公开(公告)号：US07944698B2

公开(公告)日：2011-05-17

申请号：US12164367

申请日：2008-06-30

Applicant: John Lee Colbert ,  Eric Alan Eckberg ,  Roger Duane Hamilton ,  Mark Kenneth Hoffmeyer ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

Inventor： John Lee Colbert ,  Eric Alan Eckberg ,  Roger Duane Hamilton ,  Mark Kenneth Hoffmeyer ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

IPC: H05K7/20

CPC classification number: H01L23/4006 ,  H01L2023/405 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/4913 ,  Y10T29/49826 ,  H01L2924/00

Abstract: A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.

Abstract translation: 传热装置包括具有负载弹簧的负载框架和暴露电子部件的开放区域。 负载框架安装在其上安装电子部件的印刷电路板上。 散热器组件设置在负载框架上，并且具有通过导热材料与电子部件热接触的主体。 散热器组件具有用于接合负载弹簧的负载臂。 负载板在负载臂之间延伸并且具有致动元件，该致动元件可操作地相对于负载板移动主体，从而使负载弹簧弹性变形，并产生负载力，该负载力压缩导热材料以实现期望的热界面间隙 主体和电子部件。 不影响的紧固件将散热器固定到负载框架上并保持所需的热接口间隙。

公开(公告)号：US20100248506A1

公开(公告)日：2010-09-30

申请号：US12410095

申请日：2009-03-24

Applicant: Mark Kenneth Hoffmeyer ,  Steven Paul Ostrander ,  Sri M. Sri-Jayantha

Inventor： Mark Kenneth Hoffmeyer ,  Steven Paul Ostrander ,  Sri M. Sri-Jayantha

IPC: H01R12/00 ,  H01R43/04

CPC classification number: H05K1/111 ,  H01R43/0256 ,  H05K3/3421 ,  H05K2201/0373 ,  H05K2201/09736 ,  H05K2201/2036 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49218

Abstract: A method and a surface mount technology (SMT) pad structure are provided for implementing enhanced solder joint robustness. The SMT pad structure includes a base SMT pad. The base SMT pad receives a connector for soldering to the SMT pad structure. A standoff structure having a selected geometry is defined on the base SMT pad to increase thickness of the solder joint for the connector.

Abstract translation: 提供了一种方法和表面贴装技术（SMT）焊盘结构，用于实现增强的焊点鲁棒性。 SMT焊盘结构包括基板SMT焊盘。 基座SMT焊盘接收用于焊接到SMT焊盘结构的连接器。 在基座SMT焊盘上限定具有选定几何形状的间隔结构，以增加用于连接器的焊点的厚度。

公开(公告)号：US07517230B2

公开(公告)日：2009-04-14

申请号：US12131176

申请日：2008-06-02

Applicant: John Lee Colbert ,  Mark Kenneth Hoffmeyer

Inventor： John Lee Colbert ,  Mark Kenneth Hoffmeyer

IPC: H01R12/00

CPC classification number: H01L23/4006 ,  H01L25/0655 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/0058 ,  H05K3/325 ,  H05K7/1061 ,  H05K2201/09036 ,  H05K2201/10409 ,  H05K2201/10719 ,  H05K2201/2009 ,  H01L2924/00

Abstract: An electrical contact assembly includes a first module (21a, 21b, 22) having a first set of electrical contacts, a second module (10) having a second set of electrical contacts, a shape generating module (32, 34, 36), and a clamping arrangement (24, 25, 26, 27, 28, 29) for clamping the first, second and shape generating modules together. The shape generating module (32, 34, 36) imparts a desired shape to the second module (10) for urging the second set of electrical contacts toward the first set of electrical contacts, such that clamping the modules together results in a positive contact force between the first and second sets of electrical contacts that is substantially uniform across the sets of electrical contacts. The shape generating module includes a first insulating layer (34), a second insulating layer (32) and a shape producing layer (36) disposed between the first and second insulating layers. The shape producing layer (36) includes an adhesive that flows and cures upon application of a heat treatment to produce the desired shape.

Abstract translation: 电触头组件包括具有第一组电触点的第一模块（21a，21b，22），具有第二组电触点的第二模块（10），形状产生模块（32,34,36），以及 用于将第一，第二和形状发生模块夹紧在一起的夹紧装置（24,25,26,27,28,29）。 形状产生模块（32,34,36）向第二模块（10）施加期望的形状，用于将第二组电触头推向第一组电触头，使得将模块夹在一起导致正接触力 在第一组和第二组电触点之间，在电接触组之间基本均匀。 形状产生模块包括设置在第一和第二绝缘层之间的第一绝缘层（34），第二绝缘层（32）和形状产生层（36）。 形状产生层（36）包括在施加热处理以产生所需形状时流动和固化的粘合剂。

公开(公告)号：US20080259572A1

公开(公告)日：2008-10-23

申请号：US12164339

申请日：2008-06-30

Applicant: John Lee Colbert ,  Eric Alan Eckberg ,  Roger Duane Hamilton ,  Mark Kenneth Hoffmeyer ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

Inventor： John Lee Colbert ,  Eric Alan Eckberg ,  Roger Duane Hamilton ,  Mark Kenneth Hoffmeyer ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

IPC: H05K7/20 ,  H05K3/30

CPC classification number: H01L23/4006 ,  H01L2023/405 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/4913 ,  Y10T29/49826 ,  H01L2924/00

Abstract: A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.

Abstract translation: 传热装置包括具有负载弹簧的负载框架和暴露电子部件的开放区域。 负载框架安装在其上安装电子部件的印刷电路板上。 散热器组件设置在负载框架上，并且具有通过导热材料与电子部件热接触的主体。 散热器组件具有用于接合负载弹簧的负载臂。 负载板在负载臂之间延伸并且具有致动元件，该致动元件可操作地相对于负载板移动主体，从而使负载弹簧弹性变形，并产生负载力，该负载力压缩导热材料以实现期望的热界面间隙 主体和电子部件。 不影响的紧固件将散热器固定到负载框架上并保持所需的热接口间隙。

公开(公告)号：US07199309B2

公开(公告)日：2007-04-03

申请号：US11167662

申请日：2005-06-27

Applicant: Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

Inventor： Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H05K3/4046 ,  H05K1/112 ,  H05K3/225 ,  H05K3/429 ,  H05K2201/1025 ,  H05K2201/10287 ,  H05K2201/10871 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.

Abstract translation: 一种替代在顶表面上具有多个接触焊盘的印刷电路板上的电接口的方法，所述接触焊盘连接到延伸穿过所述电路板的导电材料。 对于更换的接触垫，在该位置穿过所述印刷电路板钻一个孔，并且去除附着在顶板表面上的接触垫上的剩余的导体材料。 提供具有大致T形结构的替换导体/接触垫结构，其具有完全围绕所述杆的杆和头部，其中所述头部的直径大于所述钻孔的直径。 将替换的导体/接触垫插入孔中，其中所述杆延伸超过板的第二表面，并且头的底表面与所述板的第一表面接触。 修理板上的替换导体/接触垫也被描述。

公开(公告)号：US06711026B2

公开(公告)日：2004-03-23

申请号：US10007986

申请日：2001-11-13

Applicant: Mark Kenneth Hoffmeyer

Inventor： Mark Kenneth Hoffmeyer

IPC: H05K118

CPC classification number: H05K7/1061 ,  H01L2924/0002 ,  H05K1/0218 ,  H05K1/0263 ,  H05K1/111 ,  H05K3/244 ,  H05K2201/09781 ,  H05K2201/10719 ,  Y02P70/611 ,  H01L2924/00

Abstract: A conductive sash is etched around the periphery of a land grid array interconnection on a carrier for dense integrated circuit connections. If the array comprises more than one module or module chip domain, the conductive sash is also positioned between the modules. The dimensions of the sash are such that it is slightly larger than a frame of an interposer or other electrical connector which is placed upon the array. In this fashion, the interposer or other electrical connector rests upon the sash and provides protection against particulate and gaseous contamination of the array. Preferably, the sash is manufactured along with the array of electrical interconnections of the carrier, and during the manufacture the sash provides more homogeneous current density to the outer interconnections of the array during component processing which in turn provides more predictable and consistent surface topography of the carrier and permits more uniform mechanical loading of the interposer or other connector onto the array when assembled.

Abstract translation: 在载体上的栅格阵列互连的周围蚀刻导电的窗扇，用于密集的集成电路连接。 如果阵列包括多个模块或模块芯片域，则导电窗扇也位于模块之间。 窗扇的尺寸使得其稍微大于放置在阵列上的中介层或其它电连接器的框架。 以这种方式，插入器或其他电连接器搁置在窗框上并提供防止阵列的颗粒和气体污染的保护。 优选地，窗框与载体的电互连阵列一起制造，并且在制造期间，窗扇在组件处理期间向阵列的外部互连提供更均匀的电流密度，这又提供了更可预测和一致的表面形貌 并且当组装时允许将插入件或其它连接器更均匀地机械加载到阵列上。

公开(公告)号：US06499215B1

公开(公告)日：2002-12-31

申请号：US09606583

申请日：2000-06-29

Applicant: Mark Kenneth Hoffmeyer ,  Daniel Scott Johnson

Inventor： Mark Kenneth Hoffmeyer ,  Daniel Scott Johnson

IPC: H05K334

CPC classification number: H05K3/3452 ,  H05K3/1216 ,  H05K3/3415 ,  H05K3/3468 ,  H05K3/3494 ,  H05K2201/10734 ,  H05K2203/0557 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: A method for processing circuit boards containing area array surface treated bonding sites, such as noble metal terminal pads of a Land Grid Array (LGA) assembly. The circuit board includes a plurality of apertures patterned about the bonding site to form a footprint. A protective cover shaped to conform to the footprint includes posts registered to removably fit into the apertures. The protective cover remains overlaid on the circuit board during fabrication processes such as solder screen printing, rework, and washing, and then removed. Thus, contamination from the fabrication processes is avoided, as well as eliminating possible sources of contamination from use of adhesive tape for protection.

Abstract translation: 一种用于处理包含区域阵列表面处理的接合位置的电路​​板的方法，例如Land Grid Array（LGA）组件的贵金属端子焊盘。 电路板包括围绕接合部位图案化的多个孔，以形成覆盖区。 形状为符合足迹的保护盖包括注册以可拆卸地装配到孔中的柱。 在制造工艺如焊丝丝网印刷，返修和洗涤时，保护盖仍然覆盖在电路板上，然后拆下。 因此，避免了制造过程中的污染，并且消除了使用胶带进行保护的可能的污染源。

公开(公告)号：US06300578B1

公开(公告)日：2001-10-09

申请号：US09512131

申请日：2000-02-24

Applicant: Mark Kenneth Hoffmeyer ,  Phillip Duane Isaacs

Inventor： Mark Kenneth Hoffmeyer ,  Phillip Duane Isaacs

IPC: H01R1204

CPC classification number: H05K3/3436 ,  B23K1/0016 ,  B23K2101/42 ,  H05K3/3452 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/09481 ,  H05K2201/09572 ,  H05K2201/10992 ,  H05K2201/2081 ,  H05K2203/043 ,  H05K2203/0455 ,  Y02P70/613

Abstract: Fine pitch area array packaging is achieved using a via-in-pad design within the area array attach portion of a printed circuit board (PCB). The limitation of the design is the wicking action, whereby solder applied to the capture pad contact surface is depleted by capillary action into the via hole when reflowed, causing insufficient solder to be present at the contact surface to effect reliable and repeatable electrical connections. In one implementation, an initial application of solder is applied to plug the via hole with a material having a higher final melting temperature than eutectic solder, thereby providing a stable plug. This plug is formed by the initial solder application that may be either a eutectic solder containing a third metal that forms intermetallic compounds, when reflowed, that elevate the liquidus temperature or a solder having a different formulation with an inherent higher melting temperature. An alternative implementation is to plate the via hole with a material, such as nickel, which prevents eutectic solder, applied to the via capture pad contact surface, from wetting the hole surface and being drawn away from the contact surface by capillary action. Thus, the solder, applied to the via capture pad and used to establish an electrical connection is not depleted.

Abstract translation: 使用在印刷电路板（PCB）的区域阵列附着部分内的通孔焊盘设计实现细间距区域阵列封装。 设计的限制是芯吸作用，由此当回流时，施加到捕获垫接触表面的焊料被毛细管作用通入通孔中，导致在接触表面处存在不足的焊料以实现可靠和可重复的电连接。 在一个实施方案中，施加焊料的初始应用以用比共晶焊料更高的最终熔融温度的材料堵塞通孔，从而提供稳定的插塞。 该插头由初始焊料应用形成，其可以是包含形成金属间化合物的第三金属的共晶焊料，当回流时，提高液相线温度的焊料或具有固有的较高熔融温度的不同配方的焊料。 另一种实施方案是用诸如镍的材料对通孔进行平板化，其防止施加到通孔捕获垫接触表面的共晶焊料润湿孔表面并通过毛细管作用从接触表面拉出。 因此，施加到通孔捕获垫并用于建立电连接的焊料不会耗尽。

公开(公告)号：US6134776A

公开(公告)日：2000-10-24

申请号：US19110

申请日：1998-02-05

Applicant: Mark Kenneth Hoffmeyer

Inventor： Mark Kenneth Hoffmeyer

IPC: H01L23/40 ,  H01L21/52 ,  H01L21/58 ,  H01L21/60 ,  H01L23/367 ,  H01L23/373 ,  H05K3/34

CPC classification number: H01L24/85 ,  H01L23/3672 ,  H01L23/3735 ,  H01L23/3737 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/85205 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025

Abstract: A direct chip attach to heatsink structure is shown and described which implements rework when the chip must be removed and replaced. A laminated heatsink includes a metal heatsink with a foil layer adhered to the chip attachment surface with the assembly secured to a carrier at a cutout opening therein that defines the chip attach site. The adhesive, either a dry film adhesive or a pressure sensitive adhesive, secures foil layer to heatsink and provides the interface of separation when a chip must be removed and replaced. By peeling the foil away from the heatsink, the foil, chip and non-reworkable die attach adhesive are removed as a unit, leaving no chip attach adhesive residue at the attachment site to be scraped or abraded away. The replacement chip can be installed either by directly installing with new die attach adhesive or by first restoring the foil layer prior to chip installation. The foil may be applied over the entire surface of the heatsink or may be patterned to provide the laminated foil coating only beneath the chip attach site. Further, the foil and heatsink may be of dissimilar metals to impart varying characteristics, such as a solderable surface to an aluminum heatsink.Also, the technique would be applicable to direct chip attachment directly to a rigid or flexible electronic circuit carrier assembly. In another form, the invention may be implemented using a foil layer with adhesive on both sides to secure the chip to a heatsink at the carrier assembly chip attach location. A further form of the invention uses a tape cavity packaging structure wherein the carrier assembly includes a laminated carrier/heatsink with aligned openings that create a chip attach cavity in the package and foil bonded to the heatsink across the base of the chip cavity by a layer of adhesive that also presents a chip attach adhesive across the base of the chip attach cavity. The structure affords a low profile assembly, enables rework/replacement, shortens wire lengths and reduces wirebond loop heights.

公开(公告)号：US6024580A

公开(公告)日：2000-02-15

申请号：US4235

申请日：1998-01-08

Applicant: John Richard Dangler ,  Mark Kenneth Hoffmeyer ,  Thomas Donald Kidd ,  Miles Frank Swain

Inventor： John Richard Dangler ,  Mark Kenneth Hoffmeyer ,  Thomas Donald Kidd ,  Miles Frank Swain

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/40 ,  H01R9/09

CPC classification number: H01R12/61 ,  H05K1/118 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/091 ,  H05K3/0061

Abstract: A flex cable pad on pad terminal structure is shown having raised connector pads formed using a rigid stiffener with raised features or bumps formed integral with the stiffener; aligned with the connector pad surfaces; and laminated to the flex cable surface opposite the surface presenting the exposed connector pad surfaces, to create raised contact pads that are not subject to relaxation over time when subjected to high contact normal forces. The use of a metal stiffener which has been coined to produce the raised features aligned with the contact pad locations and lamination using a film or layer of thermocuring adhesive affords an economical process and assembly technique that also effects hot deformation of the flex cable at the contact pad locations.

Abstract translation: 示出了焊盘端子结构上的柔性电缆焊盘具有使用刚性加强件形成的升高的连接器焊盘，该刚性加强件具有与加强件一体形成的凸起特征或凸块; 与连接器焊盘表面对齐; 并且层压到与呈现暴露的连接器焊盘表面的表面相对的柔性电缆表面上，以产生当受到高接触法向力时不随时间松弛的凸起接触焊盘。 使用已经被制造以产生与接触垫位置对准的凸起特征的金属加强件并且使用热固化粘合剂的膜或层进行层压提供了经济的工艺和组装技术，其也在接触处引起柔性电缆的热变形 垫位置。