed. The circuit element is mounted on a predetermined area on the insulating resin layer. The sealing resin layer is formed on the insulating resin layer so as to entirely cover the circuit element and the opening for the pad electrode. The sealing resin layer, in the area for the pad electrode, is in contact with the gold plating layer and the wiring layer.

摘要翻译： 密封树脂层在焊盘电极部分的剥离的可能性降低，从而提高了电路设备的可靠性。 电路装置包括布线层，镀金层，绝缘树脂层，电路元件，导电构件和密封树脂层。 金电镀层形成在焊盘电极的布线层区域中。 该地区外面的表面粗糙。 绝缘树脂层形成为覆盖布线层，并且在形成焊盘电极的区域中具有开口。 电路元件安装在绝缘树脂层上的预定区域上。 密封树脂层形成在绝缘树脂层上，以完全覆盖电路元件和焊盘电极的开口。 用于焊盘电极的区域中的密封树脂层与镀金层和布线层接触。

公开(公告)号：US20070082183A1

公开(公告)日：2007-04-12

申请号：US11528683

申请日：2006-09-28

申请人： Makoto Murai ,  Ryosuke Usui

发明人： Makoto Murai ,  Ryosuke Usui

IPC分类号： B32B3/00 ,  H05K1/00

CPC分类号： H05K3/421 ,  H05K1/0373 ,  H05K3/0055 ,  H05K3/4626 ,  H05K2201/0209 ,  H05K2201/09509 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A circuit board, having improved adhesion between its via conductor and insulating layer, is provided. The circuit board includes a first wiring layer, a second wiring layer, the insulating layer, a filler, and the via conductor. The first wiring layer and the second wiring layer are electrically insulated from each other by the insulating layer. The filler which has a favorable thermal conductivity is added into the insulating layer. The via conductor establishing electrical connection between the first wiring layer and the second wiring layer is formed in a predetermined position of the insulating layer. The via conductor is in direct contact with part of the filler added into the insulating layer.

摘要翻译： 提供了一种电路板，其通孔导体和绝缘层之间具有改善的粘合性。 电路板包括第一布线层，第二布线层，绝缘层，填料和通孔导体。 第一布线层和第二布线层通过绝缘层彼此电绝缘。 将具有良好导热性的填料加入到绝缘层中。 在第一布线层和第二布线层之间建立电连接的通孔导体形成在绝缘层的预定位置。 通孔导体与添加到绝缘层中的填料的一部分直接接触。

公开(公告)号：US20060204733A1

公开(公告)日：2006-09-14

申请号：US11362516

申请日：2006-02-27

申请人： Makoto Murai ,  Ryosuke Usui

发明人： Makoto Murai ,  Ryosuke Usui

IPC分类号： B32B3/00

CPC分类号： C23C28/00 ,  C23C28/322 ,  C23C28/345 ,  H01L23/3121 ,  H01L23/3733 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/49822 ,  H01L23/49894 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/056 ,  H05K3/284 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/0269 ,  H05K2201/068 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2203/0315 ,  Y10T428/24331 ,  Y10T428/24917 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

摘要： The present invention provides a circuit device capable of controlling deformation of a circuit device while preventing an insulating layer from peeling from a substrate. The circuit device includes a substrate, an insulating layer formed on the substrate, a filler filled into the insulating layer, a conductive layer formed on the insulating layer, and a circuit element formed on the conductive layer, wherein an average particle diameter of the filler filled into the insulating layer is controlled so that a Young's modulus of a part of the insulating layer on a substrate side can be smaller than a Young's modulus of a part of the insulating layer on an opposite side relative to the substrate side.

公开(公告)号：US07822302B2

公开(公告)日：2010-10-26

申请号：US12578952

申请日：2009-10-14

申请人： Makoto Murai ,  Ryosuke Usui

发明人： Makoto Murai ,  Ryosuke Usui

IPC分类号： G02B6/12 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H05K1/00 ,  H05K1/18 ,  H05K7/00 ,  H01R9/00

CPC分类号： H05K3/0032 ,  H05K1/0366 ,  H05K3/0035 ,  H05K3/421 ,  H05K2201/029 ,  H05K2203/065 ,  Y10T29/49155 ,  Y10T29/49204

摘要： Provided is a circuit board which suppresses abnormal formation of plated layer inside a via, caused by core materials of glass fibers or the like projected from a side wall of the via and which helps to improve the connection reliability of the via. An insulating layer, which is formed of thermoset resin and embedded with glass fibers, is provided between a first wiring layer and a second wiring layer. The glass fibers projected into a via hole side from a side wall of the via hole in different positions are embedded into a via conductor in such a state that the glass fibers are jointed with each other.

摘要翻译： 提供一种电路板，其抑制由通孔的侧壁突出的玻璃纤维等的芯材引起的通孔内的镀层的异常形成，有助于提高通孔的连接可靠性。 在第一布线层和第二布线层之间设置由热固性树脂形成并嵌入玻璃纤维的绝缘层。 玻璃纤维在玻璃纤维彼此接合的状态下嵌入到通孔导体中，从通孔的侧壁在不同位置投影到通孔侧的玻璃纤维。

公开(公告)号：US07796845B2

公开(公告)日：2010-09-14

申请号：US11678321

申请日：2007-02-23

申请人： Makoto Murai ,  Ryosuke Usui

发明人： Makoto Murai ,  Ryosuke Usui

IPC分类号： G02B6/12 ,  H01L23/52 ,  H01L23/40 ,  H01L23/48 ,  H05K1/18 ,  H05K1/00 ,  H01R12/04 ,  H01L21/4763

CPC分类号： H05K3/0032 ,  H05K1/0366 ,  H05K3/0035 ,  H05K3/421 ,  H05K2201/029 ,  H05K2203/065 ,  Y10T29/49155 ,  Y10T29/49204

摘要： Provided is a circuit board which suppresses abnormal formation of plated layer inside a via, caused by core materials of glass fibers or the like projected from a side wall of the via and which helps to improve the connection reliability of the via. An insulating layer, which is formed of thermoset resin and embedded with glass fibers, is provided between a first wiring layer and a second wiring layer. The glass fibers projected into a via hole side from a side wall of the via hole in different positions are embedded into a via conductor in such a state that the glass fibers are jointed with each other.

公开(公告)号：US20100088887A1

公开(公告)日：2010-04-15

申请号：US12578952

申请日：2009-10-14

申请人： Makoto Murai ,  Ryosuke Usui

发明人： Makoto Murai ,  Ryosuke Usui

IPC分类号： H05K3/10

CPC分类号： H05K3/0032 ,  H05K1/0366 ,  H05K3/0035 ,  H05K3/421 ,  H05K2201/029 ,  H05K2203/065 ,  Y10T29/49155 ,  Y10T29/49204

摘要： Provided is a circuit board which suppresses abnormal formation of plated layer inside a via, caused by core materials of glass fibers or the like projected from a side wall of the via and which helps to improve the connection reliability of the via. An insulating layer, which is formed of thermoset resin and embedded with glass fibers, is provided between a first wiring layer and a second wiring layer. The glass fibers projected into a via hole side from a side wall of the via hole in different positions are embedded into a via conductor in such a state that the glass fibers are jointed with each other.

摘要翻译： 提供一种电路板，其抑制由通孔的侧壁突出的玻璃纤维等的芯材引起的通孔内的镀层的异常形成，有助于提高通孔的连接可靠性。 在第一布线层和第二布线层之间设置由热固性树脂形成并嵌入玻璃纤维的绝缘层。 玻璃纤维在玻璃纤维彼此接合的状态下嵌入到通孔导体中，从通孔的侧壁在不同位置投影到通孔侧的玻璃纤维。