公开(公告)号：US6086441A

公开(公告)日：2000-07-11

申请号：US69334

申请日：1998-04-29

申请人： Takashi Akiguchi ,  Kazuto Nishida

发明人： Takashi Akiguchi ,  Kazuto Nishida

IPC分类号： H01J9/28 ,  H05K1/09 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32 ,  H05K3/36 ,  H01J9/24

CPC分类号： H01J9/28 ,  H05K3/361 ,  H01J2211/46 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/092 ,  H05K2201/10977 ,  H05K2203/1189 ,  H05K3/284 ,  H05K3/305 ,  H05K3/323

摘要： A method is disclosed for connecting electrodes of a plasma display panel. The method includes overlapping a thick film electrode formed on a glass substrate with an electrode of a flexible substrate via an adhesive sheet having conductive particles dispersed therein, then, heating and pressuring from above the flexible substrate with a pressuring tool, to thereby set the adhesive sheet, and finally electrically connecting the electrode of the glass substrate and the electrode of the flexible substrate with each other.

摘要翻译： 公开了一种用于连接等离子体显示面板的电极的方法。 该方法包括通过具有分散在其中的导电颗粒的粘合片将形成在玻璃基板上的厚膜电极与柔性基板的电极重叠，然后用加压工具从柔性基板的上方加热和加压，从而将粘合剂 并且最后将玻璃基板的电极和柔性基板的电极彼此电连接。

公开(公告)号：US07090502B2

公开(公告)日：2006-08-15

申请号：US11118403

申请日：2005-05-02

申请人： Masahiro Ono ,  Shigeru Kondou ,  Kazuhiro Nishikawa ,  Kazuto Nishida ,  Hiroyuki Inoue ,  Osamu Miyazaki ,  Hiroshi Takeda ,  Tsuneyuki Ejima

发明人： Masahiro Ono ,  Shigeru Kondou ,  Kazuhiro Nishikawa ,  Kazuto Nishida ,  Hiroyuki Inoue ,  Osamu Miyazaki ,  Hiroshi Takeda ,  Tsuneyuki Ejima

IPC分类号： H01R12/00 ,  H05K1/00

CPC分类号： H05K1/144 ,  H01L2224/16225 ,  H01L2924/19105 ,  H01R12/52 ,  H05K3/3426 ,  H05K2201/042 ,  H05K2201/10189 ,  H05K2201/10424 ,  H05K2201/2018

摘要： The present invention includes a plurality of lead terminals made of a conductive material having spring elasticity; and insulative housing that buries a part of the region of lead terminal and fixedly retains a plurality of lead terminals in an arrangement having been set in advance. Lead terminal is composed of a buried part that is a part of lead terminal buried in housing; bottom end joint that is extended from one end of the buried part, is exposed through bottom end surface of housing, and extracted in width direction of bottom end surface; and flexibly changing part that is exposed from another end of the buried part through one wall surface orthogonal to bottom end surface, and is extended along this wall surface to top end surface facing to bottom end surface, being spaced from wall surface and top end surface.

摘要翻译： 本发明包括由具有弹性弹性的导电材料制成的多个引线端子; 绝缘壳体，其埋设引线端子区域的一部分，并且在预先设置的布置中固定地保持多个引线端子。 引线端子由掩埋在壳体中的引线端子的一部分构成; 从埋藏部分的一端延伸的底端接头通过壳体的底端表面暴露，并在底端表面的宽度方向上提取; 以及通过与底端表面正交的一个壁面暴露于埋藏部分的另一端的柔性变化部分，并且沿着该壁表面延伸到面向底端表面的顶端表面，与壁表面和顶端表面间隔开 。

公开(公告)号：US07771561B2

公开(公告)日：2010-08-10

申请号：US11598067

申请日：2006-11-13

申请人： Naoki Suzuki ,  Kazuto Nishida ,  Kazuyuki Tomita

发明人： Naoki Suzuki ,  Kazuto Nishida ,  Kazuyuki Tomita

IPC分类号： H01L21/00 ,  C23C16/00 ,  C23C14/00

CPC分类号： H05K3/26 ,  H01J37/32009 ,  H01J37/32935 ,  H01J37/3299 ,  H05K3/323 ,  H05K2203/095

摘要： An apparatus and a method for surface treatment of substrates whereby the quality of substrates can be maintained by preventing excessive plasma treatment of substrates. In carrying out the plasma treatment on a surface of the substrate in a reaction chamber, there are provided an emission spectroscopic analysis device or a mass analyzer, and a controller, so that the energy of ions in plasma is controlled to decrease when, e.g., bromine included in the substrate is detected, and the surface treatment to the substrate is controlled to stop when the removal of impurities of the substrate is detected to end. The bromine once separated from the substrate is prevented from adhering again to the substrate and corroding the substrate. Moreover, ions are prevented from being excessively irradiated to the substrate when the removal of impurities ends, thereby reducing damage to the substrate.

摘要翻译： 用于表面处理基板的装置和方法，由此通过防止基板的过度等离子体处理可以保持基板的质量。 在反应室中对基板的表面进行等离子体处理时，设置有发光光谱分析装置或质量分析装置以及控制器，使得等离子体中的离子的能量被控制为减少，例如， 检测包含在基板中的溴，并且当检测到去除基板的杂质结束时，控制对基板的表面处理以停止。 与基板分离的溴被防止再次粘附到基板上并腐蚀基板。 此外，当去除杂质结束时，防止离子过度照射到基板，从而减少对基板的损坏。

公开(公告)号：US07683482B2

公开(公告)日：2010-03-23

申请号：US11527461

申请日：2006-09-27

申请人： Kazuto Nishida ,  Hidenobu Nishikawa ,  Yoshinori Wada ,  Hiroyuki Otani

发明人： Kazuto Nishida ,  Hidenobu Nishikawa ,  Yoshinori Wada ,  Hiroyuki Otani

IPC分类号： H01L23/48 ,  H01L21/44 ,  H05K3/32

CPC分类号： H01L24/27 ,  H01L21/563 ,  H01L23/295 ,  H01L24/29 ,  H01L24/31 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/13118 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29399 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/45 ,  H01L2224/45118 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48 ,  H01L2224/48624 ,  H01L2224/48824 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/78301 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K3/323 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is connected, the bumps are compressed, and the insulating resin is hardened.

摘要翻译： 芯片通过在位置凸块与板电极之间对准而在电路板上粘合，在芯片和电路板之间插入各向异性导电层。 各向异性导电层是绝缘树脂，导电颗粒和无机填料的混合物。 利用工具，以每个凸起不小于20gf的压力将芯片压在板上，同时连接芯片和板的翘曲，凸起被压缩，绝缘树脂硬化。

公开(公告)号：US20100008056A1

公开(公告)日：2010-01-14

申请号：US12562444

申请日：2009-09-18

申请人： Masahiro ONO ,  Shigeru Kondo ,  Kazuhiro Nishikawa ,  Yoshihiko Yagi ,  Kazuto Nishida

发明人： Masahiro ONO ,  Shigeru Kondo ,  Kazuhiro Nishikawa ,  Yoshihiko Yagi ,  Kazuto Nishida

IPC分类号： H05K1/11

CPC分类号： H05K1/183 ,  H01L23/5385 ,  H01L25/0652 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06572 ,  H01L2924/09701 ,  H01L2924/15156 ,  H01L2924/15192 ,  H01L2924/1627 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0284 ,  H05K1/141 ,  H05K1/144 ,  H05K1/145 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/09036 ,  H05K2201/10446 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/1572 ,  Y02P70/611 ,  H01L2924/00012

摘要： A stereoscopically connected structure is made up of a first circuit board and a second circuit board which are mounted with other electronic components, and a relay board having a recess which is mounted with an electronic component and is provided with a lead-out wiring extending from the electronic component, and also having a land part to be connected with the lead-out wiring on one of the surfaces of the relay board that face the first circuit board and second circuit board. Thus the relay board can mount the electronic component thereon as well as connect the first circuit board and the second circuit board, thereby achieving high density mounting.

摘要翻译： 立体连接的结构由安装有其他电子部件的第一电路板和第二电路板构成，以及具有安装有电子部件的凹部的中继板，并且设置有从 电子部件，并且还具有与继电器板的面对第一电路板和第二电路板的一个表面上的引出布线连接的焊盘部分。 因此，继电器板可以在其上安装电子部件，并且连接第一电路板和第二电路板，从而实现高密度安装。

公开(公告)号：US06981317B1

公开(公告)日：2006-01-03

申请号：US09331763

申请日：1997-12-26

申请人： Kazuto Nishida

发明人： Kazuto Nishida

IPC分类号： H01L21/44

CPC分类号： H01L24/11 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13144 ,  H01L2224/1357 ,  H01L2224/1379 ,  H01L2224/138 ,  H01L2224/16225 ,  H01L2224/27436 ,  H01L2224/29076 ,  H01L2224/29078 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48624 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/7598 ,  H01L2224/81048 ,  H01L2224/81191 ,  H01L2224/81395 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K3/321 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： When mounting an IC chip on a circuit board, bumps are formed on electrodes of the IC chip, and the bumps and the electrodes of the circuit board are aligned in position with each other with interposition of an insulative thermosetting resin having no conductive particle between the electrodes of the circuit board and the bumps. The IC chip is pressed against the circuit board with a pressure force of not smaller than 20 gf per bump by a heated head so as to perform warp correction of the IC chip and the board, while the resin interposed between the IC chip and the circuit board is hardened to bond the IC chip and the circuit board together.

摘要翻译： 当将IC芯片安装在电路板上时，在IC芯片的电极上形成凸点，并且电路板的凸起和电极彼此对准，并在其间插入不具有导电粒子的绝缘热固性树脂 电路板的电极和凸块。 通过加热头将IC芯片以不小于20gf的压力压在电路板上，以便在IC芯片和电路之间插入树脂时进行IC芯片和板的翘曲校正 板被硬化以将IC芯片和电路板结合在一起。

公开(公告)号：US06966964B2

公开(公告)日：2005-11-22

申请号：US10328189

申请日：2002-12-26

申请人： Koujiro Nakamura ,  Yoshihiko Yagi ,  Michiro Yoshino ,  Kazuto Nishida

发明人： Koujiro Nakamura ,  Yoshihiko Yagi ,  Michiro Yoshino ,  Kazuto Nishida

IPC分类号： H01L25/18 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/56 ,  H01L21/60 ,  H01L21/98 ,  H01L25/065 ,  H01L25/07 ,  B32B31/00

CPC分类号： H01L21/563 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L24/90 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75743 ,  H01L2224/83192 ,  H01L2224/83859 ,  H01L2224/83874 ,  H01L2224/83951 ,  H01L2225/06517 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for manufacturing a semiconductor device whereby semiconductor elements like semiconductor bare chips are mounted with high productivity on both surfaces of a circuit board while preventing the board from warping, and an apparatus for manufacturing a semiconductor device for faithfully embodying the manufacturing method. Semiconductor elements temporarily fixed on both surfaces of a circuit board are heated while being pressurized in directions to be each pressed against the board, whereby adhesive on both surfaces of the board is thermally set simultaneously and bumps on each semiconductor elements are press-bonded to their opposing board electrodes on the board to be electrically connected. Ultraviolet rays are irradiated to a circumference of mixed curing adhesive applied to at least one surface of the circuit board to form an ultraviolet curing part only on the circumference of the adhesive, thereby increasing strength for temporarily fixing the semiconductor elements to the circuit board.

摘要翻译： 一种制造半导体器件的方法，其中半导体元件如半导体裸芯片以高生产率安装在电路板的两个表面上同时防止板翘曲，以及用于制造半导体器件的装置，用于忠实地体现该制造方法。 临时固定在电路板的两个表面上的半导体元件在被压靠在板上的方向被加压的同时被加热，由此在板的两个表面上的粘合剂被同时热定形，并且将每个半导体元件上的凸块压接在它们 板上的相对的电路板电极要电连接。 紫外线照射到施加到电路板的至少一个表面的混合固化粘合剂的周边，以在粘合剂的周围仅形成紫外线固化部分，从而增加将半导体元件临时固定到电路板的强度。

公开(公告)号：US07759784B2

公开(公告)日：2010-07-20

申请号：US11196269

申请日：2005-08-04

申请人： Masahiro Ono ,  Shigeru Kondou ,  Kazuhiro Nishikawa ,  Kazuto Nishida

发明人： Masahiro Ono ,  Shigeru Kondou ,  Kazuhiro Nishikawa ,  Kazuto Nishida

IPC分类号： H01L23/02

CPC分类号： H05K1/183 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/1035 ,  H01L2225/1064 ,  H01L2924/1627 ,  H01L2924/3511 ,  H05K2201/0382 ,  H05K2201/10674 ,  H05K2201/2018 ,  H05K2203/0278

摘要： A 3D circuit module which is highly reliable, easily layered and able to mount electronic components in high density is obtained by providing a support member having a frame in the periphery thereof and a recess; a coating layer for coating the frame and filling in the recess, the coating layer being made of resin material which is adhesive and has a softening temperature lower than the softening temperature of the support member; a wiring pattern formed on the coating layer, the wiring pattern including a first land on the frame, a second land on the recess, and a wiring part for connecting between the first land and the second land; and an electronic component having a projecting electrode formed on a side thereof, the electronic component being bonded to the coating layer and accommodated in the recess, with the projecting electrode connected to the second land.

摘要翻译： 通过在其周边设置具有框架的支撑构件和凹部，获得高度可靠，容易分层并能够以高密度安装电子部件的3D电路模块; 用于涂覆所述框架并填充所述凹部的涂层，所述涂层由粘合剂并且具有低于所述支撑构件的软化温度的软化温度的树脂材料制成; 形成在所述涂层上的布线图案，所述布线图案包括所述框架上的第一平台，所述凹部上的第二平台，以及用于连接所述第一平台和所述第二平台之间的布线部分; 以及电子部件，其具有在其一侧形成的突出电极，所述电子部件被接合到所述涂层并容纳在所述凹部中，所述突出电极连接到所述第二焊盘。

公开(公告)号：US07355126B2

公开(公告)日：2008-04-08

申请号：US10311476

申请日：2001-06-14

申请人： Hidenobu Nishikawa ,  Kazuto Nishida ,  Kazumichi Shimizu ,  Shuji Ono ,  Hiroyuki Otani

发明人： Hidenobu Nishikawa ,  Kazuto Nishida ,  Kazumichi Shimizu ,  Shuji Ono ,  Hiroyuki Otani

IPC分类号： H05K1/16

CPC分类号： H01L24/32 ,  H01L21/563 ,  H01L23/3142 ,  H01L24/06 ,  H01L24/14 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/06136 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/26145 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81136 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012

摘要： An electronic component and a circuit formation article are bonded together with a bonding material containing resin interposed therebetween. In a state that bumps of an electronic-component bonding region and electrodes of the circuit formation article are in mutual electrical contact, the electronic component and the circuit formation article are thermocompression-bonded to each other upon curing of the bonding material. A bonding-material flow regulating member of the electronic-component bonding region regulates flow of the bonding material toward a peripheral portion of the electronic-component bonding region during bonding of the circuit formation article to the electronic component.

摘要翻译： 电子部件和电路形成用物品通过含有树脂的接合材料接合在一起。 在电子部件接合区域和电路形成用品的电极的凸点相互电接触的状态下，电子部件和电路形成用品在接合材料固化时彼此热压接合。 电子部件接合区域的接合材料流动调节部件在电路形成物品与电子部件接合期间调节接合材料向电子部件接合区域的周边部分的流动。

公开(公告)号：US20060038274A1

公开(公告)日：2006-02-23

申请号：US11196269

申请日：2005-08-04

申请人： Masahiro Ono ,  Shigeru Kondou ,  Kazuhiro Nishikawa ,  Kazuto Nishida

发明人： Masahiro Ono ,  Shigeru Kondou ,  Kazuhiro Nishikawa ,  Kazuto Nishida

IPC分类号： H01L23/02

CPC分类号： H05K1/183 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/1035 ,  H01L2225/1064 ,  H01L2924/1627 ,  H01L2924/3511 ,  H05K2201/0382 ,  H05K2201/10674 ,  H05K2201/2018 ,  H05K2203/0278

摘要： A 3D circuit module which is highly reliable, easily layered and able to mount electronic components in high density is obtained by providing a support member having a frame in the periphery thereof and a recess; a coating layer for coating the frame and filling in the recess, the coating layer being made of resin material which is adhesive and has a softening temperature lower than the softening temperature of the support member; a wiring pattern formed on the coating layer, the wiring pattern including a first land on the frame, a second land on the recess, and a wiring part for connecting between the first land and the second land; and an electronic component having a projecting electrode formed on a side thereof, the electronic component being bonded to the coating layer and accommodated in the recess, with the projecting electrode connected to the second land.

摘要翻译： 通过在其周边设置具有框架的支撑构件和凹部，获得高度可靠，容易分层并能够以高密度安装电子部件的3D电路模块; 用于涂覆所述框架并填充所述凹部的涂层，所述涂层由粘合剂并且具有低于所述支撑构件的软化温度的软化温度的树脂材料制成; 形成在所述涂层上的布线图案，所述布线图案包括所述框架上的第一平台，所述凹部上的第二平台，以及用于连接所述第一平台和所述第二平台之间的布线部分; 以及电子部件，其具有在其一侧形成的突出电极，所述电子部件被接合到所述涂层并容纳在所述凹部中，所述突出电极连接到所述第二焊盘。