公开(公告)号：US6156150A

公开(公告)日：2000-12-05

申请号：US171183

申请日：1998-10-14

申请人： Kazuto Nishida

发明人： Kazuto Nishida

IPC分类号： H05K13/00 ,  H05K13/04 ,  B32B35/00

CPC分类号： H05K13/0486 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  Y10S156/941 ,  Y10T156/11 ,  Y10T156/1153 ,  Y10T156/19 ,  Y10T29/4973 ,  Y10T29/49822 ,  Y10T29/53274

摘要： A method and apparatus for separating an IC component (1) from a board (3). The method includes the processes of positioning a tool (21) just above the IC component, thereafter moving the tool down into a specified position, making the tool cover the IC component that is mounted on the board via an adhesive material, solder, or paste, and separating the IC component from the board by turning the tool. Through these processes, the IC component can be separated with a relatively small force, so that cracking of the IC component and damage to the board can be suppressed to a minimum.

摘要翻译： PCT No.PCT / JP97 / 01307 Sec。 371日期：1998年10月14日 102（e）1998年10月14日PCT PCT 1997年4月16日PCT公布。 公开号WO97 / 39611 PCT 日期：1997年10月23日一种用于将IC部件（1）与板（3）分离的方法和装置。 该方法包括将工具（21）定位在IC部件正上方的工序，然后将工具向下移动到指定位置，使得工具通过粘合剂材料，焊料或糊料覆盖安装在板上的IC部件 ，并通过转动工具将IC组件与板分离。 通过这些处理，IC部件能够以相对小的力分离，从而可以将IC部件的破裂和板的损坏抑制到最小。

公开(公告)号：US08007627B2

公开(公告)日：2011-08-30

申请号：US11064122

申请日：2005-02-23

申请人： Kazuto Nishida ,  Hidenobu Nishikawa ,  Yoshinori Wada ,  Hiroyuki Otani

发明人： Kazuto Nishida ,  Hidenobu Nishikawa ,  Yoshinori Wada ,  Hiroyuki Otani

IPC分类号： B32B37/00 ,  B29C65/00

CPC分类号： H01L24/31 ,  H01L21/563 ,  H01L23/295 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48624 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/78301 ,  H01L2224/81048 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/81903 ,  H01L2224/83048 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01L2224/9211 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K3/323 ,  Y10T29/4913 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip is corrected and the board is connected, the bumps are compressed, and the insulating resin is hardened.

摘要翻译： 芯片通过在位置凸块与板电极之间对准而在电路板上粘合，在芯片和电路板之间插入各向异性导电层。 各向异性导电层是绝缘树脂，导电颗粒和无机填料的混合物。 利用工具，以每个凸起不超过20gf的压力将该芯片压靠在板上，同时校正芯片的翘曲并且板被连接，凸块被压缩，并且绝缘树脂硬化。

公开(公告)号：US20090104014A1

公开(公告)日：2009-04-23

申请号：US12246021

申请日：2008-10-06

申请人： Toshihiko SATOU ,  Kazuhiko Takahashi ,  Kazuto Nishida ,  Satoru Waga

发明人： Toshihiko SATOU ,  Kazuhiko Takahashi ,  Kazuto Nishida ,  Satoru Waga

IPC分类号： H01L21/673 ,  B65D85/86 ,  B65D85/90 ,  B65D81/07

CPC分类号： H01L21/67333 ,  G01R31/2893 ,  H01L2924/0002 ,  H01L2924/00

摘要： The carrier frame relating to the present invention comprises a base layer member, a frame layer member, and a positioning layer member having multiple openings for storing electronic components. A spring layer member is mounted in a hollow part surrounded by the frame layer member between the positioning layer member and the base layer member. At each opening of the spring layer member, a small spring providing an elastic force for fastening the electronic components between an edge of the corresponding opening of the positioning layer member and the small spring is formed integrally with the spring layer member. At one end in the longitudinal direction of the spring layer member, a large spring providing an elastic force along the longitudinal direction by being in contact with an inner surface of the frame layer member in the mounted state is formed integrally with the spring layer member.

摘要翻译： 本发明的载体框架包括基层构件，框架层构件和具有用于存储电子部件的多个开口的定位层构件。 弹性层构件安装在由定位层构件和基层构件之间的框架层构件包围的中空部中。 在弹簧层构件的每个开口处，提供用于将电子部件紧固在定位层构件的相应开口的边缘与小弹簧之间的弹性力的小弹簧与弹簧层构件一体地形成。 在弹簧层部件的长度方向的一端，通过与安装状态的框架部件的内表面接触而沿着长度方向提供弹性力的大弹簧与弹簧层部件一体形成。

公开(公告)号：US07473476B2

公开(公告)日：2009-01-06

申请号：US10770955

申请日：2004-02-03

申请人： Atsushi Yamaguchi ,  Kazuto Nishida ,  Masato Hirano

发明人： Atsushi Yamaguchi ,  Kazuto Nishida ,  Masato Hirano

IPC分类号： B32B15/01

CPC分类号： H01L23/49811 ,  B23K20/16 ,  B23K35/007 ,  B23K35/262 ,  B23K2101/40 ,  H01L23/488 ,  H01L2924/0002 ,  H05K3/244 ,  H05K3/3426 ,  H05K3/3463 ,  Y10T428/12708 ,  Y10T428/12792 ,  Y10T428/12882 ,  H01L2924/00

摘要： It is possible to prevent deterioration of a soldering portion and improve strength of thermal fatigue resistance by providing barrier metal layers on at least one of lead and land to cover parent materials comprising Cu-containing materials, feeding a soldering material between the lead and the land and allowing to contact in a fused condition with barrier metal layers and solidify, and thus soldering together the lead and the land.

摘要翻译： 可以防止焊接部分的劣化，并且通过在至少一个引线和焊盘上设置阻挡金属层来覆盖包含含Cu材料的母材料，在引线和焊盘之间供给焊接材料，从而提高耐热疲劳强度的强度 并且允许在熔融状态下与阻挡金属层接触并固化，从而焊接铅和焊盘。

公开(公告)号：US07060528B2

公开(公告)日：2006-06-13

申请号：US10253604

申请日：2002-09-25

申请人： Hidenobu Nishikawa ,  Kazuto Nishida ,  Kazumichi Shimizu ,  Hiroyuki Otani

发明人： Hidenobu Nishikawa ,  Kazuto Nishida ,  Kazumichi Shimizu ,  Hiroyuki Otani

IPC分类号： H01L21/48

CPC分类号： H01L24/742 ,  H01L21/563 ,  H01L23/544 ,  H01L24/11 ,  H01L24/27 ,  H01L24/29 ,  H01L24/31 ,  H01L24/83 ,  H01L24/90 ,  H01L24/94 ,  H01L25/50 ,  H01L2223/54406 ,  H01L2223/54413 ,  H01L2223/54426 ,  H01L2223/5448 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/45144 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05599

摘要： A semiconductor element mounting method is provided with high productivity. The method includes forming bumps on electrodes of a wafer in which a plurality of semiconductor elements have been formed, temporarily compression-bonding the wafer and an interposer via an insulative resin, curing the resin by performing heating and pressurization so that the wafer and the interposer are finally compression-bonded, wherein the electrodes of the wafer and electrodes of the interposer are bonded to each other, respectively, and wherein insulative resin overflowing from between the wafer and the interposer flows into grooves disposed so as to be coincident with dicing lines of the wafer, thus providing a uniform flow of the insulative resin, and thereafter, cutting and separating this bonded unit into individual semiconductor elements.

摘要翻译： 提供了高生产率的半导体元件安装方法。 该方法包括在其上形成有多个半导体元件的晶片的电极上形成凸块，通过绝缘树脂临时压接晶片和插入件，通过进行加热和加压来固化树脂，使得晶片和插入件 最后压接，其中晶片的电极和插入器的电极分别相互粘合，并且其中从晶片和插入件之间溢出的绝缘树脂流入设置为与切割线重合的槽 晶片，从而提供均匀的绝缘树脂流动，然后将该结合单元切割并分离成单独的半导体元件。

公开(公告)号：US20050155706A1

公开(公告)日：2005-07-21

申请号：US11064122

申请日：2005-02-23

申请人： Kazuto Nishida ,  Hidenobu Nishikawa ,  Yoshinori Wada ,  Hiroyuki Otani

发明人： Kazuto Nishida ,  Hidenobu Nishikawa ,  Yoshinori Wada ,  Hiroyuki Otani

IPC分类号： H01L21/60 ,  H05K3/32 ,  C09J5/00 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/31 ,  H01L21/563 ,  H01L23/295 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48624 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/78301 ,  H01L2224/81048 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/81903 ,  H01L2224/83048 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01L2224/9211 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K3/323 ,  Y10T29/4913 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is connected, the bumps are compressed, and the insulating resin is hardened.

摘要翻译： 芯片通过在位置凸块与板电极之间对准而在电路板上粘合，在芯片和电路板之间插入各向异性导电层。 各向异性导电层是绝缘树脂，导电颗粒和无机填料的混合物。 利用工具，以每个凸起不小于20gf的压力将芯片压在板上，同时连接芯片和板的翘曲，凸起被压缩，绝缘树脂硬化。

公开(公告)号：US6086441A

公开(公告)日：2000-07-11

申请号：US69334

申请日：1998-04-29

申请人： Takashi Akiguchi ,  Kazuto Nishida

发明人： Takashi Akiguchi ,  Kazuto Nishida

IPC分类号： H01J9/28 ,  H05K1/09 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32 ,  H05K3/36 ,  H01J9/24

CPC分类号： H01J9/28 ,  H05K3/361 ,  H01J2211/46 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/092 ,  H05K2201/10977 ,  H05K2203/1189 ,  H05K3/284 ,  H05K3/305 ,  H05K3/323

摘要： A method is disclosed for connecting electrodes of a plasma display panel. The method includes overlapping a thick film electrode formed on a glass substrate with an electrode of a flexible substrate via an adhesive sheet having conductive particles dispersed therein, then, heating and pressuring from above the flexible substrate with a pressuring tool, to thereby set the adhesive sheet, and finally electrically connecting the electrode of the glass substrate and the electrode of the flexible substrate with each other.

摘要翻译： 公开了一种用于连接等离子体显示面板的电极的方法。 该方法包括通过具有分散在其中的导电颗粒的粘合片将形成在玻璃基板上的厚膜电极与柔性基板的电极重叠，然后用加压工具从柔性基板的上方加热和加压，从而将粘合剂 并且最后将玻璃基板的电极和柔性基板的电极彼此电连接。

公开(公告)号：US5858806A

公开(公告)日：1999-01-12

申请号：US620171

申请日：1996-03-22

申请人： Kazuto Nishida

发明人： Kazuto Nishida

IPC分类号： H01L21/00 ,  H05K3/32

CPC分类号： H01L21/67144 ,  H05K3/321

摘要： A method wherein an IC component is mounted to electrodes provided in a transparent portion of a flat panel display with interposition of an anisotropic conductive adhesive or film, includes steps of detecting, when mounting the IC component onto the transparent portion of the flat panel display for temporary bonding to the adhesive or film, positional displacement amounts of first positional alignment portions in two positions of the mounted IC component relative to second positional alignment portions in two positions of the transparent portion of the flat panel display in correspondence with the first positional alignment portions by a camera from a side of the flat panel display opposite from a side on which the IC component is mounted, thereby inspecting positional alignment state of bumps of the IC component with the electrodes of the flat panel display, feeding back the positional displacement amount of the IC component with respect to the flat panel display when the positional alignment state is not acceptable, and performing positional alignment of bumps of a next IC component with the electrodes of the flat panel display while taking the fed-back positional displacement amount into account. A state of bonding of the bumps to the electrodes of the flat panel display is detected in a plurality of portions, it is decided that a parallelism of the IC component relative to the flat panel display exceeds a tolerance range when the state of bonding is not acceptable, and then a warning signal is outputted.

摘要翻译： 一种方法，其中将IC部件安装到设置在具有各向异性导电粘合剂或膜的平板显示器的透明部分中的电极上的方法包括以下步骤：当将IC部件安装到平板显示器的透明部分上时， 临时粘合到胶粘剂或胶片上，与第一位置对准部分相对应地在平板显示器的透明部分的两个位置相对于第二位置对准部分安装的IC部件的两个位置中的第一位置对准部分的位置偏移量 通过相机从平板显示器的与安装有IC部件的一侧相反的一侧，从而通过平板显示器的电极检查IC部件的凸块的位置对准状态，反馈位置偏移量 IC组件相对于平板显示器的位置 对准状态是不可接受的，并且在考虑反馈位置位移量的同时，对下一个IC部件的凸块与平板显示器的电极进行位置对准。 在多个部分中检测到凸块与平板显示器的电极的接合状态，当接合不是状态时，确定IC部件相对于平板显示器的平行度超过公差范围 可接受，然后输出警告信号。

公开(公告)号：US5462626A

公开(公告)日：1995-10-31

申请号：US98813

申请日：1993-07-29

申请人： Shinji Kanayama ,  Akira Kabeshita ,  Kenichi Nishino ,  Satoshi Ohnakada ,  Takahiko Murata ,  Kazuhiro Kimura ,  Kazuto Nishida

发明人： Shinji Kanayama ,  Akira Kabeshita ,  Kenichi Nishino ,  Satoshi Ohnakada ,  Takahiko Murata ,  Kazuhiro Kimura ,  Kazuto Nishida

IPC分类号： H05K3/34 ,  H05K3/36 ,  H05K13/04 ,  B32B31/00

CPC分类号： H05K3/363 ,  H05K13/0465 ,  H05K2201/0394 ,  H05K2201/064 ,  H05K2201/10681 ,  H05K2203/0195 ,  H05K2203/107 ,  H05K3/3421 ,  H05K3/3494

摘要： A bonding method of for external leads which includes the steps of registering the external leads of an IC component with electrodes of a circuit substrate, setting an external lead retaining surface of a bonding tool on a flat outer tab obtained by coating plural outer end parts of the external leads of the registered IC component with resin, and bringing the external leads in touch with the corresponding electrodes. A laster beam irradiates one of the external leads registered on one of the electrodes to thereby bond them, and cooling gas is jetted on a bonding part of the external lead to cool a bonding part of the external lead and the electrode. During the irradiating step, the one of the external leads registered on one of the corresponding electrodes can be pressed against the electrode to bond the bonding part of the electrode and the external lead. A bonding tool which is used in the method includes a wall having an external lead retaining surface for being set on the flat outer tab and pressing one of the external leads, to bring the one of the external leads into touch with the corresponding one of the electrodes. A laser beam passage is provided in the bonding tool through which a laser beam is irradiated to an external lead bonding part, and a gas passage is also provided, through which cooling gas is jetted on to the external lead bonding part to cool the bonding part of the external lead and the electrode.

摘要翻译： 一种用于外部引线的接合方法，包括以下步骤：将IC部件的外部引线与电路基板的电极对准，将焊接工具的外部引线保持面设置在通过涂覆多个外部端部 使用树脂的注册的IC部件的外部引线，并且使外部引线与相应的电极接触。 灯光束照射登记在一个电极上的一个外部引线，从而将它们接合，并且将冷却气体喷射到外部引线的接合部分上，以冷却外部引线和电极的接合部分。 在照射步骤期间，登记在一个相应的电极上的外部引线中的一个可以被压在电极上，以将电极的接合部分和外部引线接合。 在该方法中使用的接合工具包括具有外部引线保持表面的壁，用于设置在平坦的外部突片上并按压外部引线之一，以使外部引线中的一个与相应的一个引线保持接触 电极。 激光束通道设置在接合工具中，激光束通过该激光束照射到外部引线接合部分，并且还设置有气体通道，冷却气体通过该通道喷射到外部引线接合部分以冷却接合部分 的外部引线和电极。

公开(公告)号：US5240170A

公开(公告)日：1993-08-31

申请号：US894650

申请日：1992-06-05

申请人： Kazuto Nishida ,  Kazuhiro Nobori ,  Yoshifumi Kitayama ,  Keiji Saeki

发明人： Kazuto Nishida ,  Kazuhiro Nobori ,  Yoshifumi Kitayama ,  Keiji Saeki

IPC分类号： H01L23/495 ,  H05K3/30 ,  H05K3/34

CPC分类号： H01L23/49555 ,  H05K3/3421 ,  H01L2924/0002 ,  H05K2201/10681 ,  H05K2201/10689 ,  H05K2203/0195 ,  H05K2203/082 ,  H05K2203/107 ,  H05K2203/306 ,  H05K3/303 ,  H05K3/3494 ,  Y02P70/613

摘要： A method for bonding leads of an IC component with electrodes of a circuit board includes the steps of using a mounting device to hold the IC component with flat portions of the leads inclined downward, mounting the IC component on the circuit board at a predetermined position thereof with the IC component held by the mounting device, moving the mounting device toward the circuit board to compress the IC component against the circuit board at the predetermined position while allowing the leads to flex to accommodate for nonuniformity in the heights of metal pieces to be bonded with the electrodes and bending of the circuit board. In this manner, the flat portions of the leads are brought into close contact with the electrodes. The leads are then irradiated with an optical beam so as to melt the metal pieces of the electrodes for bonding of the leads to the circuit board.

摘要翻译： 用于将IC部件的引线与电路板的电极接合的方法包括以下步骤：使用安装装置将引线的平坦部分保持在IC的下方，将IC部件安装在电路板上的预定位置 通过由安装装置保持的IC部件，将安装装置朝向电路板移动，以在预定位置处将IC部件压靠在电路板上，同时允许引线弯曲以适应待粘合的金属片的高度的不均匀性 与电极和电路板的弯曲。 以这种方式，引线的平坦部分与电极紧密接触。 然后用光束照射引线，以熔化用于将引线接合到电路板的电极的金属片。